• Journal of the Korean Wood Science and Technology
• /
• v.31 no.2
• /
• pp.84-91
• /
• 2003

In this study, the three species (Populus euramericana, Pinus densiflora and Quercus variabilis) were cut to difference (0, 0.15, 0.3, 0.45 mm) between the size of tip and that of root of the finger (DSTR) and jointed with poly vinyl acetate (PVA) and resorcinol-phenol resin (RPR). We described the relationship between the bending strength properties of finger DSTR and the acoustic emission (AE) generated during the bending test. The results were as follows: The AE generation time of finger-jointed specimens with RPR adhesive was earlier than that with PVA adhesive. The AE cumulative event count of finger-jointed specimens with RPR adhesive continuously increased with increasing load and the event count was much more than that with PVA adhesive. Also, the AE cumulative event count for resorcinol-phenol resin adhesive obtained from low load level was abundant. The AE wave in finger-jointed specimens with RPR adhesive could be detected in the below proportional limit load. Therefore, AE signals from bending test are useful for the estimation of strength in finger DSTR specimens.

• Restorative Dentistry and Endodontics
• /
• v.46 no.3
• /
• pp.32.1-32.10
• /
• 2021

Objectives: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses. Materials and Methods: The 84 specimens (Filtek Z350 XT) were prepared, stored in distilled water for a week and thermocycled (5,000 cycles, 5℃ to 55℃). They were roughened using 400-grit sandpapers and etched with phosphoric acid. Then, specimens were equally divided into 2 groups; Single Bond Universal (SU) and Prime&Bond Universal (PB). Each group was subdivided into 3 subgroups according to application methods (n = 14); UC: 1 coat + uncuring, 1C: 1 coat + curing, 3C: 3 coats + curing. After storage of the repaired composite for 24 hours, specimens were subjected to the SBS test and the data were statistically analyzed by 2-way analysis of variance and independent t-tests. Specimens were examined with a stereomicroscope to analyze fracture mode and a scanning electron microscope to observe the interface. Results: Adhesive material was a significant factor (p = 0.001). Bond strengths with SU were higher than PB. The highest strength was obtained from the 1C group with SU. Bonding in multiple layers increased adhesive thicknesses, but there was no significant difference in SBS values (p = 0.255). Failure mode was predominantly cohesive in old composites. Conclusions: The application of an adequate bonding system plays an important role in repairing composite resin. SU showed higher SBS than PB and the additional layers increased the adhesive thickness without affecting SBS.

• Journal of the Korean Society of Safety
• /
• v.7 no.3
• /
• pp.99-107
• /
• 1992

Weld bonding can be applied as a combined method of spot welding and adhesive to have more advantages than those. Weld bonding has many merits that enlarge the fatigue strength of spot Welding and also improve the creep of adhesive. But it has not beer proved well in the various environmental conditions. In this study, weld bonding test for fatigue properties and tensile strength is presented under such various coditions as temperatures, humidity, and etc.

• Composites Research
• /
• v.36 no.6
• /
• pp.441-447
• /
• 2023

Recently, as demand for high-strength, lightweight materials has increased, there has been great interest in joining with metals. In the case of mechanical bonding, such as bolting and riveting, chemical bonding using adhesives is attracting attention as stress concentration, cracks, and peeling occur. In this paper, surface treatment was performed to improve the adhesive strength, and the change in adhesive strength was analyzed. For the adhesive strength test were conducted with Carbon Fiber Reinforced Plastic(CFRP), CR340(Steel), and Al6061(Aluminum), and laser and plasma surface treatment were used. After plasma surface treatment, the adhesive strength improved by 7.3% and 39.2% in CFRP-CR340 and CFRP-Al6061, respectively. CR340-Al6061 was improved by 56.2% in laser surface treatment. Surface free energy(SFE) was measured by contact angle after plasma treatment, and it is thought that the adhesion strength was improved by minimizing damage through a chemical reaction mechanism. For laser surface treatment, it is thought that creates a rough bonding surface and improves adhesive strength due to the mechanical interlocking effect. Therefore, surface treatment is effect to improve adhesive strength, and based on this paper, the long-term fatigue test will be conducted to prevent fatigue failure, which is a representative cause of actual structural damage.

