• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.150-150
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• 2004

현재의 핫 엠보싱 기술은 나노/마이크로 패턴의 복제 기술로 다방면에서 연구되어지고 있다. 기존에 알려진 핫 엠보싱 기술은 하드 몰드를 사용하여 열과 압력을 가해서 PR 패턴 제작이나 나노/마이크로 구조물을 제작하였다. 그러나 이러한 하드 몰드의 사용은 3차원 구조물을 구현할 수 없다는 단점이 있다. 이에 본 연구에서는 하드 몰드 대신 소프트 몰드를 사용하여 3차원 미세 구조물을 구현해 보고자 한다.(중략)

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1805-1810
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• 2010

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

• Journal of the KSME
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• v.57 no.1
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• pp.42-45
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• 2017

이 글에서는 레이저 기반 포토리소그래피 공정에 대해서 소개하고, 최근 각광받고 있는 3차원 레이저 포토리소그래피 시스템 및 이를 이용한 마이크로 스케일의 3차원 구조물 제작 방법과 응용에 대해 소개하고자 한다.

• Journal of the KSME
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• v.50 no.1
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• pp.32-36
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• 2010

이 글에서는 전형적인 포토리소그래피 공정을 변형 적용하여 다양한 모양의 3차원 감광막 구조물을 형성할 수 있는, 다중노광 단일현상 고정, 다중코팅 단일노광 공정, 디퓨저 리소 그래피 공정, 리플로 공정 등 네 가지 기술을 소개한다.

• Optical Science and Technology
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• v.20 no.3
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• pp.6-9
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• 2016

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1164-1166
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• 1999

본 연구에서는 3차원 회전체 구조물을 제조하기 위해 회전노광장치를 설계하여 제작하고 마이크로렌즈 제작용 X-선 마스크와 PMMA 기판을 정밀하게 회전시켜 노광함으로써 3차원의 마이크로렌즈를 제작하였다. 제작된 마이크로렌즈의 크기는 직경이 $50{\sim}700{\mu}m$이었고, 또한 이러한 방법으로 원통형 렌즈, 계란형 렌즈 등을 제작함으로써 X-선 사진식각공정으로 정밀도가 높은 다양한 3차원의 회전체 구조물을 제조하는 방법을 제시하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.68-72
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• 2003

In this paper, we developed a new thick photoresist fabrication technology for 3-dimensional microstructures. In general, like as AZ photoresist was coated with thin film thickness about 1 $\mu\textrm{m}$ to 30 $\mu\textrm{m}$, but photoresist like SU-8 has thickness of several tens $\mu\textrm{m}$ or more and high aspect ratio. When we fabricate a microstructure using the thick photoresist like SU-8, cracks on the SU-8 thick photoresist are appeared by stress which was caused by sudden cooling down during bake of the thick photoresist spun on wafer. Thus, it was hard to fabricate the microstructure using the thick photoresist for electroplating. In this paper, we developed a new process to produce a 3-dimensional microstructure without the crack by stress through a suitable thick photoresist coating, time control of cool down and time control of PEB (Post Expose Bake).

• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.238-242
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• 2002

본 논문에서는 3차원 마이크로구조물을 위한 새로운 Thick Photoresist(TPR) 공정 기술을 개발하였다. 일반적으로 Thin Photoresist는 얇은 두께로 코팅을 할 수 있다. 그러나 SU-8과 같은 TRP은 몇 십 ㎛ 또는 그 이상으로 코팅이 가능하고 높은 종횡비를 얻을 수 있다. SU-8과 같은 TPR을 사용하여 마이크로구조물을 제작할 때 TPR의 crack들은 bake시의 갑작스런 tool down에 의한 stress에 의해 나타나는데, 이러한 crack들은 마이크로구조물의 도금을 어렵게 만든다. 본 논문에서는 TPR의 코팅, baking 시간 조절, cool down과 PEB(Post Expose Sake) 시간 조절을 통하여 stress에 의해 발생되는 crack이 없는 3차원 마이크로구조물을 제작할 수 있는 새로운 공정 기술을 개발하였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.4
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• pp.301-307
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• 2015

The diameter of a proton beam emanating from the MC-50 cyclotron is about 2-3 mm with Gaussian distribution. This widely irradiated proton beam is not suitable for semiconductor etching, precise positioning, and micromachining, which require a small spot. In this study, a beam cutting method using a microhole is proposed as an economical alternative. We produced a microhole with aspect ratio, average diameter, and thickness of 428, $21{\mu}m$, and 9 mm, respectively, for cutting the proton beam. By using this high-aspect-ratio microhole, we conducted machinability tests on microstructures with sizes of tens of ${\mu}m$. Additionally, the results of simulation using GEANT4 and those of the actual experiment were compared and analyzed. The outcome confirmed the possibility of implementing a micro process technology for the fabrication of three-dimensional microstructures of 20 micron units using the MC-50 cyclotron with the microhole.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.4
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• pp.409-417
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• 2014

To prevent the occurrence of fractures in metal structures, it is very important to evaluate the 3D crack growth process in those structures and any related parts. In this study, tension tests and two simulations, namely, Simulation-I and Simulation-II, were performed using XFEM to evaluate crack growth in three dimensions. In the tension test, Mode I crack growth was observed for a notched metal specimen. In Simulation-I, a 3D reconstructed model of the specimen was created using CT images of the specimen. Using this model, an FE model was constructed, and crack growth was simulated using XFEM. In Simulation-II, an ideal notch FE model of the same geometric size as the actual specimen was created and then used for simulation. Obtained crack growth simulation results were then compared. Crack growth in the metal specimen was evaluated in three dimensions. It was shown that modeling the real shape of a structure with a crack may be essential for accurately evaluating 3D crack growth.