• Design & Manufacturing
• /
• v.17 no.3
• /
• pp.34-40
• /
• 2023

In this study, real-time collection of mold vibration signals during injection molding processes was achieved through IoT devices installed on the mold surface. To analyze changes in the collected vibration signals, injection molding was performed under six different process conditions. Analysis of the mold vibration signals according to process conditions revealed distinct trends and patterns. Based on this result, cosine similarity was applied to compare pattern changes in the mold vibration signals. The similarity in time and acceleration vector space between the collected data was analyzed. The results showed that under identical conditions for all six process settings, the cosine similarity remained around 0.92±0.07. However, when different process conditions were applied, the cosine similarity decreased to the range of 0.47±0.07. Based on these results, a cosine similarity threshold of 0.60~0.70 was established. When applied to the analysis of mold vibration signals, it was possible to determine whether the molding process was stable or whether variations had occurred due to changes in process conditions. This establishes the potential use of cosine similarity based on mold vibration signals in future applications for real-time monitoring of molding process changes and anomaly detection.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.4
• /
• pp.41-47
• /
• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.22 no.4
• /
• pp.67-72
• /
• 2022

This study presents the design of power amplifier (PA) in 60 nm GaN/Si HEMT technology. A customized transistor model enables the designing circuits operating at W-band. The all matching network of the PA was composed of equivalent transformer circuit to reduce matching loss. And then, equivalent transformer is several advantages without any additional inductive devices so that a wideband power characteristic can be achieved. The designed die area is 3900 ㎛ × 2300 ㎛. The designed results at center frequency achieved the small signal gain of 15.9 dB, the saturated output power (Psat) of 29.9 dBm, and the power added efficiency (PAE) of 24.2% at the supply voltage of 12 V.

• Design & Manufacturing
• /
• v.17 no.1
• /
• pp.48-55
• /
• 2023

In this study, on the structure simulation for manufacturing a high strength/light weight 48V battery housing for a mild hybrid vehicle was conducted. Compression analysis was performed in accordance with the international safety standards(ECE R100) for existing battery housings. The effect of plastic materials on compressive strength was analyzed. Three models of truss, honeycomb and grid rib for the battery housing were designed and the strength characteristics of the proposed models were analyzed through nonlinear buckling analysis. The effects of the previous existing rib, double-sided grid rib, double-sided honeycomb rib and double-sided grid rib with a subtractive draft for the upper cover on the compressive strength in each axial direction were examined. It was confirmed that the truss rib reinforcement of the battery housing was very effective compared to the existing model and it was also confirmed that the rib of the upper cover had no significant effect. In the results of individual 3-axis compression analysis, the compression load in the lateral long axis direction was the least and this result was found to be very important to achieve the overall goal in designing the battery housing. To reduce the weight of the presented battery housing model, the cell molding method was applied. It was confirmed that it was very effective in reducing injection pressure, clamping force and weight.

• Design & Manufacturing
• /
• v.13 no.2
• /
• pp.30-36
• /
• 2019

Traditional cell culture(2-dimensional) is the method that provide a nutrient and environment on a flat surface to cultivate cells into a single layer. Since the cell characteristics of 2D culture method is different from the characteristics of the cells cultured in the body, attempts to cultivate the cells in an environment similar to the body environment are actively proceeding in the industry, academy, and research institutes. In this study, we will develop a technology to fabricate micro-structures capable of culturing cells on surfaces with various curvatures, surface shapes, and characteristics. In order to fabricate the hemispheric plastic structure(thickness $50{\mu}m$), plastic preform mold (hereinafter as "preform mold") corresponding to the hemisphere was first prepared by injection molding in order to fabricate a two - layer structure to be combined with a flat plastic film. Then, thermoplastic polymer dissolved in an organic solvent was solidified on a preform mold. As a preliminary study, we proposed injection molding conditions that can minimize X/Y/Z axis deflection value. The effects of the following conditions on the preform mold were analyzed through injection molding CAE, [(1) coolant inlet temperature, (2) injection time, (3) packing pressure, (4) volume-pressure (V/P). As a result, the injection molding process conditions (cooling water inlet temperature, injection time, holding pressure condition (V / P conversion point and holding pressure size)) which can minimize the deformation amount of the preform mold were derived through CAE without applying the experimental design method. Also, the derived injection molding process conditions were applied during actual injection molding and the degree of deformation of the formed preform mold was compared with the analysis results. It is expected that plastic film having various shapes in addition to hemispherical shape using the preform mold produced through this study will be useful for the molding preform molding technology and cast molding technology.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.42 no.5 s.305
• /
• pp.43-50
• /
• 2005

