Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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A Review of Ag Paste Bonding for Automotive Power Device Packaging

자동차용 파워 모듈 패키징의 은 소재를 이용한 접합 기술

  • Roh, Myong-Hoon (Joining and Welding Research Institute, Osaka University) ;
  • Nishikawa, Hiroshi (Joining and Welding Research Institute, Osaka University) ;
  • Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
  • 노명훈 (오사카 대학교 접합과학연구소) ;
  • ;
  • 정재필 (서울시립대학교 공과대학 신소재공학과)
  • Received : 2015.12.13
  • Accepted : 2015.12.24
  • Published : 2015.12.30
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Abstract

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

Keywords

References

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