• 제목/요약/키워드: Al-Si-Cu

검색결과 496건 처리시간 0.026초

금형 예열온도에 따른 Al-Cu-Si 3원계 공정합금의 미세조직 변화 (Changes on the Microstructure of an Al-Cu-Si Ternary Eutectic Alloy with Different Mold Preheating Temperatures)

  • 오승환;이영철
    • 한국주조공학회지
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    • 제42권5호
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    • pp.273-281
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    • 2022
  • Al-Cu-Si 3원계 공정합금의 응고거동과 미세조직 변화를 이해하기 위해서, 금형 예열온도를 달리하여 Al-Cu-Si 3원계 공정합금의 미세조직 변화를 관찰하였다. 금형 예열온도가 500℃일 때, 초정 Si과 덴드라이트 형상의 Al2Cu상이 관찰되며, 이후 (α-Al+Al2Cu)의 2원계 공정상이 관찰된다. 금형 예열온도가 300℃일 때 미제조직은 금형 예열온도가 500℃일 때와 유사하나 (α-Al+Al2Cu+Si)의 3원계 공정상이 관찰되는 영역과 관찰되지 않는 영역이 나타난다. 금형 예열온도가 150℃인 경우에는 미세조직이 (α-Al+Al2Cu)의 2원계 공정상과 (α-Al+Al2Cu+Si)의 3원계 공정상이 관찰되는 Bimodal 구조를 나타낸다. 금형 예열온도를 달리 하였을 때 가장 큰 변화를 나타내는 상은 Si상이며, 임계냉각속도를 지나면 (α-Al+Al2Cu+Si)의 3원계 공정상이 형성되는 순간에 빠른 냉각에 의한 Si의 성장이 억제되면 Cooperative 성장을 하기 때문에 Al, Cu의 성장도 함께 억제된다. 서로 다른 합금설계 전산모사 프로그램을 통해 Al-27wt%Cu-5wt%Si의 3원계 공정 합금을 분석한 결과, 합금설계 전산모사 프로그램에 따라 결과의 차이가 발생하며, 전산모사의 신뢰성을 높이기 위해서는 실제 주조를 통한 미세조직 분석이 수반되어야 한다.

Sc 첨가에 따른 Al-6Si-2Cu 합금의 미세조직 개량화 (Effect of Sc Addition on the Microstructure Modification of Al-6Si-2Cu Alloy)

  • 안성빈;김정석
    • 열처리공학회지
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    • 제35권3호
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    • pp.150-158
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    • 2022
  • The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al5FeSi phases were segmented and refined. The nanosized Al3Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

Al-Mg-Si 합금에서 Cu 첨가와 자연시효 열처리가 열확산도에 미치는 영향 (Effect of Additional Cu and Natural Aging Treatment on Thermal Diffusivity in the Al-Mg-Si Alloy)

  • 김유미;최세원
    • 한국주조공학회지
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    • 제41권6호
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    • pp.528-534
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    • 2021
  • 본 연구는 Al-Mg-Si 합금에서 Cu가 첨가 후 자연시효와 인공시효에 따른 제2상 석출 반응이 합금의 열확산도 및 경도에 미치는 영향을 연구하였다. 연구에 사용된 Al-0.4Mg-0.2Si 합금과 Cu를 0.6 wt%, 1.0wt% 추가한 Al-Mg-Si-Cu 합금을 각각 중력 주조로 제작하고 열확산도 경도를 측정하고 석출 반응을 확인하기 위해 열량 분석을 실시 하였다. Al-Mg-Si 합금에 첨가된 Cu는 Q'상 및 θ'상과 같은 강화상 형성에 참여하여 합금의 경도와 고온 열확산도를 향상시켰다. 한편, 자연시효 시간 증가는 Al-Mg-Si-Cu 합금의 열확산도에는 큰 영향을 미치지 않았으나, 경도를 하락시키는 것으로 확인되었다.

