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http://dx.doi.org/10.6111/JKCGCT.2020.30.3.083

Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors  

Koo, Bon Keup (Department of Materials Science and Engineering, Hanbat National University)
Publication Information
Journal of the Korean Crystal Growth and Crystal Technology / v.30, no.3, 2020 , pp. 83-90 More about this Journal
Abstract
The effect of substrate surface roughness and sintering temperature on the adhesion strength of Ag-based thick film conductors formed on AlN substrates with excellent thermal conductivity was studied. The adhesion strength of the thick-film conductor manufactured using an AlN substrate having a surface roughness (Ra) of 0.5 was higher than that of a thick-film conductor manufactured using a substrate having a surface roughness greater or smaller than this. In the case of a substrate with a surface roughness of less than 0.5, the contact area between the Ag thick film conductor and the substrate was relatively smaller than that of a substrate with a surface roughness of 0.5, resulting in a lower adhesive strength. On the other hand, when a substrate having a surface roughness of more than 0.5 was used, it was found that the conductor film was not completely adhered to the substrate, and as a result, it was found that the adhesive strength was small. In addition, it was found that the surface smoothness of the Ag-based thick film conductor film obtained by sintering at 850℃ was the best compared to the smoothness of the conductor film obtained by sintering at different sintering temperatures, and as a result, it was found that the adhesive strength of the conductor film was the highest.
Keywords
Thick film technology; AlN substrate; Ag conductor; Glass frit; Surface roughness; Sintering temperature; Adhesion strength;
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