• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.43-48
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• 2010

The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1377-1384
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• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Asian Journal of Innovation and Policy
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• v.8 no.1
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• pp.141-161
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• 2019

A considerable amount of research has been directed at subsistence markets in the recent past with the belief that these markets can be tapped profitably by marketers. Consequently, such markets have seen the launch of a number of innovative products. However, marketers of such forecasts need timely and accurate forecasts regarding the diffusion of their products. The Bass model has been widely used in marketing management to forecast diffusion of innovative products. Given the idiosyncrasies of subsistence markets, such forecasting requires an understanding of effective estimation techniques of the Bass model and their use in subsistence markets. This article reviews the literature to achieve this objective and find out gaps in research. A finding is that there is a lack of timely estimates of Bass model parameters for marketers to act on. Consequently, this article sets a research agenda that calls for timely forecasts at the takeoff stage using appropriate estimation techniques for the Bass model in the context of subsistence markets.

• Journal of Integrative Natural Science
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• v.8 no.3
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• pp.214-220
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• 2015

Cancer has emerged as one of the leading cause of deaths worldwide. A three-dimensional quantitative structure-activity relationship (3D-QSAR) analysis was performed on a series of quinazoline-based anticancer agents. Purpose of the study is to understand the structural basis for their inhibitory activity. Comparative molecular field analysis (CoMFA) technique was employed to develop 3D-QSAR model. Ligand-based alignment scheme was used to generate a reliable CoMFA model. The model produced statistically significant results with a cross-validated correlation coefficient ($q^2$) of 0.589 and a non-cross-validated correlation coefficient ($r^2$) of 0.928. Model was further validated by bootstrapping and progressive scrambling analysis. This study could assist in the design of novel and more potent anticancer agents.

• Journal of Integrative Natural Science
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• v.9 no.1
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• pp.1-9
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• 2016

Leucine rich repeat kinase 2 (LRRK2) is a highly promising target for Parkinson's disease (PD) that affects millions of people worldwide. A three-dimensional quantitative structure-activity relationship (3D-QSAR) analysis was performed on a series of pyrrolopyrimidine-based selective LRRK2 kinase inhibitors. This study was performed to rationalize the structural requirements responsible for the inhibitory activity of these compounds. A reliable 3D-QSAR model was developed using comparative molecular field analysis (CoMFA) technique. The model produced statistically acceptable results with a cross-validated correlation coefficient ($q^2$) of 0.539 and a non-cross-validated correlation coefficient ($r^2$) of 0.871. Robustness of the model was further evaluated by bootstrapping and progressive scrambling analysis. This work could assist in designing more potent LRRK2 inhibitors.

• Journal of Electrical Engineering and Technology
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• v.10 no.2
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• pp.551-559
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• 2015

This paper's focus is in reducing the torque ripple and increasing the average torque by optimizing switching angles of 8/6 switched reluctance motor while implementing a robust speed controller in the outer loop. The mathematical model of the machine is developed and it is simulated using MATLAB/Simulink. An objective function and constraints are formulated and Optimum turn-on and turn-off angles are determined using Particle swarm optimization and Genetic Algorithm techniques. The novelty of this paper lies in implementing sliding mode speed controller with optimized angles. The results from both the optimization techniques are then compared with initial angles with one of them clearly being the better option. Speed response is compared with PID controller.

• Nuclear Engineering and Technology
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• v.53 no.2
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• pp.522-531
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• 2021

We describe a new deep learning model - Convolutional eXtreme Gradient Boosting (ConvXGB) for classification problems based on convolutional neural nets and Chen et al.'s XGBoost. As well as image data, ConvXGB also supports the general classification problems, with a data preprocessing module. ConvXGB consists of several stacked convolutional layers to learn the features of the input and is able to learn features automatically, followed by XGBoost in the last layer for predicting the class labels. The ConvXGB model is simplified by reducing the number of parameters under appropriate conditions, since it is not necessary re-adjust the weight values in a back propagation cycle. Experiments on several data sets from UCL Repository, including images and general data sets, showed that our model handled the classification problems, for all the tested data sets, slightly better than CNN and XGBoost alone and was sometimes significantly better.

• Journal of Integrative Natural Science
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• v.9 no.2
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• pp.113-120
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• 2016

Monopolar spindle 1 (Mps1) is an attractive cancer target due to its high expression levels in a wide range of cancer cells. Mps1 is a dual specificity kinase. It plays an essential role in mitosis. The high expression od Mps1 was observed in various grades of breast cancers. In the current study, we have developed a CoMFA model of pyridazine derivatives as Mps1 kinase inhibitors. The developed CoMFA model ($q^2=0.797$; ONC=6; $r^2=0.992$) exhibited a good predictive ability. The model was then validated by Leave out five, progressive sampling and bootstrapping and found to be robust. The analysis of the CoMFA contour maps depicted favorable and unfavorable regions to enhance the activity. Bulky positive substitution at $R^3$ position and Negative substitution in $R^1$ position is favored could increase the activity. In contrast, bulky substitution in $R^1$ position is not favored. Our results can be used in designing a potent Mps1 (TTK) inhibitor.