This paper describes some IC(integrated circuits) design and implementation techniques of low power multi-band Gm-C bandpass filter for body composition analyzer. Proposed BPF(bandpass filter) can be selected from three bands(20 KHz, 50 KHz, 100 KHz) by control signal. To minimize die area, a simple center frequency tuning scheme is used. And to reduce power consumption, operational transconductance amplifier operated in the sub-threshold region is adopted. The proposed BPF is implemented with 0.35 um 2-poly 3-metal standard CMOS technology Chip area is $626.42um\;{\times}\;475.8um$ and power consumption is 700 nW@100 KHz.

• Transactions of Materials Processing
• /
• v.18 no.2
• /
• pp.150-155
• /
• 2009

A shaft for laser printers has to be produced with high dimensional accuracy of a few micrometers. Most companies produce the shaft, therefore, by machining. These days, forging process is tried to be employed in manufacturing the shaft for productivity. In this study, the dimensional inaccuracy of straightness is studied and the underfill is not focused because the shaft shape is simple and the load capacity of press is sufficient. The straightness and concentricity of the shaft is important for the operation of a laser printer. Many design parameters such as preform shapes, tooling dimensions, forging load, and billet geometries may affect on the dimensional accuracy. In the forging process of shafts, a billet which is cut from wires is used. The billet, therefore, may be a little bit curved but not always straight. The elastic recovery is considered to cause the dimensional inaccuracy. Therefore, the effect of the forging load on the elastic recovery and straightness is investigated through the finite element analyses using DEFORM-3D and ABAQUS.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.735-739
• /
• 2001

This paper describes a research work of developing computer-aided design of a product with bending and piercing for progressive working. An approach to the system for progressive working os based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theorise, experimental results and the empirical knowledge of field experts. the system has been written in AutoLISP on the AutoCAD with a personal computer and is composed of three main modules, which are input and shape treatment, flat pattern layout and strip layout modules. Strip layout of the system is designed by using fuzzy set theory. Process planning is determinated by fuzzy value according to several rules. Strip layout drawing generated in strip layout module is presented in 3-D graphic forms, including bending sequences and piercing processes with punch profiles divided into for external area. Results obtained using the modules enable the manufacturer for progressive working of electric products to be more efficient in this field.

• Transactions of Materials Processing
• /
• v.14 no.2 s.74
• /
• pp.160-167
• /
• 2005

In the present study about extru-bending of angle product, the bending of extruded angle products with the $'\Lambda'$ section and 'ㄱ', section can be obtained using two extrusion billets by the hot metal extru-bending machine with the two punches moving in the different velocity. The bending curvature can be controlled by the different velocity of billets through the two-hole container. This paper describes simulations and experiments of extru-bending process that can make bending during extruding by the difference of stem velocities. And they are applied to two kinds of dies, that is, one of them is conical dies with symmetry $'\Lambda'$ section and the other one is conical dies with asymmetry 'ㄱ' section. The results of the forming simulation by $DEFORM^{TM}-3D$ and results of experiments show that the bending phenomenon at the die exit during extrusion can be obtained with two extrusion billet by the two stems moving in the different velocity. And it was known that it is possible to design the structure of conical cavity of extrusion dies and to control the curvature of product through the simulation and experiment of extru-bending process.

• Journal of Applied Reliability
• /
• v.7 no.1
• /
• pp.23-29
• /
• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.