• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• Composites Research
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• v.24 no.2
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• pp.1-8
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• 2011

Interfacial fracture toughness under various mixed-mode loading is measured to provide a mixed-mode fracture criterion of a composite/metal bonded joint. Experimental fracture characterization tests were carried out using a SLB (single leg bending) specimen, which controls mode ratio with the specimen thickness. The experimental result of the SLB test conforms that interfacial fracture toughness increases as the mode II component increases. The effect of loading mode on interfacial crack growth is investigated on the basis of crack path observation using microscopic image acquisition technique. The influence of interfacial roughness on adhesion strength is also discussed.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.12-18
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• 2015

The ultimate goal of developing body is revealed the "lightweight" at latest EuroCarBody conference 2012 and the most core technology is joining process to make lightweight car body design. Accordingly, in this study, the car body assembly line for the assembly process applies to any introduction, particularly in the assembly of aluminum alloy and composite materials applied by the process for the introductory approached. Process were largely classified by welding (laser, arc, resistance, and friction stir welding), bonding (epoxy bonding) and mechanical fastening (FDS, SPR, Bolting and clinching). Applications for each process issues in the case and the applicable award was presented, based on the absolute strength of the test specimens and joining characteristics for comparative analysis were summarized. Finally, through this paper, we would tried to establish the characteristics of the joint for lightweight structure.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.267-278
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• 2010

To improve the grout penetration characteristics, vibration method was adopted in this study. The grout material perturbed by cyclic vibration is injected into the ground. By applying the vibrating flow system, cement particles will become less adhesive and the clogging tendency will be decreased. A series of pilot-scale chamber tests were performed to verify the enhancement of the groutability by applying the vibratory grout injection; assessment on change of the lumped parameter $\theta$ which represents a barometer of clogging phenomenon was made. Moreover, the effect of vibratory grout injection through the joint was also investigated using artificially made rock joints. Experimental results as well as analytical results show that the grout penetration depth can be substantially improved by vibration grouting. Moreover, it was found that enhancement of the permeation grouting due to vibratory injection is more dominant at low grouting pressure of less than 400kPa.

• Journal of the Korea Furniture Society
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• v.10 no.2
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• pp.73-78
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• 1999

This paper describes the relationship between the bending strength properties of sloped finger-jointed woods and the acoustic emissions(AEs) generated during the test. Rhus verniciflua pieces were cut in sloped-finger types and glued with three kinds of adhesives(polyvinyl acetate, polyvinyl-acryl acetate and oilic urethane resin). The slope ratios of finger joints were 0, 1.0, 1.5, and 2.0. The AE cumulative event count and cumulative count were measured during the bending test. The results were as follows: The lower the bending strength(load) was, the generation time of AE event count got and the higher the increasing rate of AE event count became in the sloped finger-jointed specimens bonded with polyvinyl acetate, polyvinyl-acryl acetate oilic urethane resin adhesives. Therefore, the slope from load-AE cumulative event count was very steep. The patterns of AE event count and count were very similar. The relationship between the MOR and the AE parameter from load and AE cumulatve event count in the early stage of the sloped finger-jointed specimens bonded with polyvinyl acetate, polyvinyl-acryl and oilic urethane resin adhesives was much greater than that between the MOE and the MOR. Therefore, the AE signals obtained during bending test are useful for estimating the strength of sloped finger-jointed Rhus verniciflua specimens.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• Composites Research
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• v.15 no.5
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• pp.19-26
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• 2002

Real defects in composite structures were detected by using laser measuring system. Four types of real defects, that is, impact-induced delamination in a composite laminate, debond in a honeycomb structure, free-edge delamination in a composite laminate and debond in an adhesive joint, were made by applying several types of loads to the specimens. Laser measuring system such as ESPI and shearography technique were used to detect those defects. Thermal loading method, which can easily induce the surface deformation of specimen, was used to detect the defects. Experimental results show that the defects in composite structures could be easily detected by ESPI and shearography technique. Moreover, it shows that ESPI and shearography technique could be usefully applied to the detection of defects in various kinds of composite structures.

• Korean Institute of Interior Design Journal
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• v.22 no.5
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• pp.367-375
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• 2013

Using the 'New material' concept has recently been introduced into the natural characteristics. In the course of such a, Janine M. Benyus has proposed to mimic the characteristics of natural ecosystems to mention the concept of Biomimicry. Process made engineered using technical elements for representing the material properties of Biomimicry such will be acting importantly, This study intends to analyze how new materials applied to 'Biomimicry' characteristics are processed in space. The results were as follows : 1) Processing methods of new materials resulted as 'Forming', 'Surface treatment', 'Bonding', 'Inserting'. These four were divided and analyzed into 'Form', 'System', 'Adaptation'. As a result of this analysis, such significances were shown as 'Forming/Surface treatment/Bonding' in 'Form', 'Bonding' in 'System' and 'Adaptation'. 2) 'Bonding' applied to 'System' of new material can be recycled to be combined with other materials through the existing adhesive material, and present as a solution of 'Sustainable development'. 3) 'Bonding' applied to 'Adaptation' of new material is to impart the ability to react to the environment through the joint, but is characteristic, at this time, using digital and other field technology. It appeared primarily that it can be known to meet the social trends and convergence between fields. Thus, as the finish that are friendly to the environment from the interior design, the results of the study are expected to be utilized in the study of new materials guidelines.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.868-872
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• 2006

In this work, the effects of the corona treatment on surface properties of semiconducting silicone rubber were investigated in terms of contact angles, ATR-FTIR(Attenuated total reflection fourier transform infrared spectroscopy) and XPS(X-ray photoelectron spectroscopy). And the adhesive characteristics were studied by measuring the T-peel strengths. Based on chemical analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and C-OH on semiconducting silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiOx,\;x=3{\sim}4$. The Corona treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength.

• Journal of the Korean Society of Safety
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• v.26 no.4
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• pp.1-6
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• 2011

New methods for joining sheet of metal are being sought. One of the most promising methods is MPJ (mechanical press joining). It has been used in thin metal work because of its simple process and relative advantages over other methods, as it requires no fasteners such as bolts or rivets, consumes less energy than welding, and produces less ecological problems than adhesive methods. In this study, the joining process and static behavior of single overlap joints has been investigated. During fixed die type joining process for SPCC plates, the optimal applied punching force was found. The maximum tensile-shear strength of the specimen produced at the optimal punching force was 1.75 kN. The FEM analysis result on the tensile-shear specimen showed the maximum von-Mises stress of 373 MPa under the applied load of 1.7 kN, which is very close to the maximum tensile strength of the SPCC sheet(= 382 MPa). This suggests that the FEM analysis is capable of predicting the maximum tensile load of the joint.