• The Journal of Advanced Prosthodontics
• /
• v.5 no.4
• /
• pp.457-463
• /
• 2013

PURPOSE. The purpose of this study was to compare the effect of a diode laser and traditional irrigants on the bond strength of self-adhesive cement. MATERIALS AND METHODS. Fifty-five incisors extracted due to periodontal problems were used. All teeth were instrumented using a set of rotary root canal instruments. The post spaces were enlarged for a No.14 (diameter, 1.4 mm) Snowlight (Abrasive technology, OH, USA) glass fiber reinforced composite post with matching drill. The teeth were randomly divided into 5 experimental groups of 11 teeth each. The post spaces were treated with the followings: Group 1: 5 mL 0.9% physiological saline; Group 2: 5 mL 5.25% sodium hypochlorite; Group 3: 5 mL 17% ethylene diamine tetra acetic acid (EDTA), Group 4: 37% orthophosphoric acid and Group 5: Photodynamic diode laser irradiation for 1 minute after application of light-active dye solution. Snowlight posts were luted with self-adhesive resin cement. Each root was sectioned perpendicular to its long axis to create 1 mm thick specimens. The push-out bond strength test method was used to measure bond strength. One tooth from each group was processed for scanning electron microscopic analysis. RESULTS. Bond strength values were as follow: Group 1 = 4.15 MPa; Group 2 = 3.00 MPa; Group 3 = 4.45 MPa; Group 4 = 6.96 MPa; and Group 5 = 8.93 MPa. These values were analysed using one-way ANOVA and Tukey honestly significant difference test (P<.05). Significantly higher bond strength values were obtained with the diode laser and orthophosphoric acid (P<.05). There were no differences found between the other groups (P> .05). CONCLUSION. Orthophosphoric acid and EDTA were more effective methods for removing the smear layer than the diode laser. However, the diode laser and orthophosphoric acid were more effective at the cement dentin interface than the EDTA, Therefore, modifying the smear layer may be more effective when a self-adhesive system is used.

• Journal of the Korea Institute of Building Construction
• /
• v.7 no.3
• /
• pp.107-113
• /
• 2007

This study is to investigate adhesive properties depending on the temperature, humidity, and freeze-thraw of the Steel plate adhesive strengthening method by the epoxy resin. The results are summarized as following. For the temperature variation, the debonding failure appear only after 1 cycle of temperature varoation because the coefficient of thermal expansion of the epoxy resin is comparatively large, and the bonding strength is decreased. The deformation properties and ultrasonic pulse velocity on each materials are similar until 4 cycles on the dry and moisture test. As the freeze-thraw test, the epoxy resin is degraded easily subjected to freeze-thaw cycle, comparatively easy, so the debonding failure may occur in short term because of the freeze-thaw repeatition.p

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1018-1021
• /
• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.1448-1452
• /
• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin-film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the tangential forces simultaneously as the probe tip of the equipment approaches to the interface between thin-film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ${\sim}$ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester, the feasibility test was performed to evaluate the adhesive strength of thin-film.

• Journal of Adhesion and Interface
• /
• v.7 no.4
• /
• pp.1-9
• /
• 2006

The single lap joint is the most studied joint in the literature in terms of both theory and practice. It is easy to manufacture and the lap shear strength is a useful value for strength assessment and quality control. Simple design rules exist such as the one present in standard ASTM 1002 or in a recent paper by Adams and Davies. The main factors that have an influence on the lap shear strength are the type of adhesive, i.e. ductile or brittle, the adherend yield strength and the overlap length. The overlap increases the shear strength almost linearly if the adhesive is sufficiently ductile and the adherend does not yield. For substrates that yield, a plateau is reached for a certain value of overlap corresponding to the yielding of the adherend. For intermediate or brittle adhesives, the analysis is more complex and needs further investigation. In order to quantify the influence of the adhesive, the adherend and the overlap on the lap shear strength, the experimental design technique of Taguchi was used. An experimental matrix of 27 tests was designed and each test was repeated three times. The influence of each variable could be assessed as well as the interactions between them using the statistical software Statview. The results show that the most important variable on the lap shear strength is the overlap length followed by the type of adherend.

• International Journal of Highway Engineering
• /
• v.17 no.6
• /
• pp.47-54
• /
• 2015

PURPOSES : The objective of this study is to evaluate the early adhesive characteristic of asphalt emulsions, including polymer-modified emulsions, for chip seals using the surface energy concept, the bitumen bond strength (BBS) test, and the Vialit test. METHODS : Two general methods, the BBS test and Vialit test, were applied to investigate the bond strength and the aggregate loss, respectively. A new theory, the surface free energy (SFE) theory, was used to evaluate the adhesive characteristic between the emulsion and the aggregate. Based on the theory, the contact angles were measured, and then the surface energy components were calculated. Using those components, the work of adhesion (Wa) was calculated for each emulsion. To ensure reliable results, all the tests were performed under the same conditions, i.e., at $25^{\circ}C$ for 240 minutes of curing time. For the materials, three emulsions (CRS-2, CRS-2L, and CRS-2P) and one aggregate type (granite) were employed. RESULTS AND CONCLUSIONS : Under the same conditions, the modified emulsions showed better adhesive characteristics and curing behaviors than the unmodified emulsions. In addition, there was no significant difference between the various modified emulsions. One of the important findings is that the analysis by Wa presents more sensitive results than other methods. The results of the Wa showed that the CRS-2P emulsion has the best adhesive characteristics. Consequently, the use of modified emulsions for chip seals could prevent aggregate loss and allow open traffic earlier.