• Title/Summary/Keyword: 355nm 펄스 레이저

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A study on the laser ablation of the copper metal foil by 355nm pulse laser (355nm 펄스 레이저를 이용한 구리 박막의 레이저 어블레이션에 대한 연구)

  • Oh J.Y;Shin B.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.667-668
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    • 2006
  • Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

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A Study on Sapphire Wafer Scribing Using Picosecond Pulse laser (피코초 펄스 레이저를 이용한 사파이어 웨이퍼 스크라이빙에 관한 연구)

  • Moon, Jae-Won;Kim, To-Hoon
    • Laser Solutions
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    • v.8 no.2
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    • pp.7-12
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    • 2005
  • The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

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Sterilization Effect by the Nd:YAG Laser pulse (Nd:YAG 레이저 펄스에 따른 멸균효과)

  • Jeong, Kyeonghwan;Jung, Dongkyung;Park, Jeongkyu;Choi, Hyeonwoo;Seo, Jeongmin
    • Journal of the Korean Society of Radiology
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    • v.14 no.5
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    • pp.695-703
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    • 2020
  • The use of medical devices is increasing due to the development of medical technology. Among medical devices, it is often used in the human body for graft and treatment. Therefore, in medical institutions, various sterilization methods according to the type and material of medical devices are applied to prevent infection. Hydrophosphite (HA) materials are the most popular in bone grafts. We would like to present a sterilization method using Q-switch Nd:YAG laser with high output energy among non-ionizing radiation suitable for small medical devices. In this study, sterilization power was most ideally shown at UV wavelengths of 1.5 W, 266 nm, and 10 pulses. Different wavelength bands; infrared and visible light; showed passive sterilization, and ultraviolet A and C showed differences in sterilization according to the pulse. In laser sterilization were differences that found according to the wavelength bands and pulses.

A Study on Fabrication of Hydrophobic Modification on the Surface of Copper using 355nm-Pulsed Laser (355nm 펄스 레이저를 이용한 구리 표면의 소수성 개질에 관한 연구)

  • Yun, Dan Hee;Kang, Bo Seok;Park, Jun Han;Gwak, Cheng Yeol;Shin, Bo Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.101-105
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    • 2016
  • Recently, the hydrophobic surface has been attracted because of the excellent opto-physical properties. Various processing methods such as chemical, mechanical, photolithographic and laser processing are competitively introduced for fabrication of hydrophobic surface of polymer, metal and ceramics. In this paper, we fabricated the hydrophobic surface of copper metal by simple method which irradiated 355 nm UV-pulsed laser in order to shape microgrooves and increased surface roughness through oxidation process at room temperature. Finally the contact angle is dramatically increased by maximum $45^{\circ}$, as a result of oxidation which simply created nanostructures on the microstructures without expensive chemical process.

Study on the Luminescence of Si Nanocrystallites on Si Substrate fabricated by Changing the Wavelength of Pulsed Laser Deposition (펄스레이저 증착법의 레이저 파장변환에 의한 실리콘 나노결정의 발광 특성 연구)

  • 김종훈;전경아;최진백;이상렬
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.4
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    • pp.169-172
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    • 2003
  • Silicon nanocrystalline thin films on p-type (100) silicon substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser with the wavelength of 355, 532, and 1064 nm. The base vacuum in the chamber was down to $10^-6$ Torr and the laser energy densities were 1.0~3.0 J/$\textrm{cm}^2$ After deposition, silicon nanocrystalline thin films have been annealed at nitrogen gas. Strong Blue and green luminescence from silicon nanocrystalline thin films have been observed at room temperature by photoluminescence and its peak energies shift to green when the wavelength is increased from 355 to 1064 nm.

Study on the Luminescence of Si Nanocrystallites on Si Substrate Fabricated by Changing the Wavelength of Pulsed laser deposition (펄스레이저 증착법의 레이저 파장변환에 의한 실리콘 나노결정의 발광특성 연구)

  • Kim, Jong-Hoon;Bae, Sang-Hyuck;Lee, Sang-Yeol
    • Proceedings of the KIEE Conference
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    • 2000.11c
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    • pp.411-412
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    • 2000
  • Si nanocrstallites on p-tyre (100) Si substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser with the wavelength of 355, 532 and 1064 nm. The base vacuum in the chamber was down to $10^{-5}$ Torr and the pressure of the gas during deposition was varied from 1 to 3 Torr. After deposition, Si nanocrystallites have been annealed at $N_2$ gas. Nitrogen have been used as ambient gases. Strong blue and green luminescence from Si nanocrystallites has been observed in room temperature by photoluminescence and its peak energies shift to green when the wavelength is increased from 355-1064 nm

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Computational Analysis of 355 nm UV Laser Single-Pulsed Machining of Copper Material Considering the Strain Rate Effect (변형률 속도 효과를 고려한 355 nm UV 레이저 구리재질의 싱글 펄스 전산해석)

  • Lee, Jung-Han;Oh, Jae Yong;Park, Sang Hu;Shin, Bo Sung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.3
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    • pp.56-61
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    • 2010
  • Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

A Study on the Computational Analysis of 355nm UV Laser Multiple-Pulsed Micro Machining Considering the Strain Rate Effect (변형률 속도 효과를 고려한 355nm UV 레이저 다중 펄스 미세가공의 전산해석에 관한 연구)

  • Lee, Jung-Han;Oh, Jae-Yong;Park, Sang-Hu;Nam, Gi-Jung;Ryu, Gwang-Hyun;Shin, Suk-Hun;Shin, Bo-Sung
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.10
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    • pp.29-33
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    • 2010
  • UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

A study on selective hybrid-structure film fabricated by 355nm UV-pulsed laser processing (355nm UV 레이저를 이용한 선택적 하이브리드 구조 필름의 제작에 관한 연구)

  • Kim, Myung-Ju;Lee, Sang-Jun;Shin, Bo-Sung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.5
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    • pp.2979-2984
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    • 2015
  • This paper has presented a new foaming technology of selective hybrid-structured polymer film with expanded pores. The porous structure of closed pore was firstly fabricated by applying the 355nm UV-pulsed laser to 0.1mm thick film that was uniformly mixed with PP pellets, copper powder, and CBA (Chemical Blowing Agent). In order to expand pore size of closed-cell shape, LAMO(Laser Aided Micro pore Opening) processing was conducted to heat the copper powder, and then the bigger pore size of closed-cell more than existing pore size was successfully formed because of rapid conduction of heated metal powder. From the experimental results, various process parameters such as laser fluence, intensity, scan rate, spot size and density of powder and CBA were considerably considered to reveal the correlation among the pore characteristics. In the future, a function experiment will be carried out to use the hybrid film of industrial applications.