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Effect of Adhesion layer on the Optical Scattering Properties of Plasmonic Au Nanodisc  

Kim, Jooyoung (Department of Physics, Sogang University)
Cho, Kyuman (Department of Physics, Sogang University)
Lee, Kyeong-Seok (Thin Film Materials Research Center, Korea Institute of Science and Technology)
Publication Information
Korean Journal of Metals and Materials / v.46, no.7, 2008 , pp. 464-470 More about this Journal
Abstract
Metallic nanostructures have great potential for bio-chemical sensor applications due to the excitation of localized surface plasmon and its sensitive response to environmental change. Unlike the commonly explored absorption-based sensing, the optical scattering provides single particle detection scheme. For the localized surface plasmon resonance spectroscopy, the metallic nanostructures with controlled shape and size have been usually fabricated on adhesion-layer pre-coated transparent glass substrates. In this study, we calculated the optical scattering properties of plasmonic Au nanodisc using a discrete dipole approximation method and analyzed the effect of adhesion layer on them. Our result also indicates that there is a trade-off between the surface plasmon damping and the capability of supporting nanostructures in determining the optimal thickness of adhesion layer. Marginal thickness of Ti adhesion layer for supporting Au nanostructures fabricated on a silica glass substrate was experimentally analyzed by an adhesion strength test using a nano-indentation technique.
Keywords
localized surface plasmon resonance; adhesion layer; discrete dipole approximation; effective medium approximation;
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1 D. A. Stuart, A. J. Haes, C. R. Yonzon, E. M. Hicks, and R. P. Van Duyne, IEE Proc.-Nanobiotechnol. 152, 13 (2005)
2 E. Hutter and J. H. Fendler, Adv. Mater. 16, 1685 (2004)   DOI   ScienceOn
3 E. D. Palik, Handbook of Optical Constants, Academic Press, New York (1985)
4 K. S. Lee and M. A. El-Sayed, J. Phys. Chem. B 109, 20331 (2005)   DOI
5 R. J. Gehr and R. W. Boyd, Chem. Mater. 8, 1807 (1996)   DOI   ScienceOn
6 A. D. McFarland and R. P. Van Duyne, Nano Lett. 3, 1057 (2003)   DOI   ScienceOn
7 A. P. Alivisatos, Nat. Biotechnol. 22, 47 (2004)   DOI   ScienceOn
8 U. Kreibig and M. Vollmer, Optical Properties of Metal Clusters, Springer, Berlin, Germany (1995)
9 K. H. Su, Q. H. Wei, and X. Zhang, Appl. Phys. Lett. 88, 063118 (2006)   DOI   ScienceOn
10 C. Burda, X. Chen, R. Narayanan, and M. A. El-Sayed, Chem. Rev. 105, 1025 (2005)   DOI   ScienceOn
11 C. Sonnichsen, T. Franzl, T. Wilk, G. von Plessen, J. Feldmann, O. Wilson, and P. Mulvaney, Phys. Rev. Lett. 88, 077402 (2002)   DOI   ScienceOn
12 M. S. Guzman, M. Hack, and G. Neubauer, IEEE Int. Reliab. Phys. Symp. Proc. 32th annual pp. 108 (San Jose, CA, 1994)
13 W. P. McConnell, J. P. Novak, L. C. Brousseau, III, R. R. Fuierer, R. C. Tenent, and D. L. Feldheim, J. Phys. Chem. B 104, 8925 (2000)   DOI   ScienceOn
14 A. K. Sheridan, A. W. Clark, A. Glidle, J. M. Cooper, and D. R. S. Cumming, J. Vac. Sci. Technol. B 25, 2628 (2007)   DOI   ScienceOn
15 B. J. Wiley, S. H. Im, Z. Y. Li, J. McLellan, A. Siekkinen, and Y. Xia, J. Phys. Chem. B 110, 15666 (2006)   DOI   ScienceOn
16 K.-H. Su, Q.-H. Wei, X. Zhang, J. J. Mock, D. R. Smith, and S. Schultz, Nano Lett. 3, 1087 (2003)   DOI   ScienceOn
17 W. H. Yang, G. C. Schatz, and R. P. Van Duyne, J. Chem. Phys. 103, 869 (1995)   DOI   ScienceOn
18 B. T. Drain and P. J. Flatau, J. Opt. Soc. Am. A 11, 1491 (1994)   DOI   ScienceOn
19 S. Link, M. B. Mohamed, and M. A. El-Sayed, J. Phys. Chem. B 103, 3073 (1999)   DOI   ScienceOn
20 K. H. Su, Q.-H. Wei, X. Zhang, J. J. Mock, D. R. Smith, and S. Schultz, Nano Lett. 3, 1087 (2003)   DOI   ScienceOn
21 D. A. Schultz, Curr. Opin. Biotechnol. 14, 13 (2003)   DOI   ScienceOn
22 K. L. Kelly, E. Coronado, L. L. Zhao, and G. C. Schatz, J. Phys. Chem. B 107, 668 (2003)   DOI   ScienceOn
23 M. J. Cordill, D. F. Bahr, N. R. Moody, and W. W. Gerberich, IEEE Trans. Dev. Mater. Reliab. 4, 163 (2004)   DOI   ScienceOn