• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.667-668
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• 2006

Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.299-300
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• 2010

• Laser Solutions
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• v.8 no.2
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• Journal of the Korean Society of Radiology
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• v.14 no.5
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• pp.695-703
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• 2020

The use of medical devices is increasing due to the development of medical technology. Among medical devices, it is often used in the human body for graft and treatment. Therefore, in medical institutions, various sterilization methods according to the type and material of medical devices are applied to prevent infection. Hydrophosphite (HA) materials are the most popular in bone grafts. We would like to present a sterilization method using Q-switch Nd:YAG laser with high output energy among non-ionizing radiation suitable for small medical devices. In this study, sterilization power was most ideally shown at UV wavelengths of 1.5 W, 266 nm, and 10 pulses. Different wavelength bands; infrared and visible light; showed passive sterilization, and ultraviolet A and C showed differences in sterilization according to the pulse. In laser sterilization were differences that found according to the wavelength bands and pulses.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.101-105
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• 2016

Recently, the hydrophobic surface has been attracted because of the excellent opto-physical properties. Various processing methods such as chemical, mechanical, photolithographic and laser processing are competitively introduced for fabrication of hydrophobic surface of polymer, metal and ceramics. In this paper, we fabricated the hydrophobic surface of copper metal by simple method which irradiated 355 nm UV-pulsed laser in order to shape microgrooves and increased surface roughness through oxidation process at room temperature. Finally the contact angle is dramatically increased by maximum $45^{\circ}$, as a result of oxidation which simply created nanostructures on the microstructures without expensive chemical process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.4
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• pp.169-172
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• 2003

Silicon nanocrystalline thin films on p-type (100) silicon substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser with the wavelength of 355, 532, and 1064 nm. The base vacuum in the chamber was down to $10^-6$ Torr and the laser energy densities were 1.0~3.0 J/$\textrm{cm}^2$ After deposition, silicon nanocrystalline thin films have been annealed at nitrogen gas. Strong Blue and green luminescence from silicon nanocrystalline thin films have been observed at room temperature by photoluminescence and its peak energies shift to green when the wavelength is increased from 355 to 1064 nm.

• Proceedings of the KIEE Conference
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• 2000.11c
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• pp.411-412
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• 2000

Si nanocrstallites on p-tyre (100) Si substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser with the wavelength of 355, 532 and 1064 nm. The base vacuum in the chamber was down to $10^{-5}$ Torr and the pressure of the gas during deposition was varied from 1 to 3 Torr. After deposition, Si nanocrystallites have been annealed at $N_2$ gas. Nitrogen have been used as ambient gases. Strong blue and green luminescence from Si nanocrystallites has been observed in room temperature by photoluminescence and its peak energies shift to green when the wavelength is increased from 355-1064 nm

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.5
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• pp.2979-2984
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• 2015

This paper has presented a new foaming technology of selective hybrid-structured polymer film with expanded pores. The porous structure of closed pore was firstly fabricated by applying the 355nm UV-pulsed laser to 0.1mm thick film that was uniformly mixed with PP pellets, copper powder, and CBA (Chemical Blowing Agent). In order to expand pore size of closed-cell shape, LAMO(Laser Aided Micro pore Opening) processing was conducted to heat the copper powder, and then the bigger pore size of closed-cell more than existing pore size was successfully formed because of rapid conduction of heated metal powder. From the experimental results, various process parameters such as laser fluence, intensity, scan rate, spot size and density of powder and CBA were considerably considered to reveal the correlation among the pore characteristics. In the future, a function experiment will be carried out to use the hybrid film of industrial applications.