• Title/Summary/Keyword: 3D 인쇄

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A Study on the User Behavior of Korean Defense R&D Researchers (국방연구개발 연구원들의 정보이용 행태에 관한 연구)

  • Song, Jong-Ho;Oh, Dong-Geun
    • Journal of Information Management
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    • v.39 no.2
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    • pp.1-25
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    • 2008
  • This study is to investigate the user behavior of defense development and test researchers working for A research institute to provide advanced library services. Based on the prior studies about the subject, survey through questionnaires were conducted, and the data analyzed using SPSS 12.0. Results of the analyses are as follows: The researchers generally gathered information 2 to 3 times per month. The major reason for information gathering was to solve problems and do their tasks. They considered accuracy of information as the most important factor when they gather information. Finding and selecting information sources were the most difficult task for them in retrieving, acquiring and using information. They have most frequently used digital materials (67%), printed materials next (26%), and non-book materials (6%). Internet was both the most frequently used and most satisfied information source for the researchers.

Design and Implementation of Dual Wideband Dipole Type Antenna for the Reception of S-DMB and 2.4/5 GHz WLAN Signals (S-DMB와 2.4/5 GHz WLAN 신호 수신을 위한 이중 광대역 다이폴형 안테나의 설계 및 구현)

  • Kim, Sung-Min;Yang, Woon-Geun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.11 s.114
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    • pp.1021-1029
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    • 2006
  • In this paper, we designed and implemented a dual wideband dipole type antenna for the reception of S-DMB (Satellite Digital Multimedia Broadcasting) and 2.4/5 GHz WLAN(Wireless Local Area Network) signals. The proposed antenna based on conventional monopole type dual band antenna was implemented as planar wideband dipole type antenna with the volume of $8{\times}33.8{\times}1.68mm^3$. The proposed antenna is printed type on FR4 substrate of 1.6 mm thick and composed of a dipole type antenna for low frequency band and two symmetric structured resonance elements for high frequency band. We confirmed antenna area with dense surface current for each frequency band with simulation. By varying the length of the antenna area with dense surface current, we could vary resonance frequency of each frequency band separately. Impedance bandwidths$(VSWR{\leq}2)$ are 362 MHz(14.23 %) for 2 GHz band and 1188 MHz(22.13, %) for 5 GHz band which show wideband characteristic. Measured maximum gains were 4.33 dBi for 2 GHz band and 5.48 dBi for 5 GHz band which showed improved performance. And the implemented antenna has a good omni-directional radiation pattern characteristic.

Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module (태양광 접속함 정션박스 모듈 적용을 위한 Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In 솔더링의 공정최적화)

  • Lee, Byung-Suk;Oh, Chul-Min;Kwak, Hyun;Kim, Tae-Woo;Yun, Heui-Bog;Yoon, Jeong-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.13-19
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    • 2018
  • The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

Development of Prototyping and Die/Mold Manufacturing Technology using Rapid Prototyping(SLA) (쾌속 3차원 조형법을 이용한 시작기술 및 시작금형)

  • Park, K.;Lee, S.C.;Jung, J.H.;Yang, D.Y.;Yoon, J.R.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.5
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    • pp.1582-1589
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    • 1996
  • Rapid prototyping is a new prototyping technology which produces three dimensional part models directrly from CAD data and has been extensively applied to various manufacturing processes. There are many types of rapid prototyping systems due to their building principles and materials. In this work, Stereolithography Appaaratus(SLA) which is the most widely-used rapid prototyping system is introduced to achieve die/mold technology innovation. For the purpose, the prototyping technology using SLA is developed such that patterns of which shapes are quite complicated are successfully produced with high accuracy. Using these patterns, prototype die/molds are efficientrly manufactured; a turbocharger rotor, a fan and a wheel patterns, prototype die/molds are efficienterly manufactured ; a turbochager rotor, a fan and a wheel pattern are made, and the molds of the investment casting, the injection molding and the die casting are manufactured respectively. The casting products are produced using these molds and it turns out that these methods are quitre effective for manufacturing products of complicated geometry from the viewpoint of efficiency and productivity.

