• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• Journal of the Korean Society of Radiology
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• v.14 no.5
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• pp.695-703
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• 2020

The use of medical devices is increasing due to the development of medical technology. Among medical devices, it is often used in the human body for graft and treatment. Therefore, in medical institutions, various sterilization methods according to the type and material of medical devices are applied to prevent infection. Hydrophosphite (HA) materials are the most popular in bone grafts. We would like to present a sterilization method using Q-switch Nd:YAG laser with high output energy among non-ionizing radiation suitable for small medical devices. In this study, sterilization power was most ideally shown at UV wavelengths of 1.5 W, 266 nm, and 10 pulses. Different wavelength bands; infrared and visible light; showed passive sterilization, and ultraviolet A and C showed differences in sterilization according to the pulse. In laser sterilization were differences that found according to the wavelength bands and pulses.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.104-109
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• 2001

A 355 nm (3.5 eV) neodymium:yttrium aluminum gamet laser, produced by a harmonic generator, was used to create silver metallic particles as seeds for nucleation in photosensitive glass containing Ag+ and Ce3+ ions. The pulse width and frequency of the laser were 8 ns and 10 Hz, respectively. Heat treatment was conducted at 570 C for 1 h, following laser irradiation, to produce crystalline growth, after which a LiAlSi3O8 crystal phase appeared in the laser-irradiated Li2O A1203 SiO2 glass. For the Present study, we compared the effect of laser-induced crystallization on glass crystallization with that of spontaneous crystallization by heat treatment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.5
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• pp.459-462
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• 1999

Recent advances in NLO Borate Crystals for UV Generation are reviewed with the particular emphasis on the technique to improve the life time of UV optics. The laser-damage resistance of CLBO and fused silica surfaces was successfully improved after removing polishing compound by ion beam etching. The polishing compound embedded in the CLBO and fused silica surfaces were to a depth of less than 100nm. We were able to remove polishing compound without degrading the surface condition when the applied ion beam voltage was less than 200 V. The laser-induced surface damage threshold of CLBO was improved up to 15J/$\textrm{cm}^2$(wavelength: 355 nm, pulse width: 0.85 ns)as compared with that of the as-polished surface (11 J/$\textrm{cm}^2$). The laser-induced surface damage of fused silica also increased from 7.5J/$\textrm{cm}^2$ to 15J/$\textrm{cm}^2$. For the irradiation of a 266 nm high-intensity and high-repetition laser light, the surface lifetime of CLBO and fused silica could be more doubled compared with that of the as-polished surface.

• Korean Journal of Optics and Photonics
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• v.34 no.6
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• pp.241-247
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• 2023

We examine the spectral characteristics of laser-induced periodic surface structures (LIPSSs) formed on an amorphous silicon film irradiated by a 355-nm nanosecond laser. A Gaussian beam with a diameter of 196 ㎛ is used to perform a two-dimensional raster scan. The laser's pulse number is varied from 190 to 280, and its intensity is adjusted within 100-130 mJ/cm². LIPSSs with a periodicity of approximately 330 nm form on the surface of the Si film, aligned perpendicular to the laser's polarization. Transmission spectra of the samples show dips around 700 nm for transverse electric polarization and around 500 nm for transverse magnetic polarization. The features are investigated with a one-dimensional-grating model using a rigorous coupled-wave analysis. Simulations confirm that the observed dips are due to the resonant modes, depending on the polarization.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.13-19
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• 2010

Due to the rapid spread of mobile handheld devices, industrial demands for micro-scale holes with a diameter of even smaller than $10{\mu}m$ in sapphire/silicon wafers have been increasing. Holes in sapphire wafers are for heat dissipation from LEDs; and those in silicon wafers for interlayer communication in three-dimensional integrated circuit (IC). We have developed a sapphire wafer driller equipped with a 532nm laser in which a cooling chuck is employed to minimize local heat accumulation in wafer. Through the optimization of process parameters (pulse energy, repetition rate, number of pulses), quality holes with a diameter of $30{\mu}m$ and a depth of $100{\mu}m$ can be drilled at a rate of 30holes/sec. We also have developed a silicon wafer driller equipped with a 355nm laser. It is able to drill quality through-holes of $15{\mu}m$ in diameter and $150{\mu}m$ in depth at a rate of 100holes/sec.

• Bulletin of the Korean Chemical Society
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• v.34 no.4
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• pp.1039-1042
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• 2013

Polyynes were prepared by liquid laser ablation of a graphite target in deionized water at various physical conditions such as laser power (20 and 40 mJ/pulse) and ablation wavelengths (355, 532, and 1064 nm). The effects of physical parameters on the linear carbon chain length were examined by analyzing the densities of polyynes with different carbon numbers ($C_6H_2$, $C_8H_2$, and $C_{10}H_2$) as well as their branching ratios. We concluded the photophysical processes turned out to play a more significant role than thermal ones in the formation of polyynes.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.6
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• pp.89-94
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• 2016

Consumer orientation requires that companies understand consumer needs and produce products that meet their expectations. This study proposes a new additive method that creates a polymer/metal bonding layer and thus can lighten the weight of helmets to develop a consumer-oriented 3D printing helmet. The composite solution is experimentally prepared with copper formate and a photopolymer resin. Stereolithography apparatus and photothermal reactions are introduced to fabricate an adhesive hybrid layer of copper metal and polymer. A UV pulse laser with a 355 nm wavelength was installed to simplify this process. Resistance, adhesion, and accuracy were investigated to evaluate the properties of the layer produced.