무가압 침투에 의하여 제조된 Al-5Mg-X(Si, Cu, Ti)/SiCp 복합재료의 시효 및 마멸특성에 관한 연구 (A Study on Aging and Wear Behaviors of Al-5Mg-X(Si, Cu, Ti)/SiCp Composites Fabricated by Pressureless Infiltration Method)

  • 우기도;김석원;나홍석;문호정
    • 한국주조공학회지
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    • 제20권5호
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    • pp.300-306
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    • 2000
  • The objective of this work was to investigate the effects of SiC particle size(50, 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on aging behavior in Al-5Mg-X(Si,Cu,Ti)/SiCp composites fabricated by pressureless infiltration method using hardness and wear test, scanning electron microscopy(SEM) and differential scanning calorimetry(DSC). The peak aging time in Al-5Mg-X(Si, Cu, Ti)/SiCp(50, 100 ${\mu}m$) composites is shorter than Al-5Mg-0.3Si alloy.The peak aging time of 50 ${\mu}m$ SiC particle reinforced Al-5Mg-X(Si,Cu,Ti) composites is shorter than those of 100 ${\mu}m$ SiC particle reinforced of Al-5Mg-X(Si,Cu,Ti) composites. The Al-5Mg-0.3Si-0.1Cu-0.1Ti/SiCp(50 ${\mu}m$) composites aged at $180^{\circ}C$ has higher hardness and better wear resistance than any other aged composite.The aging effect is promoted by the addition of Si and Cu in Al-5Mg/SiCp composites, so the wear resistance of Al-5Mg/SiCp composites with Si and Cu elements is enhanced by the aging treatment.

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Al-Si-Cu 알루미늄 주조 합금의 열간 균열 민감성에 미치는 Cu 함량의 영향 (Effect of Cu content on Hot Tearing Susceptibility in Al-Si-Cu Aluminum Casting Alloy)

  • 오승환;친밧 문크대거;김헌주
    • 한국주조공학회지
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    • 제41권5호
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    • pp.419-433
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    • 2021
  • Al-Si-Cu 합금은 구리 첨가에 따른 석출경화로 경도와 강도가 현저하게 강한 합금을 생성하는 장점이 있습니다. 그러나 구리를 첨가하면 Al-Si-Cu 합금의 응고 범위가 확장되고 합금은 응고 중에 발생하는 가장 흔하고 심각한 파단 현상 중 하나 열간 균열이 발생하기 쉽습니다. 합금의 열간 균열 특성에 대한 기존의 평가 방법은 이 특성에 대한 정량적 데이터를 제공하지 않는 상대적이고 정성적인 분석 방법입니다. 이 연구에서 Al-Si-Cu 주조 합금의 열간 균열 특성에 대한 더 신뢰할 수있는 정량 데이터를 얻기 위해 Instone et. al 이 개발 한 장치를 부분적으로 수정되었습니다. Cu 원소의 영향을 평가하기 위해 Al-Si-Cu 계 합금에서 4 가지 수준의 Cu 함량을 (0.5, 1.0, 3.0, 5.0) wt. %로 설정하고 각 합금에 대해 열간 균열 특성을 평가했습니다. Cu 함량이 증가함에 따라 열간 균열 강도는 (2.26, 1.53, 1.18, 1.04) MPa)로 감소했습니다. 열간 균열이 발생하는 시점, Cu 함량이 증가함에 따라 고액 공존 범위가 증가하여 동일 온도에서 해당 고상율 및 응고 속도가 감소하였다. 파단면의 형태는 수상 돌기에서 잔류 액상으로 덮인 수상 돌기로 바뀌었고, 열간 균열 발생 인근에서 CuAl2 상이 관찰되었다.

Al6Si2Cu 알루미늄 합금의 기계적 물성 향상을 위한 이단계 고용화 열처리 (Two-step Solution Treatment for Enhancement of Mechanical Properties of AlSiCu Aluminum Alloy)

  • 박상규;김정석
    • 열처리공학회지
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    • 제31권3호
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    • pp.97-103
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    • 2018
  • The objective of this study is to develop the mechanical properties of AlSiCu aluminum alloy by the two-step solution heat treatment. The microstructure of gravity casting specimen represents a typical dendrite structure having a secondary dendrite arm spacing (SDAS) of 40 mm. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases are generated. The eutectic Si phases are fragmented and globularized with solution heat treatment. Also, the $Al_2Cu$ intermetallic phase is resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ might be a optimum condition for enhancement of mechanical properties of AlSiCu aluminum alloy.

