Effect of Substrate Roughness on the Adhesion of TiN Deposition by PACVD

플라즈마 화학증착법에 있어 모재의 표면조도가 TiN 박막층의 밀착력에 미치는 영향에 관하여

  • Kang, H.Y. (Department of Metallurgical Engineering, Yonsei University) ;
  • Kim, M.I. (Department of Metallurgical Engineering, Yonsei University)
  • 강해용 (연세대학교 공과대학 금속공학과) ;
  • 김문일 (연세대학교 공과대학 금속공학과)
  • Published : 1991.06.29

Abstract

The adhesion strength of TiN films to substrate(STC 3) steel has been studied using the scratch adhesion test. Before deposition, the substrates were mechanically polished and TiN films were deposited at different substrate temperature($480^{\circ}C-540^{\circ}C$). The chemical properties of TiN films were investigated by RBS, and EDS, and the physical properties were investigated by micro-hardness tester, SEM, and X-ray diffractometer. According to results of this study, the adhesion strength of TiN films increase with increasing the deposition temperature. The roughness of the polished substrates surface were measured with a profilometer. It was observed that, as a general rule, the adhesion strength of deposited TiN films increase with decreasing the substrates surface roughness.

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Acknowledgement

Supported by : 연세대학교