• 한국전문물리치료학회지
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• 제14권4호
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• pp.75-83
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• 2007

The purpose of this study was to investigate the effect of balance training with upper extremity exercise on the improvement of balance performance in people who have had a stroke. Eighteen candidates who have all experienced a stroke, were living in Dong-Gu, Ulsan and were participating in a community based rehabilitation program, have been included in this study. The program was conducted three times weekly, 1 hour per session, for 7 consecutive weeks. Subjects were tested with 7 m and 100 m Timed Gait Test (sec), Timed Get Up and Go Test (sec), Functional Reach Test (cm) and 5 items of Berg's Balance Test at pre-training and post-training. Total balance index and balance ratios were measured by K.A.T. 3000. The balance training program performed by sitting on a chair and gymnastic ball and standing on stable and unstable surfaces during upper extremity exercises such as Proprioceptive Neuromuscular Facilitation (PNF) upper extremity pattern, picking a ball up from floor, throwing and catching it. After seven weekends of balance training, subjects showed a significant difference in balance test results. The exceptions were three items of Berg's Balance Test (p<.05). Balance index score and affected and unaffected side balance ratio had a larger improvement than pre-training (p<.05). The result of this study showed that intervention of this balance training program could improve the balance performance in people who have had a stroke.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.289-299
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• 2005

실험과 비선형 유한요소해석을 병행하여, area array 패키지에서 솔더 접합부 특성을 판별하기 위한 전단시험 결과에 미치는 전단속도와 높이의 영향을 연구하였다. 전단속도의 증가와 전단높이의 감소에 따라 전단강도는 증가하는 경향을 나타내었다. 과대하게 높은 전단높이는 비정상적으로 높은 표준편차 또는 솔더볼 표면으로부터 전단 프로브의 밀림 현상과 같은 실험오차를 발생시켰다. 반면, 낮은 전단 속도는 취약한 계면 파괴나 계면에서 가장 약한 층의 판별에 있어서 유용하였다. 한편, 리플로우 회수 증가에 따른 Sn-37Pb/Cu와 Sn-3.5Ag/Cu BGA 솔더 접합부의 기계적${\cdot}$전기적 특성에 대하여 연구하였다. Cu6Sn5와 Cu3Sn으로 구성된 금속간화합물 층의 총 두께는 리플오우 시간의 1/3승에 비례하여 증가하였다. 전단 강도는 3회 또는 4회 리플로우까지 증가한 후, 이후 리플로우 회수에 비례하여 감소하는 경향을 나타내었다. 이때, 파괴는 리플로우 회수에 관계없이 솔더 내에서 발생하였다. 진기 비저항은 리플로우 회수에 비례하여 증가하였다.

• 한국의류산업학회지
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• 제14권4호
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• pp.635-640
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• 2012

In this study, thermoplastic urethane (TPU) coating yarns were prepared at various extruding temperatures. The fine structure and mechanical properties of resultant TPU coating yarns examined by the wide angle X-ray diffractometer (WAXD), differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMTA), and tensile test. TPU coating yarns (prepared at extruding temperatures at $175^{\circ}C$) were confirmed as a stable fine structure that obtained excellent tensile strength and flexibility. The C samples prepared by optimized conditions made by TPU woven floor mat. The structure of the woven mat is $4{\times}4$ basket weave and have laminated with the EVA foam to obtained final TPU woven floor mat products. The resultant TPU woven floor mat was obtained to 1.5MN of tensile strength, 22% of the elongation, and 0.2MN of tear strength. The weight loss abrasion and the resilience by the ball rebound of the TPU-woven floor mat was prior to those of the PVC subsequently, we were able to develop a woven floor mat with TPU coating yarn and produce an eco-friendly high valuable woven floor mat using an interior product.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• Journal of Welding and Joining
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• 제19권5호
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• 한국안광학회지
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• 제16권3호
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• pp.229-235
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• 2011

목적: 본 연구에서는 안경 착용자들이 안경렌즈의 파손으로 인한 안전사고에 노출될 수 있다는 점에 착안하여 국내에 유통되고 있는 안경렌즈의 내충격성을 평가하고자 하였다. 방법: 국내에 유통되고 있는 4개 회사의 제품으로 NK55(${n_{d}}$ = 1.56)소재의 굴절력 -3D, -6D, +3D, +6D를 가지는 안경렌즈 중 코팅을 통한 강화처리를 하지 않은 160개의 안경렌즈를 대상으로 하여 강철구 낙하 시험(Drop Ball Test)을 실시하였다. 즉, 미국 FDA의 기준에 따라 이들 안경렌즈에 약 16 g의 강철구를 높이 127 cm에서 자유낙하 시킨 후 렌즈의 표면형태를 관찰하였다. 결과: 본 연구에서 사용한 다른 4곳 회사에서 제조되는 안경렌즈의 중심두께는 같은 굴절률과 굴절력을 가짐에도 불구하고 그 수치가 동일하지는 않은 것으로 조사되었다. 강철구 낙하시험에서 렌즈 표면에 균열이나 깨짐이 없는 것을 적합한 안전성을 가진 렌즈로 규정하였을 때 +3D, +6D의 볼록렌즈는 모두 안전한 렌즈로 판단되었다. 그러나 상대적으로 중심두께가 얇은 오목 렌즈의 경우 강철구 낙하 시험을 수행하였을 때 렌즈의 깨짐 현상이 두드러지게 나타남을 확인할 수 있었다. 특히 -3D, -6D 오목렌즈의 경우 전체 80개 중 73.8%에 해당하는 59개가 미국 FDA 기준에 부적합한 렌즈로 나타났다. 결론: 본 결과로 미루어 볼 때 안경 구매시 시력교정과 더불어 미적인 면과 가격적인 면도 중요하지만 안경 렌즈의 파손에 의한 사고 또한 무시할 수 없는 사항이라 여겨졌다. 따라서 국내에서도 안경렌즈로 인한 안전사고의 방지를 위하여 강철구 낙하 시험의 의무적인 시행과 더불어 이의 철저한 확인이 시급하다고 판단할 수 있었다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 공업화학
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• 제25권2호
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• pp.161-166
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• 2014