자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구 (A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules)

  • 유동열;고용호;방정환;이창우
    • Journal of Welding and Joining
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    • 제33권3호
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    • pp.19-24
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    • 2015
  • Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

Al-Si-Cu합금의 용체화 처리 온도에 따른 Al2Cu 용해와 용융 현상 (Dissolution and Melting Phenomenon of Al2Cu according to Solution Treatment Temperature of Al12Si3Cu alloy)

  • 이승관;김정석
    • 열처리공학회지
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    • 제35권1호
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    • pp.1-7
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    • 2022
  • In this study, dissolution and melting phenomenon of the Al2Cu was studied for the high-strength Al-Si-Cu aluminum alloy in automobile component. The Solution heat treatment was performed at 480℃ and 510℃ for 4hours. Microstructure analysis of the specimen was performed using the optical micrograph and scanning electron microscope for qualitative and quantitative analysis of various phases, the chemical composition of secondary phases was achieved by energy dispersive spectroscopy (EDS) and electron probe micro analysis (EPMA). As a result of the electron probe micro analysis, a plate like Al2Cu phase was observed, and eutectic Si phase was observed of a coarsen plate shape. At a temperature of 510, necking phenomenon occurs in a specific part of plate like Al2Cu, and it is segmented and dissolved in the Al matrix. When the temperature of the alloy exceeds the melting point of Al2Cu, incipient melting occurs at the grain boundary of undissolved Cu particles

과공정 Al-Si 합금의 마모 특성에 미치는 잔류응력의 영향에 관한 연구 (A Study on the Relationship between Residual Stress and Wear Peroperty in Hypereutectic Al-Si Alloys)

  • 김헌주;김창규
    • 한국주조공학회지
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    • 제20권2호
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    • pp.89-96
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    • 2000
  • The effects of modification processing on the refinement of primary Si and the wear behavior of hyper-eutectic Al-Si alloys have been mainly investigated. Refining effects of primary Si in Al-17%Si alloy was more efficient than that of B.390 alloy. Optimum condition of getting the finest primary Si microstructure was when AlCuP modifier is added into the melt at $750^{\circ}C$ and held it at $700^{\circ}C$ for 30 minutes. Wear loss in the specimens of as-cast condition decreases as the size of primary Si decreases, in the order of B.390 alloy, B.390 alloy with AlCuP addition, Al-17%Si alloy and Al-17%Si alloy with AlCuP addition. Wear loss in the aged condition of Al-17%Si alloy, B.390 alloy and B.390 alloy with AlCuP addition decreased due to the increase of compressive residual stress in the matrix by the aging treatment. While, wear loss increased in the aged specimens of Al-17%Si alloy with AlCuP addition and Hepworth addition in which compressive residual stress decreases by the aging treatment. Therefore, it is assumed that higher compressive residual stress in the matrix can reduce the wear loss in composite materials such as hyper-eutectic Al-Si alloys.

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Al-Si-Cu계 AC2B 합금의 최적 용체화 처리 조건 (The Optimal Solution Treatment Condition in a Al-Si-Cu AC2B Alloy)

  • 정재길;박준수;하양수;이영국;전중환;강희삼;임종대
    • 대한금속재료학회지
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    • 제47권4호
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    • pp.223-227
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    • 2009
  • The precipitates, hardness, and tensile properties of Al-6.2Si-2.9Cu AC2B alloy were investigated with respect to solution treatment time at $500^{\circ}C$. $Al(Cu)-Al_2Cu$ eutectic, Si, ${\theta}-(Al_2Cu)$, and $Q-(Al_5Cu_2Mg_8Si_6)$ phases were observed in the as-cast specimen. With increasing the solution treatment time at $500^{\circ}C$, the $Al(Cu)-Al_2Cu$ eutectic and ${\theta}-(Al_2Cu)$ phases were gradually reduced and finally almost disappeared in 5 h. The mechanical properties, such as hardness, tensile strength, and elongation, were improved with solution treatment time until about 5 h due to the dissolution of the $Al_2Cu$ particles. With further holding time, the mechanical properties did not change much. The solution treated specimens for over 5 h at $500^{\circ}C$ exhibit almost the same tensile properties even after aging at $250^{\circ}C$ for 3.5 h. Accordingly, the optimal solution treatment condition of the Al-Si-Cu AC2B alloy is considered to be 5 h at $500^{\circ}C$.