• Elastomers and Composites
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• 제29권2호
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• pp.121-130
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• 1994

The physical properties of rubber blend between natural rubber(NR) and ethylene propylene diene terpolymer(EPDM) were investigated as a study of EPDM composite materials. For EPDM/NR blends, the effects of ethylene and diene contents in EPDM, blend ratio, dicumyl peroxide(DCP) curing system on the physical properties, interfacial adhesion force and dynamic crack growth etc. were studied. EPDM/NR blends loaded with carbon black were prepared by mechanical mixing and cured by plate heating cure press. Crosslinking density was measured by swelling method with toluene. The physical properties of all blends were measured with Instron, fatigue to failure(FTF), Demattia flex cracking tester(DMFC), scanning electron microscopy (SEM), etc. As the ethylene and diene contents in EPDM increased, the physical properties, such as dynamic crack growth, adhesion to other component were increased too. Interfacial adhesion force of EPDM/NR blends to dissimilar layer was improved by the use of optimum peroxide curing system.

• International Journal of Concrete Structures and Materials
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• 제2권1호
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• pp.3-8
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• 2008

Polymer-cement composites are known repair materials. The aim of this work is to investigate the influence of various amount of dispersion of carboxylated styrene-butadience copolymer on the selected mechanical properties of polymer-cement concrete (PCC) and on its adhesion to ordinary concrete. The compressive, flexural and tensile strengths as well as frost resistance and fracture resistance of the composites are tested. Adhesion strength of PCC to ordinary concrete, as one of most important performance of good repair material is evaluated and analyzed using three test methods. The results obtained in standard pull-off test are compared with the two other tests. The first one, which is an adaptation of WST (wedge splitting test) characterizes crack propagation in the plane of bond created during repair. In the second test the resistance to shear is a measure of adhesion strength.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.177-179
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• 2011

The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

• 열처리공학회지
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• 제4권2호
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• pp.27-37
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• 1991

The adhesion strength of TiN films to substrate(STC 3) steel has been studied using the scratch adhesion test. Before deposition, the substrates were mechanically polished and TiN films were deposited at different substrate temperature($480^{\circ}C-540^{\circ}C$). The chemical properties of TiN films were investigated by RBS, and EDS, and the physical properties were investigated by micro-hardness tester, SEM, and X-ray diffractometer. According to results of this study, the adhesion strength of TiN films increase with increasing the deposition temperature. The roughness of the polished substrates surface were measured with a profilometer. It was observed that, as a general rule, the adhesion strength of deposited TiN films increase with decreasing the substrates surface roughness.

• 한국재료학회지
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• 제13권5호
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• pp.338-342
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• 2003

Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 대한금속재료학회지
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• 제46권7호
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• pp.464-470
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• 2008

Metallic nanostructures have great potential for bio-chemical sensor applications due to the excitation of localized surface plasmon and its sensitive response to environmental change. Unlike the commonly explored absorption-based sensing, the optical scattering provides single particle detection scheme. For the localized surface plasmon resonance spectroscopy, the metallic nanostructures with controlled shape and size have been usually fabricated on adhesion-layer pre-coated transparent glass substrates. In this study, we calculated the optical scattering properties of plasmonic Au nanodisc using a discrete dipole approximation method and analyzed the effect of adhesion layer on them. Our result also indicates that there is a trade-off between the surface plasmon damping and the capability of supporting nanostructures in determining the optimal thickness of adhesion layer. Marginal thickness of Ti adhesion layer for supporting Au nanostructures fabricated on a silica glass substrate was experimentally analyzed by an adhesion strength test using a nano-indentation technique.

• 폴리머
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• 제39권2호
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• pp.281-286
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• 2015

UV경화형 2-ethylhexyl acrylate(2-EHA)/acrylic acid(AA) 점착제의 점착특성에 대한 경화제 함량의 영향에 대해 조사하였다. 0.01 wt%의 극소량의 MMT가 도입된 아크릴 단량체 혼합물에 각각 0, 0.05, 0.1, 0.3 wt%의 1,6-hexanediol diacrylate(HDDA)를 경화제로 첨가하고 UV조사를 실시하여 점착제를 제조하였다. MMT 도입이 공중합체의 경화 거동과 점착제의 표면 특성에 미치는 영향은 매우 낮았으나, 점착특성의 경우 MMT의 도입으로 분자 사슬의 유연성이 제한되면서 응집파괴(cohesive failure)가 억제되는 것을 확인하였다. 그러나 0.3 wt%의 경화제가 도입된 점착제는 사슬 경직성이 크게 증가하면서 MMT의 첨가가 오히려 점착특성을 저하시키는 것으로 추측되었다. 결과를 토대로 2-EHA/AA 점착제의 경우 0.05 wt%의 낮은 함량의 경화제와 극소량의 MMT의 도입이 박리 시 응집파괴 없이 균형적인 점착특성을 부여하는 것으로 판단된다.

• 한국군사과학기술학회지
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• 제7권2호
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• pp.100-108
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• 2004

Nitramine-polymer composites suffer from a problem known as dewetting. Dewetting adversely affects the performance and the sensitivity characteristics of an explosive composition. Voids, which are generated between explosive particles and binder on dewetting, act as initiation sites. For a PBXs as well as propellants, where good adhesion and mechanical properties are of great importance, dewetting therefore must be prevented by strong adhesion between the filler and the binder. The surface energy of materials is measured by Wilhelmy plate and wicking method. The interfacial energy between the filler and the binder is calculated from the disperse phase and the polar phase of surface energy. Time dependent compressive properties of composite explosives have been determined by stress-strain curves obtained at different strain rates and temperatures. The interfacial state of the PBX was observed through SEM. It was found from the result that the interface between the explosive and the binder becomes better adhesion with decreasing interfacial tension and increasing work of adhesion. The result clearly shows that the castable PBX has good adhesion more than the pressable PBX.

• Korean Chemical Engineering Research
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• 제50권1호
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• pp.6-10
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• 2012

본 연구의 목적은 styrene-butadiene-styrene(SBS) 블록공중합체와 폐타이어 고무분말(crumb rubber, CR)로 개질한 아스팔트의 저온접착특성에 대해 파라핀오일 가소제의 영향에 대한 것이다. SBS/CR로 개질한 아스팔트 블렌드와 파라핀오일/SBS/CR 아스팔트 블렌드의 온도 민감성을 침입도와 연화점으로 측정하였다. 형광현미경으로 파라핀오일/SBS/CR 아스팔트 블렌드에 대한 개질제들의 분산 상태와 만능시험기로 저온에서 접착성질을 각각 측정하였다. 저온접착시험에서 SBS 함량의 증가와 파라핀오일 함량 5 wt % 및 10 wt %에서 접착강도와 변형률이 증가하였다. $-20^{\circ}C$에서 측정한 접착강도와 강인성은 파라핀오일이 10 wt %와 SBS 공중합체의 양이 6 wt %인 조성에서 최대값을 얻었다. SBS/CR/아스팔트 블렌드에서 파라핀오일의 첨가는 유연성을 부여하는 효과를 나타내고, 저온에서 강인성의 증가를 가져오는 것을 확인하였다.