• Journal of the Korea Society for Simulation
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• v.15 no.2
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• pp.51-57
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• 2006

Production environment of semiconductor industry is shifting from 200mm wafer process to 300mm wafer process. In the new era of semiconductor industry, FAB (fabrication) Line Automation is a key issue that semiconductor industry is facing in shifting from 200mm wafer fabrication to 300mm wafer fabrication. In addition, since the semiconductor manufacturing technologies are being widely spread and market competitions are being stiffened, cost-down techniques became basis of growth. Most companies are trying to reduce average cycle time to increase productivity and delivery time. In this paper, we simulated 300mm wafer fabrication semiconductor manufacturing process by laying great emphasis on reduce average cycle time.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.1
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• pp.21-28
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• 2017

Indirect evaporative cooling, which utilizes a cooling effect obtained by the evaporation of water, is energy-effective compared to the conventional vapor compression method. It is also eco-friendly, due to the non-usage of CFC refrigerant. In this study, three indirect evaporative cooler samples of the cross flow type(size: $300mm{\times}300mm{\times}300mm$, channel pitch: $5mm{\times}5mm$, $5mm{\times}7mm$, $7mm{\times}7mm$) were made using plastic/paper composites. Tests were conducted to measure indirect evaporative efficiencies and pressure drops. Results showed that the efficiency was the highest for the $5mm{\times}5mm$ sample, owing to the largest surface area. The saved electrical energy was also the greatest for that sample. The pressure drop of the wet channel was larger than that of the dry channel as expected. A theoretical model was proposed, which underestimated both the indirect evaporation efficiency and the pressure drop.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.56.1-56
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• 2002

$\textbullet$ Introduction $\textbullet$ Constitution and equipment of AMHS $\textbullet$ Discussion about Using Stocker $\textbullet$ Ahead developed 300mm stockers $\textbullet$ 300mm Stocker Solution-Modular Stocker $\textbullet$ Conclusion

• Journal of the Korea Institute of Building Construction
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• v.14 no.3
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• pp.223-229
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• 2014

In this study, the fire resistance of high strength concrete with organic fibers and polymer powder (PW) was investigated. Two types of the specimens of ${\phi}100{\times}200mm$ and $300{\times}300{\times}600mm$ sizes were prepared. As a result of the test, it was found that the fiber-to-PW mixing ratio of 1:1 achieved the highest fluidity. Further, it was found that the mixing ratios of PP 0.05% + PW 0.05%, PNY 0.05% + PW 0.05% was sufficient to protect the high strength concrete from spalling. For the mock-up specimens of $300{\times}300{\times}600mm$ size, if the required amounts of fibers were added in the concrete. the concrete spalling was resisted. Likewise, in the case of the polymix (PM) together with PW, all the tested specimens were satisfactory for fire resistance performance.

• Journal of the Korean Wood Science and Technology
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• v.39 no.2
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• pp.132-139
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• 2011

This study examined the characteristics of radio-frequency/vacuum dried Korean red pine ($Pinus$ $densoflora$) heavy timbers with 250 ${\times}$ 250 mm (S), 300 ${\times}$ 300 mm (L) in cross section and 300 mm in diameter, and 3,600 mm in length, which were subjected to compressive loading after a kerf pretreatment. The following results were obtained : The drying time was short and the drying rate was high in spite of the large cross section of specimens. The moisture gradient inall specimens was gentle in both longitudinal and transverse directions owing to dielectric heating. The shrinkage of the width in the direction perpendicular to was 21 percent ~ 76 percent of that of the thickness of square timbers in the direction parallel to the mechanical pressure. The casehardening for all specimens was very slight because of significantly reduced ratio of the tangential to radial shrinkage of specimens and kerfing. The surface checks somewhat severely occurred although the occurrence extent of the surface checks on the kerfed specimens was slight compared withthat on the control specimen.

• Journal of the Korean Institute of Gas
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• v.10 no.2 s.31
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• pp.61-67
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• 2006

We developed the ultrasonic phased array technique for obtaining ultrasonic images of electrofusion joints of polyethylene piping. And we inspected 4 cases at fields with this technique. First case is for the 300 mm diameter polyethylene electrofusion joint by using 3.5 MHz phased array sensor, second is for the 350 mm diameter saddle electrofusion joint, third is for the 400 mm diameter electrofusion joints and the last one is for the 400 mm diameter piping joints which will be used at 300 kPa suppling pressure.

• Journal of Korean Society for Geospatial Information Science
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• v.22 no.4
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• pp.71-80
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• 2014

This study predicted damage areas due to landslides in Gangwon Province and estimated the scale of damage to roads, buildings, and forests on the local government level. By using old research findings to predict landslides, the study established techniques to make maps for landslide vulnerability, occurrence possibility, and risk. The scale of damage to roads, buildings, and forests was estimated at the local government level by making a landslide risk map for 100mm, 200mm, and 300mm of accumulated rainfall. The scale of damage to roads, buildings, and forests was estimated to be greatest in Hongcheon-gun, Jeongseon-gun, and Hongcheon-gun, respectively, in case of 100mm~200mm accumulated rainfall, in Chuncheon City, Pyeongchang-gun, and Hongcheon-gun, respectively, in case of 200mm~300mm accumulated rainfall, and in Hongcheon-gun in case of 300mm accumulated rainfall or more. Those estimation results of scale of damage by landslides at the local government level will help to set priorities in landslide prevention and provide basic data for budget decisions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.112-112
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• 2011

300 mm 웨이퍼용 도핑장치에서 2 MHz 유도결합 플라즈마와 8 kHz의 기판 바이폴라 펄스 바이어스에 의한 플라즈마에 대해 수치 계산이 수행되었다. 한 주기에서 0, -500, +100 V의 Pulse duration동안 기판 전체에 100, 500, 150 eV 부근의 이온 입사 에너지 분포를 보였으며, 이에 따라 기판 가장자리에서의 이온 입사 각도는 -30~+$30^{\circ}$ 사이에서 변화함으로서 도핑 불균일에 대한 원인을 확인하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.155-155
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• 2011

Dual coil을 사용하는 상용 AMAT DPS II 300 mm Centura 장비의 antenna의 전류비를 조절하여 $SiO_2$의 식각 균일도를 평가하였다. Inner turn과 outer turn의 흐르는 전류비를 분배 capacitor로 조절하여 16.9 %의 이온 전류 밀도 분포를 확인하였고, 투입 전력에 따라 200 W에서 12 %, 800 W에서 9 %로 점차 감소하는 경향을 확인하였다. 이때 300 mm wafer의 반지름 방향으로의 식각 균일도는 3 %로 측정되었고, FRC (flow ratio control)는 0.5에서 가장 균일한 결과를 얻었다.