• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.165-166
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• 2011

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.1-12
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• 2012

In this experiment, we have manufactured thermal-curable silver pastes for direct printing. And to enhance conductivity, printability, adhesion and hardness during polymer direct-gravure prints, we have manufactured Ag pastes by adding variety of filter contents. Then we have investigated characteristics of rheology in paste according to the gravure printability and the properties of printed conductive patterns. Depending on a variety of Ag powder, there was a big difference in sharpness of printed pattern. And also by the use of carbon, there was a big difference in amount of solvent used, conductivity and in hardness. We could improve doctoring and the sharpness of a pattern by adding Ag paste in carbon particle, but as we have used nano-sized particle, there was an increase in the amount of solvent used and also we have found out that it gives a bad effect as adhesive and hardness becomes weaker. Even though Ag particle has the same spherical shape, the surface treatments could differ from one another. And by the appropriate choice and with the suitable combination of Ag powder, excellent printability and conductivity could be obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.267-271
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• 2019

A shingled PV module is manufactured by dividing and bonding. In this method, the solar cell is divided by lasers and bonded using electrically conductive adhesives (ECAs). Consequently, the manufacturing cost increases because a process step is added. Therefore, we aim to reduce the production cost by reducing the amount of Ag paste used in the solar cell front. Various electrode structures were designed and simulated. The number of fingers was optimized by designing thinner fingers, and the number of fingers with the maximum power conversion efficiency was confirmed. The simulation confirmed the maximum efficiency in the 4-divided electrode pattern. The amount of Ag paste used for each electrode pattern was calculated and analyzed. The number of fingers was optimized by decreasing the width of the finger; this will not only reduce the amount of Ag paste required but also the increase the efficiency.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.957-958
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• 2008

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.59-68
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• 2012

As one of the eletronic device industries has been developed by using a recent printing method, the consumption of Ag paste has been on the rise as well. The printing method has simple processes in comparison with other methods. Also it enables to be large-scaled and to lower price ranges. If UV curing system would be applied to the printing method, energy consumption and dangerousness from curing system can be minimized in a short period of time so that its method can be more eco-friendly. This study conducted an experiment in order to make UV curing Ag paste which is feasible to implement micro patterns with different dispersing agents. The purpose of the study is to analysis the suitable printability for micro pattern and to test dispersibility, hardening properties, conductivity and adhesive stength by measuring viscosity, TI(thixotropy index), G', G", $tan{\delta}$(G"/G') after making paste. We have experimented with four dispersing agents. After We did an analysis of characteristic of rheology, conductivity and adhesive stength, etc, We confirmed that the paste added FP 3060 has excellent dispersibility, conductivity and adhesive stength. If the paste has excellent dispersibility, we will expect that micro pattern is made by that.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.15-23
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• 2015

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

• Analytical Science and Technology
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• v.12 no.2
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• pp.171-175
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• 1999

Carbon paste electrodes, modified with podands containing more than two sulfur atoms, have been employed for the voltammetric determination of Ag(I) ion from aqueous solution. The voltammetric response was characterized with respect to paste composition, preconcentration method, kind of anion, variation of pH, Ag(I) ion concentration, and possible interferences. Linear calibration curves were obtained for Ag(I) ion concentration ranging from $1.0{\times}10^{-6}$ to $9.0{\times}10^{-5}M$, and detection limit was $5.0{\times}10^{-7}M$.

• Analytical Science and Technology
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• v.15 no.1
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• pp.91-95
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• 2002

Carbon paste electrodes, modified with 5,6,14,15-dibenzo-1,4-dioxa-8,12-diazacyclopentadeca-5,14-diene containing different ligating atoms of oxygen and nitrogen, have been employed for the voltammetric determination of Ag(I) ion from aqueous solution. The voltammetric response was characterized with respect to paste composition, preconcentration method, kind of anion, variation of pH, Ag(I) ion concentration, and possible interferences. Linear calibration curves were obtained for Ag(I) ion concentration ranging from $3.0{\times}10^{-6}M$ to $8.0{\times}10^{-5}M$, and detection limit was $8.5{\times}10^{-7}M$.