• 한국산학기술학회논문지
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• 제16권10호
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• pp.7071-7077
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• 2015

최근 스마트폰, 태블릿 PC 및 전자기기 등의 사용이 증가함에 따라 커버글라스의 수요가 증가하고 있는 추세이다. 모바일 기기의 디스플레이가 대형화되면서 접촉이나 낙하 등과 같이 외부에서 힘을 받게 되는 환경에서 높은 강도를 유지하는 것이 요구되고 있다. 커버글라스 제작 공정에서 연마공정은 커버글라스의 표면거칠기 및 충분한 강도를 제공하는 중요한 공정이다. 기존 연삭 숫돌에 의한 가공방법은 커버글라스 가공표면에 스크레치, 칩핑, 노칭 및 마이크로 크랙 등의 가공 문제점이 발생한다. 따라서 본 연구에서는 모바일 커버글라스의 연마를 위해 연마필름을 이용한 폴리싱 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 연마 필름 폴리싱 시스템에 대한 유한요소모델을 생성하였고 다물체 동역학 해석을 수행하였다. 연마 필름 폴리싱 시스템에 대한 응력 및 변위 해석을 통해 특성을 분석하였고 레이저 변위 센서를 이용해 제작된 시스템에 대한 변위를 측정하여 구조적 안정성에 대해 확인하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권6호
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• pp.291-296
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• 2006

In this study, the sputtered BTO film was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO ($BaTiO_3$) thin film using the $BaTiO_3$-mixed abrasive slurry (BTO-MAS) was higher than that using the $TiO_2$-mixed abrasives slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%) below 5% was obtained in each abrsive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.301-302
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• 2010

• 한국정밀공학회지
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• 제14권10호
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• pp.68-74
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• 1997

The surface finishing system using the micro abrasive film was designed and manufactured to make the mirror surface of the cylindrical workpices. An experimental study of srface finishing was carried out to investigate the performance of mirror surface finishing system. The surface roughness value of stainless steel was about 0.2 .approx. 0.25 .mu. m Rmax, 0.02 .approx. 0.04 .mu. m Ra, using abrasive grain size of 12, 9 .mu. m. The surface roughness value of chrome coated workpiece was about 0.07 .approx. 0.11 .mu. m Ra using abrasive grain size 3 .mu. m. In the same condition, the chrome coated workpiece has obtained better surface roughness charateristics than the one of stainless steel.

• 한국생산제조학회지
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• 제7권6호
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• pp.97-101
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• 1998

In this study, The ultra-precision finishing system is applicable to all kind of the cylnderical workpiece products fast and easy. This system was applied to chrome coated steel to investigate the characteristic of grinding; (1) 3$mu extrm{m}$ of abrasive film is not use for grinding performance. (2) Grinding condition of coated chrome steel would set up differently, in 30~12${\mu}{\textrm}{m}$, in 9~5${\mu}{\textrm}{m}$. (3) The surface roughness of chrome coated steel was about Ra 0.0009${\mu}{\textrm}{m}$ in abrasive grain size 5${\mu}{\textrm}{m}$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.273-278
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• 1994

The surface finishing systems using the micro abrasive film were designed and manufactured to make the mirror surface of the cylindrical workpiece. An experimental study of surface finishing was carried out to investigate the performance of mirror surface finishing system. The surface roughness of stainless steel was about Rmax 0.2~0.25 .mu.m, Ra 0.02~0.04 .mu.m in abrasive grain size 12, 9 .mu.m. the surface roughness of chrome coated workpiece was about Rmax 0.07~ 0.11 .mu. m, Ra 0.01 in abrasive grain size 3 .mu. m. Also, to measure the mirror finishing time by mirror surface finishing system, the experiment was carried out on the chrome coated and ground roller of diameter 76mm and length 650mm. The finishing time and surface roughness were 40min and Rmax 0.1~0.13 .mu.m, Ra 0.01 .mu.m.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• 한국정밀공학회지
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• 제18권10호
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• 반도체디스플레이기술학회지
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• 제3권1호
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.803-809
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• 2005

Cerium ammonium nitrate (CAN) and nitric acid was used an etchant and an additive for Ru etching and polishing. pH and Eh values of the CAN and nitric acid added chemical solution satisfied the Ru etching condition. The etch rate increased linearly as the concentration of CAN increased. Nitric acid added solution had the high etch rate. But micro roughness of etched surfaces was not changed before and after etching, The removal rate of Ru film was the highest in $1wt\%$ abrasive added slurry, and not increased despite the concentration of alumina abrasive increased to $5wt\%$. Even Ru film was polished by only CAN solution due to the friction. The highest removal rate of 120nm/min was obtained in 1 M nitric acid and $1wt\%$ alumina abrasive particles added slurry. The lowest micro roughness value was observed in this slurry after polishing. From the XPS analysis of etched Ru surface, oxide layer was founded on the etched Ru surface. Therefore, Ru was polished by chemical etching of CAN solution and oxide layer abrasion by abrasive particles. From the result of removal rate without abrasive particle, the etching of CAN solution is more dominant to the Ru CMP.