본 연구에서는 열전지용 양극활물질로 사용되는 $FeS_2$ (Pyrite) 분말을 볼밀링법으로 분쇄하여 단위전지를 제작하고, 볼밀 전, 후 입자크기변화가 열전지의 전기화학적 특성에 미치는 영향을 고찰하였다. $450^{\circ}C$ 시험결과, 분쇄된 $1.46{\mu}m$ $FeS_2$ 분말을 사용한 단위전지가 분쇄 전 $98.4{\mu}m$의 $FeS_2$ 분말을 사용한 단위전지에 비해서 전지용량이 크게 향상되었으며, 내부저항도 감소되었다. 이러한 결과는 볼밀로 인한 비표면적 증가의 영향으로 판단된다. 반면, $500^{\circ}C$에서 방전시 1단계의 Z-phase 반응구간($FeS_2{\rightarrow}Li_3Fe_2S_4$)에서 $1.46{\mu}m$ 분말을 사용한 단위전지 전압 및 저항특성이 우수하였지만, 2단계의 J-phase 반응($Li_3Fe_2S_4{\rightarrow}LiFe_2S_4$)에서는 볼밀된 $1.46{\mu}m$ 분말을 사용한 전지의 전압이 감소하고, 전지 내부저항도 급격하게 증가하는 경향을 보였다. 이러한 현상은 $500^{\circ}C$ 방전시 미분화된 $FeS_2$가 Z-phase 영역에서 방전반응과 동시에 열분해에 의한 자가방전($FeS_2{\rightarrow}FeS_{1.14}$ (pyrrhotite))이 일어나 볼밀 전 조대한(coarsen) $FeS_2$ 분말에 비해 용량이 감소하고 내부 저항도 증가되기 때문으로 사료된다.

• Environmental Engineering Research
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• 제17권4호
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• pp.197-203
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• 2012

Phosphorus removal during discharge of wastewater is required to achieve in a very high level because eutrophication occurs even at a very low phosphorus concentration. However, there are limitations in the traditional technologies in the removal of phosphorus at very low concentration, such as at a level lower than 0.1 mg/L. Through a series of experiments, a possible technology which can remove phosphate to a very low level in the final effluent of wastewater was suggested. At first Al, Zn, Ca, Fe, and Mg were exposed to phosphate solution by impregnating them on the surface of activated alumina to select the material which has the highest affinity to phosphate. Kinetic tests and isotherm tests on phosphate solution have been performed on four media, which are Ca-impregnated activated alumina, activated alumina, Ca-impregnated loess ball, and loess ball. Results showed that Ca-impregnated activated alumina has the highest capacity to adsorb phosphate in water. Scanning electron microscope image analysis showed that activated alumina has high void volume, which provides a large surface area for phosphate to be adsorbed. Through a continuous column test of the Ca-impregnated activated alumina it was discovered that about 4,000 bed volumes of wastewater with about 0.2 mg/L of phosphate can be treated down to lower than 0.14 mg/L of concentration.

• 한국운동역학회지
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• 제25권3호
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• pp.293-300
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• 2015

Objective : The purpose of this study was to compare the kinematic data of the horizontal rotation movements of shoulder, hip, knee during two-handed backhand drive stroke according to two different ball directions. Methods : The kinematic variables were analyzed such as the joint angles of the lower body, horizontal rotation angles of the shoulder, hip, inter-knee segment, body twist angle and difference in angle of forward swing. Two-handed backhand drive stroke was analyzed through a three-dimensional motion analysis. The collected data were analyzed by a paired t-test, and the statistical significant value was set at ${\alpha}=.05$. Results : The findings of this study were as follows; First, there was no difference in the total angles of lower limb joints from the forward swing position to impact posterior. Second, there was no difference in the horizontal rotation angles of E1 shoulder, hip, and E2 shoulder but the horizontal rotation angles of E1 knee, E2 hip, knee, E3, and E4 shoulder, hip, and knee were different in all events. Third, there was no difference in the body twist angle of the maximum horizontal rotation. In addition, there was no difference in the angle of the body twist by the ball direction in the shoulder-hip, the hip-knee and the shoulder-knee. Conclusion : Horizontal rotation angle determines ball directions.