• ETRI Journal
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• v.29 no.4
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• pp.421-429
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• 2007

This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

• Advances in concrete construction
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• v.13 no.1
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• pp.45-69
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• 2022

This paper investigates the shear behavior of reinforced concrete haunched beams (RCHBs) without stirrups. The research objective is to study the effectiveness of the ideal steel fiber (SF) ratio, which is used to resist shear strength, besides the influence of main steel reinforcement, compressive strength, and inclination angles of the haunched beam. The modeling and analysis were carried out by Finite Element Method (FE) based on a software package, called Atena-GiD 3D. The program of this study comprises two-part. One of them consists of nine results of experimental SF RCHBs which are used to identify the accuracy of FE models. The other part comprises 81 FE models, which are divided into three groups. Each group differed from another group by the area of main steel reinforcement (A_s) which are 226, 339, and 509 mm². The other parameters which are considered in each group in the same quantities to study the effectiveness of them, were steel fiber volumetric ratios (0.0, 0.5, and 1.0)%, compressive strength (20.0, 40.0, 60.0) MPa, and the inclination angle of haunched beam (0.0°, 10.0°, and 15.0°). Moreover, the parametric analysis was carried out on SF RCHBs to clarify the effectiveness of each parameter on the mechanical behavior of SF RCHBs. The results show that the correlation coefficient (R²) between shear load capacities of FE proposed models and shear load capacities of experimental SF RCHBs is 0.9793, while the effective inclination angle of the haunched beam is 10° which contributes to resisting shear strength, besides the ideal ratio of steel fibers is 1% when the compressive strength of SF RCHBs is more than 20 MPa.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Asian-Australasian Journal of Animal Sciences
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• v.22 no.3
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• pp.428-432
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• 2009

40 goat kid ribcages were held for 7 days in storage conditions ($4^{\circ}C$) and used to determine the effects of three different packaging methods (atmospheric air, vacuum and modified atmosphere package (MAP) 10:70:20 mixture of $N_2:O_2:CO_2$) on meat quality of the chops. L* was affected by the packaging method being lighter than MAP chops. The coordinate a* significantly increased during storage time. For MAP-packed chops and those kept in atmospheric air, b* increased markedly during storage time whereas it remained unaffected throughout storage when in vacuum packages. Final pH values ranged from 5.6 to 5.8 and no effects were found for either storage time or packaging method. WHC means were lowest for the three packaging methods on day 7 of storage and highest on day 1. Storage time increased water loss in vacuum treatments. Trained panel colour acceptability was lower at 3, 5 and 7 days than on day 1 of storage for atmospheric air treatment and vacuum packaging, while for the MAP treatment average values on days 5 and 7 were lower than those observed on days 1 or 3. Trained panel odour was lower for atmospheric air and vacuum packages at 3, 5, and 7 days storage than at 1 day, while no differences were found in trained panel odour acceptability for MAP packages. With reference to consumers, the MAP proposed in the present study is the chosen method for storing goat meat, rather than vacuum or atmospheric air packaging.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1639-1642
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• 1994

The severe conditions such as rated voltage of 800kV, gas pressure of $5kg/cm^2$ and rated lighting impulse withstand voltage of 2400kV were adopted for the design of spacers in the 800kV GIS to give a sufficient design margin. The design criteria on the maximum electric field strength of the center conductor and the insulator surface were established by considering the insulator surface characteristics, electrode area and surface effects in the unequal electric field strength of the given gap. The design parameters such as inter/outer envelope degree, thickness, inter/outer inserts, triple junction gap were determined by calculating the electric field using FLUX-2D program package and by referring to the published papers. The mechanical stress analysis was conducted on the feasible model spacers that showed good electric field distributions to confirm the sufficient mechanical design margin. The 800kV spacer designed as described above is now in the process of manufacturing.

• Journal of Biosystems Engineering
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• v.7 no.2
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• pp.18-29
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• 1983

A low cost and versatile data acquisition system for the field and laboratory use was developed by using a single board microcomputer. Data acquisition system based on a Z80 microprocessor was built, tested and modified to obtain the present functional system. The microcomputer developed consists of 6 kB ROM, 5 kB RAM, 6-seven segment LED display, 16-Hex. key and 8 command key board. And it interfaces with an 8 channel, 12 bits A/D converter, a microprinter, EPROM programmer for 2716, and RS232C interface to transfer data between the system and HP3000 mini-computer manufactured by Hewlett Packard Co., A software package was also developed, tested, and modified for the system. This package included drivers for the AID converter, LED display, key board, microprinter, EPROM programmer, and RS232c interface. All of these programs were written in 280 assembler language and converted to machine codes using a cross assembler by HP3000 computer to the system during modifying stage by data transferring unit of this system, then the machine language wrote to the EPROM by this EPROM programmer. The results are summarized as follows: 1. Measuring program developed was able to control the measuring intervals, No. of channels used, and No. of data, where the maximum measuring speed was 58.8 microsec. 2. Calibration of the system was performed with triangle wave generated by a function generator. The results of calibration agreed well to the test results. 3. The measured data was able to be written into EPROM, then the EPROM data was compared with original data. It took only 75 sec. for the developed program to write the data of 2 kB the EPROM. 4. For the slow speed measurements, microprinter instead of EPROM programmer proved to be useful. It took about 15 min. for microprinter to write the data of 2 kB. 5. Modified data transferring unit was very effective in communicating between the system and HP3000 computer. The required time for data transferring was only 1~2 min. 6. By using DC/DC converting devices such as 78-series, 79-series. and TL497 IC, this system was modified to convert the only one input power sources to the various powers. The available power sources of the system was DC 7~25 V and 1.8 A.

