• Structural Engineering and Mechanics
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• 제5권3호
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• pp.283-295
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• 1997

This paper presents a high precision integration method for the dynamic response analysis of structures with holonomic constraints. A detail recursive scheme suitable for algebraic and differential equations (ADEs) which incorporates generalized forces is established. The matrix exponential involved in the scheme is calculated precisely using $2^N$ algorithm. The Taylor expansions of the nonlinear term concerned with state variables of the structure and the generalized constraint forces of the ADEs are derived and consequently, their particular integrals are obtained. The accuracy and effectiveness of the present method is demonstrated by two numerical examples, a plane truss with circular slot at its tip point and a slewing flexible cantilever beam which is currently interesting in optimal control of robot manipulators.

• 진공이야기
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• 제3권3호
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• pp.15-18
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• 2016

In future wearable electronic systems, 3-dimensional (3D) devices have attracted much attention due to their high density integration and low-power functionality. Among 3D devices, gate-all-around (GAA) nanowire transistor provides superior gate controllability, resulting in suppressing short channel effect and other drawbacks in 2D metal-oxide-semiconductor field-effect transistor (MOSFET). Silicon nanowires (SiNWs) are the most promising building block for GAA structure device due to their compatibility with the current Si-based ultra large scale integration (ULSI) technology. Moreover, the theoretical limit for subthreshold swing (SS) of MOSFET is 60 mV/dec at room temperature, which causes the increase in Ioff current. To overcome theoretical limit for the SS, it is crucial that research into new types of device concepts should be performed. In our present studies, we have experimentally demonstrated feedback FET (FBFET) and tunnel FET (TFET) with sub-60 mV/dec based on SiNWs. Also, we fabricated SiNW based complementary TFET (c-TFET) and SiNW complementary metal-oxide-semiconductor (CMOS) inverter. Our research demonstrates the promising potential of SiNW electronic devices for future wearable electronic systems.

• Computers and Concrete
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• 제11권1호
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• pp.51-61
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• 2013

This paper describes earthquake response of the Arhavi Highway Tunnel its geometrical properties, 3D finite element model and the linear time history analyses under a huge ground motion considering soil-structure interaction. The Arhavi Highway Tunnel is one of the tallest tunnels constructed in the Black Sea region of Turkey as part of the Coast Road Project. The tunnel has two tubes and each of them is about 1000 m tall. In the study, lineartime history analyses of the tunnel are performed applying north-south, east-west and up accelerations components of 1992 Erzincan, Turkey ground motion. In the time history analyses, Rayleigh damping coefficients are calculated using main natural frequency obtained from modal analysis. Element matrices are computed using the Gauss numerical integration technique. The Newmark method is used in the solution of the equation of motion. Because of needed too much memory for the analyses, the first 10 second of the ground motions, which is the most effective duration, is taken into account in calculations. The results obtained 3D finite element model are presented. In addition, the displacement and stress results are observed to be allowable level of the concrete material during the earthquakes.

• 대한기계학회논문집A
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• 제41권6호
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• pp.491-497
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• 2017

최근 3차원 프린팅 기술이 기존의 시작품 제작을 넘어서 직접 제조기술로서의 잠재력을 보이면서 많은 관심을 받고 있다. 3차원 프린팅은 기존의 제조공정으로는 불가능했던 복잡한 형상의 제작이 가능한 장점이 있으며, 이러한 장점으로 인해 경량화 구조물이나 부품이 일체화된 제품의 제조에도 사용되고 있다. 본 연구에서는 이러한 특성을 활용하여 제품의 경량화와 통기성 향상을 위한 다공성 박판 구조를 설계하였고, 유한요소해석을 통해 구조물의 굽힘강성을 비교하였다. 또한 다공성 구조물의 강성 저하를 보완하기 위한 보강설계를 수행하였고, 유한요소해석을 통해 보강구조물의 설계에 따른 굽힘강성 변화를 고찰하였으며 반응표면분석을 통해 설계변수의 최적화를 수행하였다.

