• 제어로봇시스템학회:학술대회논문집
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• 1987.10a
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• pp.786-790
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• 1987

This paper describes a systein which enables a fast 3 -dimensional profile measurement using a slit-ray projection method. One distinctive feature of this system is that a real-time video is processor is employed in order to reduce the amount of image data to be processed without eliminating essential information. Experimental results show that a calibrating method presented for the TV camera and the slit-ray projector is convenient and enables sufficient accurate measurements.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.7 s.166
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• pp.1129-1138
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• 1999

[$Moir\acute{e}$] technique is now being extensively investigated as a fast non-contact means of three-dimensional profile measurement especially for reverse engineering. One problem with $moir\acute{e}$ technique is so called $2\pi$-ambiguity problem that limits the maximum step height difference between two neighboring sampling points to be less than half the equivalent wavelength of $moir\acute{e}$ fringes. In this investigation, a new two-wavelength scheme of projection $moir\acute{e}$ topography is proposed and tested to cope with the $2\pi$-ambiguity problem. Experimental results are discussed to assess the new method in measuring large objects with high step discontinuities.

• Korean Journal of Computational Design and Engineering
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• v.17 no.3
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• pp.156-163
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• 2012

Real-time three-dimensional shape measurement is becoming increasingly important in various fields, including medical sciences, high-technology industry, and microscale measurements. However, there are not so many 3D profile tools specially designed for specifically narrow space, for example, to scan the tooth shape of a human jaw. In this paper, a real-time 3D intraoral scanner is proposed for the measurement of tooth profile in the mouth cavity. The proposed system comprises a laser diode beam, a micro charge-coupled device, a graticule, a piezoelectric transducer, a set of optical lenses, and a polhemus device sensor. The phase-shifting technique is used along with an accurate calibration method for the measurement of the tooth profile. Experimental and theoretical inspection of the phase-to-coordinate relation is presented. In addition, a nonlinear system model is developed for collimating illumination that gives the more accurate mathematical representation of the system, thus improves the shape measurement accuracy. Experiment results are presented to verify the feasibility and performance of the developed system. The experimental results indicate that overall measurement error accuracy can be controlled within 0.4 mm with a variability of ${\pm}0.01$.

• Applied Microscopy
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• v.42 no.3
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• pp.158-163
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• 2012

Detailed comparison of low-voltage scanning electron microscopy and electron holography techniques for two-dimensional (2D) dopant profiling was carried out with using the same multilayered p-n junction specimen. The dopant profiles obtained from two methods are in good agreement with each other. It demonstrates that reliability of dopant profile measurement can be increased through precise comparison of 2D profiles obtained from various microscopic techniques.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.3
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• pp.208-219
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• 2002

A novel measurement method to obtain the 6-DOF motions of arbitrary rigid bodies is proposed in this paper. The method adopts a specially fabricated mirror called 3-facet mirror, which looks like a triangular pyramid haying an equilateral cross-sectional shape. The mirror is mounted on the objects to be measured, illuminated by a laser beam having circular profile, and reflects the laser beam in three different directions. Three PSDs(position sensitive detector) detect the three beams reflected by the mirror, respectively. From the signals of the PSDs, we can calculate the 3-dimensional position and orientation of the 3-facet mirror, and thus enabling us to determine the 3-dimensional position and orientation of the objects. In this paper, we model the relationship between the 3-dimensional position and orientation of an object in motion and the outputs of three PSDs. A series of experiments are performed to demonstrate the effectiveness and accuracy of the proposed method. The experimental results show that the proposed sensing system can be an effective means of obtaining 3-dimensional position and orientation of arbitrary objects and provide resonable measurement accuracy.

• Korean Journal of Optics and Photonics
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• v.14 no.5
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• pp.504-508
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• 2003

We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2${\times}$l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 ${\mu}{\textrm}{m}$ with a standard deviation of 1.5 ${\mu}{\textrm}{m}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.6
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• pp.1743-1752
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• 1996

In this paper, a precision inspection technique using CAD/CAI integration is proposed for the parts having very thin and sharp 3 dimensional curve features. The technique begings with feature reconstruction of turbine blades which have 3 dimensional combined feometry, such as splines, and thin circles. The alifnment procedures consistsb of two phases-rough and fine phases : rough phase alignment is based on the conventional 6 point5s probing on the clear cut surfacef, and fine phase alignment is based on the intial measurement on the 3 dimensional curved parts using an lterative measurement feed-back least sequares technique for alignment. Forf the analysis of profile tolerance of parts, the actual measured points are obtained by finding the closet points on the CAD geometry by the developed subdivision technique and the Tschebycheff norm is applied based on iterative fashion, giving accurate profile tolerance value. The developed inspection technique is applied to practical procedures of blade manufacturing and demonstrated high performance.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.19 no.2
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• pp.75-83
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• 2023

For three-dimensional finite element welding residual stress simulation, several methods are available. Two widely used methods are the moving heat source model using heat flux and the temperature boundary condition model using the temperature profile of the welded beads. However, each model has pros and cons in terms of calculation times and difficulties in determining welding parameters. In this paper, a new method using the moving temperature profile model is proposed to perform efficiently 3-D FE welding residual stress analysis for large structures. Comparison with existing experimental residual stress measurement data of two-pass welding pipe and SNL(Sandia National Laboratories) mock-up canister shows the accuracy and efficiency of the proposed method.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.9
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• pp.22-29
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• 1997

This paper describes a three dimensional profile measurement method for sheet metal products which have flexible and porous sculptured surfaces. Shadow masks are used as measuring objects for practical implementation or this study. The shadow masks are located inside the fluorescent glasses of monitors for televisions or computers and used to prevent electron guns from interfering between pixels. Three dimen- sional surface profiles are measured by adopting a software autofocusing technique to capture focused images. The experimental results show that the method is very effecive and suitable for sheet meal prod- ucts with flexible and porous surfaces.

• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.531-537
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• 2014

Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.