3D Interactive Virtual Space System based on VRML and EAI (VRML과 EAI를 이용한 3D 상호작용 가상공간시스템)

  • 염창근;박경환
    • Proceedings of the Korea Multimedia Society Conference
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    • 1998.10a
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    • pp.149-154
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    • 1998
  • 본 논문에서는 월드와이드웹상에서 3차원 인터페이스를 기술하는 표준 사양인 VRML과 자바의 EAI(External Authoring Interface)를 통하여 사용자 간에 발생하는 상호작용들을 동기화 시키는 방법을 소개한다. 제시한 방법에서는 별도의 독립적인 응용프로그램을 작성하거나 동기화를 위하여 확장된 VRML을 사용할 필요없이 웹브라우저와 바로 호환하여 사용할 수 있으며 기존의 방대한 웹문서와 연계가 쉬우므로 범용적인 자료구축이 가능하다. 하지만, 가장 최근의 VRML97에서조차도 VRML이 제시하는 가상공간 다중 사용자 환경의 지원은 아직 미비하다. 더 이상 단순히 3차원 월드를 탐험하는 시기는 지났으며, 같은 공간상에서 혼자가 아닌 여럿이 함께 하는 다중 사용자 환경을 제공해야 할 것이다. 이에 자바의 네트웍 기능과 가상공간의 외부에서 동적으로 월드를 제어할 수 있는 EAI를 이용하여 부족했던 다중 사용자 환경을 지원함으로써 가상 공간 시스템을 구축할 수 있다. 그러나, 가상 공간에서 일어나는 이벤트는 단지 동일 브라우저에서만 유효하기 때문에 다른 사용자에게 전달할 때는 이벤트를 원격지의 이벤트와 연동하기 위하여 다른 방법이 필요하다. 사용자 상호작용 시스템에 있어서 이러한 이벤트를 결정하는 가장 중요한 요소는 아바타의 행동양식(avatar's behavior)이라 할 수 있다. 가상 공간에서 일어나는 이벤트의 대부분이 사용자에 의해서 발생되는 것들이다. 즉, 아바타의 행위에 따라서 사용자 서로 간에 상호작용이 일어나게 되며 이들 이벤트를 서로 동기화 함으로써 실시간 3차원 상호작용 시스템을 구현한다. 이렇게 구현된 시스템을 구현한다. 이렇게 구현된 시스템은 전자 상거래, 가상 쇼핑몰, 가상 전시화, 또는 3차원 게임이나 가상교육 시스템과 같은 웹기반 응용프로그램에 사용될 수 있다.물을 보존·관리하는 것이 필요하다. 이는 도서관의 기능만으로는 감당하기 어렵기 때문에 대학정보화의 센터로서의 도서관과 공공기록물 전문 담당자로서의 대학아카이브즈가 함께 하여 대학의 공식적인 직무 관련 업무를 원활하게 지원하고, 그럼으로써 양 기관의 위상을 높이는 상승효과를 낼 수 있다.하여는, 인쇄된 일차적 정보자료의 검색방법등을 개선하고, 나아가서는 법령과 판례정보를 위한 효율적인 시스템을 구축하며, 뿐만 아니라 이용자의 요구에 충분히 대처할 수 잇는 도서관으로 변화되는 것이다. 이와 함께 가장 중요한 것은 법과대학과 사법연수원에서 법학 연구방법에 관한 강좌를 개설하여 각종 법률정보원의 활용 내지 도서관 이용방법에 관하여 교육하는 것이다.글을 연구하고, 그 결과에 의존하여서 우리의 실제의 생활에 사용하는 $\boxDr$한국어사전$\boxUl$등을 만드는 과정에서, 어떤 의미에서 실험되었다고 말할 수가 있는 언어과학의 연구의 결과에 의존하여서 수행되는 철학적인 작업이다. 여기에서는 하나의 철학적인 연구의 시작으로 받아들여지는 이 의미분석의 문제를 반성하여 본다. 것이 필요하다고 사료된다.크기에 의존하며, 또한 이러한 영향은 $(Ti_{1-x}AI_{x})N$ 피막에 존재하는 AI의 함량이 높고, 초기에 증착된 막의 업자 크기가 작을 수록 클 것으로 여겨진다. 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로 $\ulcorner$순응$\lrcorner$의 범위를 벗어나지 않는다. 그렇기 때문에도 $\ulcorner$순응

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Electrical Characteristics of Copper Circuit using Inkjet Printing (잉크젯 프린팅 방식으로 형성된 구리 배선의 전기적 특성 평가)

  • Kim, Kwang-Seok;Koo, Ja-Myeong;Joung, Jae-Woo;Kim, Byung-Sung;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.43-49
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    • 2010
  • Direct printing technology is an attractive metallization method, which has become immerging as "Green technology" to the conventional photolithography, on account of low cost, simple process and environment-friendliness. In order to commercialize the printed electronics in industry, it is essential to evaluate the electrical properties of conductive circuits using direct printing technology. In this contribution, we focused on the electrical characteristics of inkjet-printed circuits. A Cu nanoink was inkjet-printed onto a Bisaleimide triazine(BT) substrate with parallel transmission line(PTL) and coplanar waveguide(CPW) type, then was sintered at $250^{\circ}C$ for 30 min. We calculated the resistivity of printed circuits through direct current resistance by the measurement of I-V curve: the resistivity was approximately 0.558 ${\mu}{\Omega}{\cdot}cm$ which is about 3.3 times that of bulk Cu. Cascade's probe system in the frequency range from 0 to 30 GHz were employed to measure the Scattering parameter(S-parameter) with or without a gap between the substrate and the probe station chuck. The result of measured S-parameter showed that all printed circuits had over 5 dB of return loss in the entire frequency range. In the curve of insertion loss, $S_{21}$, showed that the PTL type circuits had better transmission of radio frequency (RF) than CPW type.

Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy in D. I. Water and NaCl Solutions (증류수 및 NaCl 용액내 SnPb 솔더 합금의 Electrochemical Migration 우세 확산원소 분석)

  • Jung, Ja-Young;Lee, Shin-Bok;Yoo, Young-Ran;Kim, Young-Sik;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.3 s.40
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    • pp.1-8
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    • 2006
  • Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.

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Shape Design of FPCB Connector to Improve Assembly Performance (체결 성능 향상을 위한 FPCB 커넥터의 형상설계)

  • Kim, Dae-Young;Park, Hyung-Seo;Kim, Woong-Kyeom;Pyo, Chang-Ryul;Kim, Heon-Young
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.3
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    • pp.347-353
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    • 2012
  • Recently, multi-functionalization (as in smart phones) has been in demand, and the connectors connecting the electrical signals of each board in a cellular phone have become key components. The miniaturization of these connectors is required to achieve a finer pitch design and enhance the electrical signal transfer capacity. However, the miniaturization of connectors reduces the structural safety, and a finer pitch design may cause contact problems under external impact. In this paper, a preliminary design for miniaturized, finer-pitch connectors is suggested for a product with 50 pins and a thickness of 0.2 mm. The assembly process of the FPCB (Flexible Printed Circuit Board) and connector was simulated to ensure the holding force between the two components and avoid overstressing. The design optimization process was performed with the Taguchi method. Fatigue analysis was also conducted to predict the fatigue life of the terminal, and the theoretical and experimental results were compared.

Design of Diversity Vehicle Antennas for FM Radio Reception (FM 라디오 수신을 위한 차량용 다이버시티 안테나 설계)

  • Ahn, Seung-Beom;Noh, Young-Ho;Oh, Jung-Hoon;Choo, Ho-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.8
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    • pp.761-769
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    • 2009
  • In this paper, we report on the channel capacity and diversity gain of the vehicle on-glass antenna for FM radio reception. The correlation coefficient and channel capacity were obtained using the simulated 3D radiation pattern of each antenna and the Rayleigh channel model for urban environment. To examine the channel capacity we used two antennas which are a simple straight antenna and L-type antenna. Then we observed the available channel capacity by varying the position of feeds and the shape of the L-type antenna. The sample antenna, which has a maximum feed distance with different polarizations, was built and the receiving performance was measured in the weak FM field area. From the results we confirmed that the distance between the feeds should be placed as far as possible for the high channel capacity. If the distance between the feeds are greater than a certain threshold value than the polarizations of the two antennas are getting more important for determining the channel capacity.

Bio-kinetic and Design Analysis for Box-mill Wastewater Treatment Using Anoxic Activated Sludge Process (무산소 활성오니공정을 이용한 판지공장 폐수처리의 동력학적 해석 및 설계분석)

  • Cho, Yong-Duck;Lee, Sang-Wha;Kim, Young-Il
    • Journal of Korean Society of Environmental Engineers
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    • v.28 no.10
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    • pp.1090-1097
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    • 2006
  • The anoxic activated sludge process was applied to the treatment of industrial box-mill wastewater, which exhibited the high removal efficiencies of $90{\sim}94%$$ TCOD_{Mn}$ and $58{\sim}81%$ Color. For the design of industrial anoxic activated sludge process, Monod bio-kinetic coefficients of box-mill wastewater were estimated as follows: $K_{max}$(maximum specific substrate removal rate)=0.52 $day^{-1}$, $K_s$(half saturation constant)=314 mg/L, $K_d$(decay coefficient)=0.274 $day^{-1}$, y(microbial yield coefficient)=0.908 mg/mg, and ${\mu}_{max}$(maximum specific growth rate)=0.472 $day^{-1}$. Space loading factors for the design analysis were practically determined as the values of F/M ratio=$0.043{\sim}0.07$ kg-$TCOD_{Mn}$/kg-SS-day, BOD space loading=$0.18{\sim}0.3$ kg-$TCOD_{Mn}/m^3-day$, and ${\theta}_x=6.8{\sim}26.4$ day when considering the relationship of these loading factors with growth dynamics of microorganisms, the F/M ratio that is inversely proportional to ${\theta}_x$ should be equivalent to ${\mu}_{max}$ in units, but exhibited the significant difference between theses two values. Therefore, it is considered that high safety factors are requested in the design of anoxic activated sludge process that is based on Monod bio-kinetics of microorganism.