• 한국측량학회지
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• 제39권5호
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• pp.297-311
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• 2021

Around the world, there is an increasing interest in Digital Twin cities. Although geospatial data is critical for building a digital twin city, currently-established spatial data cannot be used directly for its implementation. Integration of geospatial data is vital in order to construct and simulate the virtual space. Existing studies for data integration have focused on data transformation. The conversion method is fundamental and convenient, but the information loss during this process remains a limitation. With this, standardization of the data model is an approach to solve the integration problem while hurdling conversion limitations. However, the standardization within indoor space data models is still insufficient compared to 3D building and city models. Therefore, in this study, we present a comparative analysis of data models commonly used in indoor space modeling as a basis for establishing a generic indoor space feature model. By comparing five models of IFC (Industry Foundation Classes), CityGML (City Geographic Markup Language), AIIM (ArcGIS Indoors Information Model), IMDF (Indoor Mapping Data Format), and OmniClass, we identify essential elements for modeling indoor space and the feature classes commonly included in the models. The proposed generic model can serve as a basis for developing further indoor feature models through specifying minimum required structure and feature classes.

• 한국산학기술학회논문지
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• 제15권2호
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• pp.1195-1203
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• 2014

최근 표준으로 등록된 IFC(Industry Foundation Classes)4는 건축시설의 형상요소 표현에 한정될 뿐 도로, 교량 및 터널 등의 토목시설에 대한 형상표준을 정의하고 있지 않아 여전히 토목 형상모델의 교환을 위한 상호운용성에 제약이 있다. 특히 도로시설은 중심선형에 따라 모델링되는 선형적 특성을 가지며, 프로젝트 별로 형상이 서로 상이하여 표준화된 도로정보모델을 구축하는 것이 곤란하다. 따라서 본 연구에서는 도로의 형상정보모델 개발을 위해 3차원 설계 프로세스 관점에서 도로를 구성하는 구조요소 및 속성을 도출하는 것이 목적이다. 이를 위해 본 연구는 도로설계를 위해 활용되는 도로설계편람, 지침, 시방서 및 기하설계 기준 등의 정보를 분석하여 도로 구조물의 형상 요소와 속성을 추출한다. 도출된 형상은 엔티티(Entity) 항목으로 정의하고 가상 도로모델을 통해 정의된 도로 형상모델의 위계구조를 검토한다. 도출된 도로의 세부 구조 요소 및 속성은 인프라 분야의 BIM(Building Information Modeling)환경을 구축하기 위한 3차원 형상정보로 활용되며, 도로의 구체적인 형상, 타입 및 속성을 세분화하여 도로분야의 IFC로 확장하기 위한 기초자료로 활용될 것으로 기대된다.

• 한국재료학회지
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• 제23권10호
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• 한국군사과학기술학회지
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• 제2권2호
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• pp.209-217
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• 1999

In this paper, an integrated S/W system from CAD to optimal design has been suggested and an application to a precision machine tool structure shown. The integrated system is so designed to reduce manual interfacing effort. An object-oriented programming language is used for combining 3-D CAD program, FEM and optimal design tools. In this system parametric modelling technique is applied and users can get the optimum design iteratively without much user intervention. The CAD model is automatically updated when the design parameters are transferred back to the CAD program. Not only design time can be dramatically reduced but unnecessary operation errors avoided by the integration.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Wind and Structures
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• 제15권3호
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• pp.189-208
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• 2012

Lock-in and drag amplification phenomena are studied for a flexible cantilever using a simplified fluid-structure interaction approach. Instead of solving the 3D domain, a simplified setup is devised, in which 2D flow problems are solved on a number of planes parallel to the wind direction and transversal to the structure. On such planes, the incompressible Navier-Stokes equations are solved to estimate the fluid action at different positions of the line-like structure. The fluid flow on each plane is coupled with the structural deformation at the corresponding position, affecting the dynamic behaviour of the system. An Arbitrary Lagrangian-Eulerian (ALE) approach is used to take in account the deformation of the domain, and a fractional-step scheme is used to solve the fluid field. The stabilization of incompressibility and convection is achieved through orthogonal quasi-static subscales, an approach that is believed to provide a first step towards turbulence modelling. In order to model the structural problem, a special one-dimensional element for thin walled cross-section beam is implemented. The standard second-order Bossak method is used for the time integration of the structural problem.