• 한국전기전자재료학회논문지
• /
• 제17권1호
• /
• pp.94-100
• /
• 2004

We fabricated textured Ag substrates for YBCO coated conductor and evaluated the effects of annealing temperature on microstructural evolution, texture formation, and surface morphology. Ag ingot, as an initial specimen, was prepared by plasma arc melting(PAM). Subsequently, the ingot was cold rolled to 100 ${\mu}{\textrm}{m}$ thick tape and annealed at temperatures of 600-80$0^{\circ}C$. The texture and surface morphology of the substrate were characterized by pole-figure and atomic force microscopy(AFM) profile, respectively. It was observed that a strong ｛110｝<110> texture was formed after annealing and its symmetry improved as annealing temperature increased. The full-width at half-maximum(FWHM) of ｛110｝<110> pole was as sharp as 10$^{\circ}$ for the substrate annealed at 80$0^{\circ}C$. On the other hand, it was found that the thermal grooving and faceting became remarkable as annealing temperature increased : root-mean-square(RMS) roughness of the substrate annealed at 80$0^{\circ}C$ was 39.2 nm. The substrate of strong texture and smooth surface, fabricated in our study, is considered to be suitable for use as a substrate for the epitaxial deposition of superconductor film.

• Transactions on Electrical and Electronic Materials
• /
• 제14권1호
• /
• pp.9-11
• /
• 2013

The AZO/Ag/AZO multilayer films were deposited on polyethersulfone (PES) substrate by using facing target sputtering methods at room temperature. The AZO/Ag/AZO multilayer films with polymer substrate had advantages, such as low sheet resistance, high optical transmittance in visible range and stable mechanical properties. From the results, the AZO/Ag/AZO multilayer films (50/12/50 nm) demonstrated a sheet resistance of 11 ${\Omega}/{\square}$ and average transmittance of 87% in visible range (wavelength of 380-770 nm). Moreover, the multilayer showed stable mechanical properties compared to the single-layered AZO sample during the bending test due to the existence of the ductile Ag metal layer.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.151-155
• /
• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2004년도 추계학술발표대회 개요집
• /
• pp.37-39
• /
• 2004

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2003년도 추계학술발표대회 개요집
• /
• pp.89-90
• /
• 2003

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.313-313
• /
• 2016

Transparent conductive oxide (TCO) films have many disadvantages, such as rarity, possible exhaustion, process temperature limitations, and brittleness on a flexible substrate. In particular, as display technology moves toward flexible displays, TCO will become completely unsuitable due to its brittleness. To address theses issue, many researchers have been studying TCO substitutes. In recent efforts, metal nanowires, conducting polymers, carbon nanotube networks, graphene films, hybrid thin films, and metal meshes/grids have been evaluated as candidates to replace TCO electrodes. In this study, we fabricated the TCO film with Ag meshes shape using polystyrene (PS) beads monolayer on the substrate. The PS beads were used as a template to create the mesh pattern. We fabricated the monolayer on the flexible substrate (PES) with the well-aligned PS beads. Electrodes with Ag mesh shape were formed using this patterned monolayer. We could fabricated the Ag mesh electrode with the sheet resistance with $8ohm{\Omega}/{\Box}$.

• Journal of Welding and Joining
• /
• 제29권5호
• /
• pp.90-94
• /
• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• 한국재료학회지
• /
• 제23권10호
• /
• pp.586-591
• /
• 2013

The printing of nanomaterials onto certain substrates is one of the key technologies behind high-speed interconnection and high-performance electronic devices. For the printing of next-generation electronic devices, a printing process which can be applied to a flexible substrate is needed. A printing process on a flexible substrate requires a lowtemperature, non-vacuum process due to the physical properties of the substrate. In this study, we obtained well-ordered Ag nanowires using modified gravure printing techniques. Ag nanowires are synthesized by a silver nitrate ($AgNO_3$) reduction process in an ethylene glycol solution. Ag nanowires were well aligned by hydrodynamic force on a micro-engraved Si substrate. With the three-dimensional structure of polydimethylsiloxane (PDMS), which has an inverse morphology relative to the micro-engraved Si substrate, the sub-micron alignment of Ag nanowires is possible. This technique can solve the performance problems associated with conventional organic materials. Also, given that this technique enables large-area printing, it has great applicability not only as a next-generation printing technology but also in a range of other fields.

• 한국결정성장학회지
• /
• 제30권3호
• /
• pp.83-90
• /
• 2020

열전도성이 우수한 AlN 기판에 형성되는 Ag계 후막도체의 접착강도에 미치는 기판 표면조도 및 소결 온도의 영향을 연구하였다. 표면조도(R_a)가 0.5인 AlN 기판을 사용하여 제조한 후막도체의 접착강도가 이보다 표면조도가 크거나 또는 작은 기판을 사용하여 제조한 후막도체의 경우보다 높게 나타났다. 표면조도가 0.5보다 작은 기판의 경우 Ag 후막도체와 기판 사이의 접촉면적이 표면조도가 0.5인 기판보다 상대적으로 작아 접착강도가 작게 나타났다. 한편, 표면조도가 0.5보다 큰 기판을 사용한 경우에는 도체막이 기판에 완전히 접착되지 못하는 현상이 나타났고, 이로 인해서 접착강도가 적게 나타남을 알 수 있었다. 또한, 850℃에서 소결하여 얻어진 Ag계 후막도체 막의 표면 평활도가 다른 소결 온도에서 소결하여 얻어진 도체막의 평활도에 비해 가장 우수하였고, 이로 인해 도체막의 접착강도가 가장 높게 나타남을 알 수 있었다.

• 한국자기학회지
• /
• 제21권6호
• /
• pp.214-218
• /
• 2011

본 연구에서는 DC 마그네트론 스퍼터링을 이용해 MgO 단결정 기판 위에 성장된 Ag/CoFeB 박막의 스퍼터링 조건에 따른 박막 미세구조의 변화를 연구하였다. Ag 박막의 결정성 및 표면 거칠기는 인가전력(sputtering power) 및 증착온도의 변화에 따라 증착온도가 증가하는 경우 (200) 방향의 결정성이 향상되는 것을 확인하였으며, 인가전력이 증가되는 경우 표면 거칠기가 감소하는 것을 확인하였다. 또한 고분해능 TEM(transmission electron microscopy) 및 XRR(X-ray reflectivity) 측정을 통해 MgO 기판 위 Ag층의 켜쌓기 성장 및 MgO 기판과 Ag층 사이에 산화층에 해당하는 계면층이 존재하는 것을 알 수 있었으며, 증착온도의 증가에 따른 Ag의 섬상구조 형성 및 intermixing 효과에 의한 Ag/CoFeB 계면층의 변화 및 자기적 특성의 변화를 연구하였다.