• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05b
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• pp.34-37
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• 2004

It is well known that Ag-CdO alloy for electrical contactor has been widely used in weak or middle electric current field. But it is necessary to decrease Cd contents without decrease of contactor property because Cd is harmful to human body. The present work has been carried out to investigate effects of Mm (misch metal) addition on the property of Ag-CdO alloy for electrical contactor. As the results of present works, hardness and strength was improved and arc resistance was improved, also, in spite of decrease Cd contents by the Mm addition. It was estimated that Ag-oxide particle was refined by Mm addition.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.556-565
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• 1994

Effects of Ag addition to 2090 and CP 276 Al-Li alloy systems on the microstructure and mechanical properties have been investigated. The addition of silver up to 0.16wt.% reduced the grain size of the alloys, and was responsible for the formation of finer and more uniform $\delta$'($AI_{3}Li$) and $T_{1}(AI_{2}CuLi$) precipitates in 2090 alloys, even though no variation of precipitates was found in CP 276 alloys. The addition of 0.16wt.% Ag improved the tensile strength of 2090 alloys about 40MPa with the expense of small reduction of percent elongation. However, the small addition of Ag to CP 276 containing Mg did not show any variation of tensile strength and elongation. The aging treatment of these alloys at $150^{\circ}C$ for 70 or 90 hours, depending on alloy systems, showed peak hardness value of about 92 $H_rB$.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.52-55
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• 1989

The properties of sintered Ag-SnO$_2$contacts which contain the second oxide were investigated with hardeness, workability, electrical conductivity and are erosion. Ag-SnO$_2$contacts containing ZnO or Bi$_2$O$_3$have most excellent workability and arc erosion endurance.

• Journal of Korea Foundry Society
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• v.19 no.6
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• pp.456-465
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• 1999

The overall objective of this study is to investigate the effect of Ag addition on the mechanical properties and microstructure of rapid solidified 7000 Al series alloys. Al-Zn-Mg-Cu alloys with small amounts of Ag was fabricated into the powder by gas atomization. The powder was extruded after the cold compaction and degassing and then followed by T6 heat treatment. Microstructure observation, phase analysis, room and high temperature tensile test and hardness test were pursued. The tensile strength and hardness of Ag-added alloy after heat treatment was increased with increasing Ag contents. However, the elongation of extruded alloys was not increased as much as to be expected. The reason of this result seems to be related to $the{\Omega}$ phase, which contribute to the high temperature strength stability of Al-Cu-Zn alloys through the formation of eutectoid with Ag addition.

• Journal of Powder Materials
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• v.11 no.6 s.47
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• pp.477-485
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• 2004

Monodispersed flaky silver powder was obtained by controlling the ratios of $H_{2}O_{2}/NH_{3}$ and Agin in a mixed solution of ethylene glycol and ammonia with an addition of PVP. The effects of $NH_{3}/Ag,\; H_{2}O_{2}/Ag\;and\;H_{2}PtCl_{6}/Ag$ on its morphology and size were investigated. In $H_{2}O_{2}-NH_{3}-AgNO_{3}\;system,\;NH_{3}/Ag$ molar ratio was found to be an important reaction factor for the nucleation and crystal growth of Ag powder. The synthesis of flaky powder was optimized at over 6 of $NH_{3}/Ag \;and\;5\;of\;H_{2}O_{2}/Ag\;under\;1.0{\times}10^{-3}\;of\;Pt/Ag.\;Moreover,\;as\;the\; NH_{3}/Ag$ molar ratio increased, the size of precipitates was increased regardless of the amount of Pt. In the absence of $H_{2}PtCI$, the morphology and size of reduced Ag powder were found to be irregular in shape $2-4{\mu}m$ in diameter. However, homogenized fine Ag powder was obtained due to heterogeneous nucleation when $H_{2}PtCI$ used as a cat-alyst, and flaky one was synthesized with the addition of Pt over $1.0{\times}10^{-3}$ of Pt/Ag.

• Journal of the Korean GEO-environmental Society
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• v.20 no.11
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• pp.5-10
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• 2019

For the development of long-wavelength responding photocatalyst, Ag was applied to commercial $TiO_2$ to produce $Ag/TiO_2$ photocatalyst. Moreover, micro-emulsion method was used in order to increase the efficiency of the photocatalyst by enhancing the dispersion of Ag. Physical properties of the manufactured catalyst were analyzed by scanning electron microscopy (SEM), field emission transmission electron microscopy (FE-TEM) and diffuse reflectance spectroscopy (DRS). For the catalytic performance measurement, RO 16 (Reactive Orange 16) removal was performed with 25 ppm RO 16 under UV-A (365 nm) irradiation. In addition, ball milling and dip-coating method were used to synthesize the photocatalyst for the comparison of the outcomes of using different synthesis methods. In addition, catalytic performance was improved by varying the Ag content and surfactant content. The highest catalytic performance was shown at $Ag/TiO_2$ synthesized by micro-emulsion method with 2 wt% of Ag content, and 0.5 g of the surfactant.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.1011-1019
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• 1998

This work designed Sn-5%Pb-1.5%Ag-x%In solder alloy to develop the solder alloy with low Pb content. This solder alloy doesn't cause environmental pollution. and this study reviewed the probability of replacement of Sn-37%Pb solder as evaluation of melting range, wettability. microstructure, microhardne'ss, tensile strength, drossability of this new solder alloys. The level of international regulation in dissolution amount of Pb ion was 3ppm. But dissolution amount of Pb ion in Sn-5%Pb solder alloy confirmed not to threat the global environmental is 0.46ppm. The melting range of this solder alloy was $183-192^{\circ}C$. Also the range of solidification was very narrow within $5^{\circ}C$. The wettability was similar to Sn-37%Pb solder, and the effect of amount of In addition of wettability couldn't be founded. The probability of replacement in the melting range and wettability is very high. And microhardness of this solder alloy was 1.5 times of conventional type solder. Tensile strength of new solder alloys was a little high than that of conventional type solder. With increasing amount of In% addition, tensile strength was increased, but elongation was decreased. The solder alloy of l%In addition revealed AgSn and Pb on dendrite microstructure boundary, and $Ag_3Sn$, $Ag_3In$ and Pb were revealed on it at the solder alloy of 3% In addition. The drossability was superior to Sn-37%Pb solder alloy and the solder alloys of 2% In addition was not generated for 3hrs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.74-78
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• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.