• Solar Energy
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• v.5 no.2
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• pp.70-76
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• 1985

The study aims at providing the methodology for planning and designing of passive solar systems. The computer softwares for the optimization of passive solar systems and insulation level of passive solar houses are developed. The computer software package was generated for various residential buildings under Korean weather condition.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.2
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• pp.108-114
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• 2016

This paper presents a 2.6 GHz Doherty power amplifier IC to enhance the back-off efficiency. In order to apply to small-cell base stations, the Doherty power amplifier was fabricated using GaN-HEMT process for high power density. In addition, the implemented Doherty power amplifier was mounted on a QFN package. The implemented GaN-HEMT Doherty power amplifier was measured using LTE downlink signal with 10 MHz bandwidth and 6.5 dB PAPR for verification. A power gain of 15.8 dB, a drain efficiency of 43.0 %, and an ACLR of -30.0 dBc were obtained at an average output power level of 33.9 dBm.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• International conference on construction engineering and project management
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• 2015.10a
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• pp.147-149
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• 2015

A nuclear power plant construction project normally involves a large construction work of which the total project cost is over 5 trillion Won, Such a large-scale construction project has the risks of schedule delay and quality degradation due to increase in project cost, because designs are changed due to design errors. The reasons for design changes during installation are 1) insufficient engineering capability of the owner, 2) information discontinuance due to the multiple package method, and 3) inefficient constructability review processes. Accordingly, this study proposes, through problem analysis, a method of developing a constructability review system that utilizes constructability review processes and a data-based technology (3D modeling) that are optimized for nuclear power plant construction projects. It also presents a method of establishing a system for reviewing constructability in which constructability review processes and a Database (3D model, Schedule, Design change Items) are linked each other.

• Korean Journal of Optics and Photonics
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• v.5 no.3
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• pp.423-430
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• 1994

We designed and fabricated the single mode fiber pigtailed DFB-LD module for 2.5 Gbps optical communication system. In the design of the DFB-LD module, we made the module divided into two parts of inner sub-module and outer 14-pin butterfly package and cylindrical shaped sub-module contain quasi confocal 2 lens system including optical isolator and electrical connection between these parts via hybrid substrate of bias T circuit. Laser welding was used to assemble the sub-module which requires accurate fixing between optical elements. The fabricated DFB-LD module showed optical coupling efficiency of 20% and - 3 dB small signal response of more than 2.6 GHz. We confirmed mechanical reliability of the module by temperature cycle test where the tested module exhibit optical power fluctuation of less than 10%. Finally we evaluated the performance of the fabricated DFB-LD module as light source of 2.5 Gbps optical communication system, sensitivity of - 30.2 dBm was obtained through 47 km optical fiber transmission under the criterion of $1\times10^{-10}$ BER and transmission penalties were 1.5 dB caused by extinction ratio and 1.0 dB caused by chromatic dispersion of normal single mode fiber. fiber.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.1-12
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• 1998

We have implemented receiver for a 3 Dimensional Phased-Array Radar detecting the azimuth angle, the altitude, the range of a target on real time. This system consists of high frequency module, which protects receiver and controls sensitivity, intermediate frequency module, monopulse detector, IQ phase detector, AGC controller. A two-channel receiver with same function is implemented for increasing accuracy of target altitude data by amplitude comparison monopulse method. The TSS sensitivity of the receiver is -98dBm. The bandwidth of the receiver is 500 MHz. We can control the system gain manually by 100 dB when be AGC off. The gain and phase unbalance of two channels is 5 dB and 30 degree, respectively. The image rejection rate of the IQ detector is 30 dB. We used duroid substrate and package- type device.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.1
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• pp.19-24
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• 2014

In this work, a compact patch antenna based on a low temperature cofired ceramic (LTCC) has been presented for V-band system-on-package (SoP) applications. In order to integrate it with transceiver block, a waveguide (W/G) to embedded microstrip line (eMSL) vertical transition was designed using slot-fed double stacked patch antennas for easy assembly and wide bandwidth. The $2{\times}2$ patch antenna integrating the transition was designed and fabricated in the 5-layer LTCC dielectrics. The whole size of the fabricated antenna including the $2{\times}2$ patches, transition and W/G was $20{\times}24{\times}5.39mm^3$. The fabricated antenna has achieved a 10 dB impedance bandwidth of 2.45 GHz from 61 to 63.45 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.5
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• pp.336-343
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• 2018

We herein present the design and fabrication of a Rx core chip operating in the X-band (10.5~13 GHz) using Win's commercial $0.25-{\mu}m$ GaAs pHEMT process technology. The X-band core chip comprises a low-noise amplifier, a four-bit phase shifter, and a serial-to-parallel data converter. The size is $1.75mm{\times}1.75mm$, which is the state-of-the-art size. The gain and noise figure are more than 10 dB but less than 2 dB, and both the input and output return losses are less than 10 dB. The RMS phase error is less than $5^{\circ}$, and the P1dB is 2 dBm at 12.5 GHz, the performance of which is equivalent to other GaAs core chips. The fabricated core chip was packaged in a QFN package type with a size of $3mm{\times}3mm$ for the convenience of assembly. We confirmed that the performance of the packaged core chip was almost the same as that of the chip itself.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.447-450
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• 2002

The purpose of this 3-D numerical simulation is to calculate and examine a 500 kW Horizontal Axis Wind Turbine (HAWT) power performance and 3-D rotor flow characteristics, which are compared to calculation data from Delft University. The experimental approach, which has been the main method of investigation, appears to be reaching its limits, the cost increasing relate with the size of wind turbines. Hence, the use of Computational Fluid Dynamics (CFD) techniques and Navier-Stokes solvers is considered a very serious contender. We has used the CFD software package CFX-TASCflow as a modeling tool to predict the power performance and 3-D flow characteristics of a wind turbine on the basis of its geometry and operating data. The wind turbine with 40m diameters rotor, it was scaled to compare with the calculation data from delft university. The HAWT, which has eight-rpm variations are investigated respectively. The pitch angle is $+0.5^{\circ}$and wind speed is fixed at 5m/s. The tip speed ratio (TSR) of the HAWT ranging from 2.89 to 9.63.