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http://dx.doi.org/10.7777/jkfs.2022.42.3.273

Changes on the Microstructure of an Al-Cu-Si Ternary Eutectic Alloy with Different Mold Preheating Temperatures  

Oh, Seung-Hwan (Korea Institute of Industrial Technology)
Lee, Young-Cheol (Korea Institute of Industrial Technology)
Publication Information
Journal of Korea Foundry Society / v.42, no.5, 2022 , pp. 273-281 More about this Journal
Abstract
In order to understand the solidification behavior and microstructural evolution of the Al-Cu-Si ternary eutectic alloy system, changes of the microstructure of the Al-Cu-Si ternary eutectic alloy with different cooling rates were investigated. When the mold preheating temperature is 500℃, primary Si and Al2Cu dendrites are observed, with (α-Al+Al2Cu) binary eutectic and needle-shaped Si subsequently observed. In addition, even when the mold preheating temperature is 300℃, primary Si and Al2Cu dendrites can be observed, and both (α-Al+Al2Cu+Si) areas observed and areas not observed earlier appear. When the mold preheating temperature is 150℃, bimodal structures of the binary eutectic (α-Al+Al2Cu) and ternary eutectic (α-Al+Al2Cu+Si) are observed. When the preheating temperature of the mold is changed to 500℃, 300℃, and 150℃, the greatest change is in the Si phase, and upon reaching the critical cooling rate, the ternary eutectic of (α-Al+Al2Cu+Si) forms. If the growth of the Si phase is suppressed upon the formation of (α-Al+Al2Cu+Si), the growth of both Al and Cu is also suppressed by a cooperative growth mechanism. As a result of analyzing the Al-27wt%Cu-5wt%Si ternary eutectic alloy with a different alloy design simulation programs, it was confirmed that different results arose depending on the program. A computer simulation of the alloy design is a useful tool to reduce the trial and error process in alloy design, but this effort must be accompanied by a task that increases reliability and allows a comparison to microstructural results derived through actual casting.
Keywords
Ternary eutectic alloy; eutectic reaction; modification of eutectic and Rapid solidification;
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  • Reference
1 J.T. Kim, S.W. Lee, S.H. Hong, H.J. Park, J.Y. Park, N.S. Lee, Y.H. Seo, W.M. Wang, J.M. Park and K.B. Kim, Materials and Design, 92 (2016) 1038.
2 S.W. Lee, J.T. Kim, S.H. Hong, H.J. Park, J.-Y. Park, N.S. Lee, Y. Seo, J.Y. Suh, J. Eckert and D.H. Kim, Scientific reports, 4(1) (2014) 1.
3 J.M. Park, N. Mattern, U. Kuhn, J. Eckert, K.B. Kim, W.T. Kim, K. Chattopadhyay and D.H. Kim, Journal of Materials Research, 24(8) (2009) 2605.   DOI
4 G.C. Pettan, C.R.M. Afonso and J.E. Spinelli, Materials & Design, 86 (2015) 221.   DOI
5 B.J. Kim, D.K. Arne, Y.H. Park and Y. Lee, Materials Science & Engineering A, 833 (2022).
6 K.A. Jackson, J.D. Hunt, Lamellar and Rod Eutectic Growth, in: P. Pelce (Ed.), "Dynamics of Curved Fronts", Academic Press, SanDiego (1988) 363-376.
7 T. Sato and Y. Sayama, Journal of Crystal Growth, 22(4) (1974) 259.   DOI
8 Wattis, A.D. Jonathan and A Becker-Doring, Journal of Physics A: Mathematical and General, 32(49) (1999) 8755.   DOI
9 W. Kurz, Advaced Engineering Materials, 3(7) (2001) 443.
10 D. Stefanescu and R. Ruxanda, "Fundamentals of Solidification", ASM International, OH (2004) 71-92.
11 D.M. Stefanescu, "Science and engineering of casting solidification", Springer, Berlin (2015).
12 Y. Du, Y.A. Chang, B. Huang, W. Gong, Z. Jin, H. Xu, Z. Yuan, Y. Liu, Y. He and F.-Y. Xie, Materials Science and Engineering A, 363 (2003) 140.   DOI
13 F.B. Ian and A.T. John, Metallurgical and Materials Transaction A, 44A (2013) 3901.
14 S.A. Awe, Journal of King Saud University - Engineering Sciences, 33 (2021) 569.
15 L.F. Mondolfo, "Aluminum Alloys: Structure and Properties", Butterworth-Heinemann, Oxford (1976).
16 X. Ma and L. Liu, Materials & Design, 83 (2015) 138.   DOI
17 C.S. Tiwary, S. Kashyap and K. Chattopadhyay, Scripta Materialia, 93 (2014) 20.   DOI