• Journal of Welding and Joining
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• v.14 no.4
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• pp.99-108
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• 1996

The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1039-1043
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• 2000

$\alpha$-Si$_3$N$_4$가 20vol% 혼합된 SiC/Si$_3$N$_4$혼합물에서 $\alpha$-SiC의 일부를 SiC whisker로 치환하여 첨가한 후 180$0^{\circ}C$, 25MPa의 압력으로 hot pressing하여 SiC/Si$_3$N$_4$/SiCw 복합체를 제조하였다. SiC whisker의 첨가 함량이 증가할수록 상대밀도, 꺽임강도, 마모 저항성은 감소되었으나, 파괴인성은 크게 향상되었다. $\alpha$-SiC의 일부를 SiC whisker로의 치환은 치밀화를 억제하였으나 파괴인성의 증가는 마모 저항성을 향상시키지 않았다.

• Journal of Powder Materials
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• v.10 no.1
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• pp.57-62
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• 2003

The effect of bedding on the microstructure of $Si_3N_4$ added with ultra-fine SiC was investigated. The bedding and the addition of ultra-fine SiC effectively inhibited grain growth of $Si_3N_4$ matrix grain. The microstructures of the specimens sintered with bedding powder consisted of fine-grains as compared with the specimens sintered without bedding powder. In addition, the grain size and the difference of grain size between the specimens sintered with bedding and without bedding was reduced with increasing SiC content. Some ultra-fine SiC particles were trapped in the $Si_3N_4$ grains growed. The number of SiC particles trapped in the $Si_3N_4$ grains increased with increasing the grain growth. When ultra-fine SiC particles were added in the $Si_3N_4$ ceramics, the strength was improved but the toughness was decreased, which was considered to be resulted from the decrease of the grain size.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.217-217
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• 2009

This paper describes the characteristics of polycrystalline 3C-SiC doubly clamped beam micro resonators. The polycrystalline 3C-SiC doubly clamped beam resonators with 60 ~ 100 ${\mu}m$ lengths, $10\;{\mu}m$ width, and $0.4\;{\mu}m$ thickness were fabricated using a surface micromachining technique. Polycrystalline 3C-SiC micro resonators were actuated by piezoelectric element and their fundamental resonant frequency was measured by a laser vibrometer in vacuum at room temperature. For the 60 ~ 100 ${\mu}m$ long cantilevers, the fundamental frequency appeared at 373.4 ~ 908.1 kHz. The resonant frequencies of doubly clamped beam with lengths were higher than simulated results because of tensile stress. Therefore, polycrystalline 3C-SiC doubly clamped beam micro resonators are suitable for RF MEMS devices and bio/chemical sensor applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.27-27
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• 2010

This paper describes the electrical and optical characteristics of $N_2$ doped porous 3C-SiC films. Average pore diameter is about 30 nm and etched area was increased with $N_2$ doping rate. The mobility was dramatically decreased in porous 3C-SiC. The band gaps of polycrystalline 3C-SiC films and doped porous 3C-SiC were 2.5 eV and 2.7 eV, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.1015-1021
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• 2010

In this study, the effect of the C/SiC composition ratio on the impact damage of a reaction sintered SiC (RS-SiC) plates was evaluated. An impact test was conducted by using an air gun. The impacter used was a steel ball with a diameter of 2 mm, and the impact velocities were 113, 122, and 180 m/s. The RS-SiC plates were $20\times20\times3$ mm with different C/SiC composition ratios. The ring crack diameters damaged by a steel ball were determined using SEM images. It was observed that the maximum diameter increased with increasing impact velocity, and it rapidly changed with increasing C/SiC composition ratio because of the effect of residual Si and the variation flexural strength. Cone cracks were formed in the case of C/SiC composition ratios of 0.4~0.5, this indicated that the impact damage changed from a ring crack to a cone crack in this critical range of C/SiC composition ratios. The C/SiC composition ratio of 0.3 was determined to be the optimal ratio for the RS-SiC manufacturing process.

