• Journal of Electrical Engineering and Technology
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• v.7 no.4
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• pp.582-588
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• 2012

In this paper, a highly miniaturized and performed UWB bandpass filter has been newly designed and implemented by embedding all the passive elements into a multi-layered PCB substrate with high dielectric $SrTiO_3$ composite film for 3.1 - 4.75 GHz compact UWB system applications. The high dielectric composite film was utilized to increase the capacitance densities and quality factors of capacitors embedded into the PCB. In order to reduce the size of the filter and avoid parasitic EM coupling between the embedded filter circuit elements, it was designed by using a $3^{rd}$ order Chebyshev circuit topology and a capacitive coupled transformation technology. Independent transmission zeros were also applied for improving the attenuation of the filter at the desired stopbands. The measured insertion and return losses in the passband were better than 1.68 and 12 dB, with a minimum value of 0.78 dB. The transmission zeros of the measured response were occurred at 2.2 and 5.15 GHz resulting in excellent suppressions of 31 and 20 dB at WLAN bands of 2.4 and 5.15 GHz, respectively. The size of the fabricated bandpass filter was $2.9{\times}2.8{\times}0.55(H)mm^3$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Development and Reproduction
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• v.14 no.2
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• pp.115-121
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• 2010

The in vitro effects of nonylphenol (NP) and 2,2',4,6,6'-pentachlorobiphenyl (PCB104) on ovarian steroidogenesis of the ribbed gunnel, Dictyosoma burgeri were investigated. Oocytes taken during maturation stage were incubated with 100 ng/$m{\ell}$ of NP and PCB104 in the presence of exogenous precursor, $[^3H]-17{\alpha}$-hydroxyprogesterone ($[^3H]-17{\alpha}OHP$). Steroids were extracted from the media and the isolated oocytes, and the extracts were separated and identified by thin layer chromatography. The identities of the major metabolites were testosterone (T) and estradiol-$17{\beta}$ (E2). NP treatment inhibited production of E2 metabolite in the oocytes of 1.2, 1.3 and 1.4 mm although NP inhibited production of T metabolite at the oocytes of 1.1, 1.3 and 1.4 mm. PCB104 treatment inhibited production of T metabolite in the oocytes of all groups and E2 metabolite in the oocytes of 1.2, 1.3 and 1.4 mm. In conclusion, these results suggested that NP and PCB104 had an inhibitory effects on conversion of $[^3H]-17{\alpha}OHP$ to T and E2 during the oocyte maturation process of ribbed gunnel.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.1
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• pp.67-75
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• 2011

This paper investigates the radiated emission from the enclosure aperture, when the enclosure contains a 4-layer PCB and the PCB is driven by a pulse train additive with the switching noise from an active device. Radiated emission characteristics with and without switch noise cases, respectively, are analyzed by changing the PCB location and the slot direction. The equivalent circuit of a DC-DC converter is used to simulate the switching noise of active device. Also, MWS simulation results are directly connected to the ADS simulator as a 2-port block. The simulated results are compared with the measured ones.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.25-32
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• 2021

In this paper, the Magneto-Electric(ME) dipole array antenna with dual-polarization in the X-Band is proposed and it is implemented and measured. The proposed array antenna is composed of 32 single ME dipole antenna and a Teflon PCB. 1 × 1 ME dipole antenna is implemented dual-polarization by radiating vertical polarization and horizontal polarization from two pairs of radiators. 2-port feeding structures are realized by lamination process using LTCC. And, each port independently feeds the radiator through a Γ-shaped feeding strip with isolation between ports. The Teflon PCB used in the antenna array has a 4-layer structure, and 2-port is fed through the top and bottom layers. The λ_g/4 transformer is applied to the transmission line of the Teflon PCB for impedance matching of the arrayed antenna and the Teflon PCB, and the optimal parameters are obtained through simulation. The measured maximum antenna gains of port 1 was 18.2 dBi, Cross-pol was 1.0 dBi. And the measured maximum antenna gains of port 1 was 18.1 dBi, Cross-pol was 3.2 dBi.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.12
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• pp.3329-3343
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• 1995

The interaction of mixed convection and surface radiation in a printed circuit board(PCB) is investigated numerically. The electronic equipment is modeled by a two-dimensional channel with three hot blocks. In order to calculate the turbulent flow characteristics, the low Reynolds number k-.epsilon. model which is proposed by Launder and Sharma is applied. The S-4 approximation is used to solve the radiative transfer equation. The effects of the Reynolds number and geometric configuration variation of PCB on the flow and heat transfer characteristics are analyzed. As the results of this study, it is found that the thermal boundary layer occured at adiabatic wall in case with thermal radiation included, and the effect of radiation is also found to be insignificant for high Reynolds numbers. It is found, as well, that the heat transfer increases as the Reynolds number and block space increase and the channel height decreases and the heat transfer of vertical channel is greater than that of horizontal channel.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.117-122
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• 2008

Micro-sized bumps on a multi-layered build-up PCB were fabricated by pulse-reverse copper electroplating. The values of the current density and brightener content for the electroplating were optimized for suitable performance with maximum efficiency. The micro-bumps thus electroplated were characterized using a range of analytical tools that included an optical microscope, a scanning electron microscope, an atomic force microscope and a hydraulic bulge tester. The optical microscope and scanning electron microscope analyses results showed that the uniformity of the electroplating was viable in the current density range of $2-4\;A/dm^2$; however, the uniformity was slightly degraded as the current density increased. To study the effect of the brightener concentration, the concentration was varied from zero to 1.2 ml/L. The optimum concentration for micro-bump electroplating was found to be 0.6 ml/L based on an examination of the electroplating properties, including the roughness, yield strength and grain size.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.43 no.12 s.354
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• pp.75-82
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• 2006

In this paper, we design the meander line inductors with high sensitivity and high quality factor(Q) using high characteristic impedance of aperture ground plate. Sensitivity as a frequency is new defined by variation of effective inductance per analysis frequency range instead of self resonance frequency (SRF). An equivalent lumped circuit is derived to explain the characteristic of high frequency inductor. The 4 nH meander line inductor with aperture ground plate has 0.45 nH/GHz of good sensitivity and 86 of Q at 0.7 GHz.