• Korean Journal of Metals and Materials
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• v.49 no.2
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• pp.180-186
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• 2011

Isothermal annealing and electromigration tests were performed at $125^{\circ}C$ and $125^{\circ}C$, $3.6{\times}10_4A/cm^2$ conditions, respectively, in order to compare the growth kinetics of the intermetallic compound (IMC) in the Cu/thin Sn/Cu bump. $Cu_6Sn_5$ and $Cu_3Sn$ formed at the Cu/thin Sn/Cu interfaces where most of the Sn phase transformed into the $Cu_6Sn_5$ phase. Only a few regions of Sn were not consumed and trapped between the transformed regions. The limited supply of Sn atoms and the continued proliferation of Cu atoms enhanced the formation of the $Cu_3Sn$ phase at the Cu pillar/$Cu_6Sn_5$ interface. The IMC thickness increased linearly with the square root of annealing time, and increased linearly with the current stressing time, which means that the current stressing accelerated the interfacial reaction. Abrupt changes in the IMC growth velocities at a specific testing time were closely related to the phase transition from $Cu_6Sn_5$ to $Cu_3Sn$ phases after complete consumption of the remaining Sn phase due to the limited amount of the Sn phase in the Cu/thin Sn/Cu bump, which implies that the relative thickness ratios of Cu and Sn significantly affect Cu-Sn IMC growth kinetics.

• Journal of Plant Biotechnology
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• v.45 no.1
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• pp.45-54
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• 2018

This research was conducted to study the gene expression of coffee (Coffea arabica L.) seedlings under salt stress condition. A solution of five percent ($2.3dS\;m^{-1}$) deep sea water was used for the salt treatment, and it was thereby compared to normal irrigation water ($0.2dS\;m^{-1}$) used for the control treatment. The mRNA was extracted from the leaves of the coffee seedlings for a comprehensive analysis. In this study, a total of 19,581 genes were identified and aligned to the reference sequences available in the coffee genome database. The gene ontology analysis was performed to estimate the number of genes associated with the identified biological processes, cellular components and molecular functions. Among the 19,581 genes, 7369 (37.64%) were associated with biological processes, 5909 (30.18%) with cellular components, and 5325 (27.19%) with molecular functions. The remaining 978 (4.99%) genes were therefore grouped as unclassified. A differential gene expression analysis was performed using the DESeq2 package to identify the genes that were differentially expressed between the treatments based on fold changes and p-values. Namely, a total of 611 differentially expressed genes were identified (treatment/control) in that case. Among these, 336 genes were up-regulated while 275 of the genes were down-regulated. Of the differentially expressed genes, 60 genes showed statistically significant (p < 0.05) expression, 44 of which were up-regulated and 16 which were down-regulated. We also identified 11 differentially expressed transcription factor genes, 6 of which were up-regulated and rest 5 genes were down-regulated. The data generated from this study will help in the continued interest and understanding of the responses of coffee seedlings genes associated with salinity stress, in particular. This study will also provide important resources for further functional genomics studies.

• Journal of Korean Society of Transportation
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• v.20 no.3
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• pp.149-158
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• 2002

For the purpose of preciously describing real time traffic pattern in urban road network, dynamic network loading(DNL) models able to simulate traffic behavior are required. A number of different methods are available, including macroscopic, microscopic dynamic network models, as well as analytical model. Equivalency minimization problem and Variation inequality problem are the analytical models, which include explicit mathematical travel cost function for describing traffic behaviors on the network. While microscopic simulation models move vehicles according to behavioral car-following and cell-transmission. However, DNL models embedding such travel time function have some limitations ; analytical model has lacking of describing traffic characteristics such as relations between flow and speed, between speed and density Microscopic simulation models are the most detailed and realistic, but they are difficult to calibrate and may not be the most practical tools for large-scale networks. To cope with such problems, this paper develops a new DNL model appropriate for dynamic traffic assignment(DTA), The model is combined with vertical queue model representing vehicles as vertical queues at the end of links. In order to compare and to assess the model, we use a contrived example network. From the numerical results, we found that the DNL model presented in the paper were able to describe traffic characteristics with reasonable amount of computing time. The model also showed good relationship between travel time and traffic flow and expressed the feature of backward turn at near capacity.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1069-1077
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• 2011

In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.