• Journal of Sensor Science and Technology
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• v.22 no.3
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• pp.175-180
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• 2013

This paper describes the characteristics of cubic silicon carbide (3C-SiC) films grown on a carbonized Si(100) substrate, using hexamethyldisilane (HMDS, $Si_2(CH_3)_6$) as a safe organosilane single precursor in a nonflammable $H_2$/Ar ($H_2$ in Ar) mixture carrier gas by atmospheric pressure chemical vapor deposition (APCVD) at $1280^{\circ}C$. The growth process was performed under various conditions to determine the optimized growth and carbonization condition. Under the optimized condition, grown film has a single crystalline 3C-SiC with well crystallinity, small voids, low residual stress, low carrier concentration, and low RMS. Therefore, the 3C-SiC film on the carbonized Si (100) substrate is suitable to power device and MEMS fields.

• Korean Journal of Materials Research
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• v.10 no.7
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• pp.489-492
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• 2000

Three different white cast irons alloyed with Cr and Si were prepared in order to study their distribution be-havior in matrices and carbides. The specimens were produced using a 15kg-capacity high frequency induction fur-nace. Melts were super-heated to $1600^{\circ}C$, and poured at $1550^{\circ}C$ into a pepset mold. Three combinations of the alloys were selected so as to observe the distribution behavior of Cr and Si : 0.5%C-25.0%Cr-1.0%Si(alloy No. 1), 0.5%C-5.0%Cr-1.0%Si(alloy No. 2) and 2.0%C-5.0%Cr-1.0%Si(alloy No. 3). Cellular $M_7C_3$ carbides-$\delta$ferrite eutectic were developed at $\delta$ferrite liquid interfaces in the alloy No. 1 while only traces of $M_7C_3$ carbides-$\delta$ferrite eutectic were precipitated in the alloy No. 2. With the addition of 2.0% C and 5.0% Cr, ledeburitic $M_3C$ carbides instead of cellular $M_7C_3$ carbides were precipitated in the alloy No. 3. Cr was distributed preferentially to the $M_7C_3$ carbides rather than to the matrix structure while more Si was partitioned in the matrix structure rather than the $M_7C_3$ carbides. $K^m$ for Cr was ranged from 0.56 to 0.68 while that for Si was from 1.12 to 1.28. $K^m$ for Cr had a lower value with increased carbon contents. The mass percent of Cr was higher in the $M_7C_3$ carbides with increased Cr contents.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.78-79
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• 2008

In this paper, poly 3C-SiC thin films were grown on $SiO_2$/Si by atmospheric pressure chemical vapor deposition (APCVD) using HMDS, $H_2$, and Ar gas at $1100^{\circ}C$ for 30 min, respectively. And then, palladium films were deposited on poly 3C-SiC by RF magnetron sputter. Thickness, uniformity, and quality of these samples were performed by SEM. Crystallinity and preferred orientationsof palladium were analyzed by XRD. And Pd/poly 3C-SiC schottky diodes were fabricated and characterized by current-voltage measurements. Its electric current density Js and barrier height voltage were measured as $2\times10^{-3}$ A/$cm^2$, 0.58 eV, respectively. And these devices operated about $350^{\circ}C$. From results, Pd/poly 3C-SiC devices are promising for high temperature hydrogen sensor and applications.

• Journal of the Korean Ceramic Society
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• v.36 no.11
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• pp.1261-1265
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• 1999

Effect of SiC particle size of the densification of Al2O3-SiC composite during pressureless sintering was investigated. Two types of SiC powders having average particle size of 0.15${\mu}{\textrm}{m}$ and 3${\mu}{\textrm}{m}$ were used. Densification rate of the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles was slower than that of the specimen containg 3${\mu}{\textrm}{m}$ SiC particles. Although the relative density of the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles was below 90% of theoretical density after sintering at 155$0^{\circ}C$ the complete closure of open pores occurred. Therefore full densification could be obtained by subsequent HIP. On the other hand in the specimen containing 3${\mu}{\textrm}{m}$ SiC particles the complete closed pore was observed at 95% of theoretical density. Such a fast pore closure in the specimen containing 0.15${\mu}{\textrm}{m}$ SiC particles is likely to occur as a result of dense reaction layer formation on the specimen surface which is attributed to the high reactivity of small size particles with sintering atmosphere.