• Korean Journal of Optics and Photonics
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• v.5 no.1
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• pp.166-172
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• 1994

The fiber optic receiver, ETRI APD-FET 1.0, is developed for the application of optical communication. This fiber optic receiver includes PD sub-module and pre-amplifier case. A single lens system is introduced for the PD sub-module. The sub-module consists of the avalenche photodiode(APD), GRIN rod lens, and a single mode fiber. The above components are enclosed into the stainless steel 304L housings. By bevelling the fiber end, the single mode fiber provides less than ~ 28 dB of optical return loss. The area of image focus is controlled by adjusting the length of spacer located in-between the fiber and the GRIN rod lens. The laser welding technique is applied to achieve the maximum coupling efficiency for the joining of each housing. In the pre-amplifier case, GaAs FET pre-amplifier workes for photocurrent amplification and the thermister is mounted to control the APD bias. The performance of ETRI APD-FET1.0 shows the sensitivity of - 30.3 dBm at $10^{-10}$ BER(bit error rate) and 2.5 Gbps optical random signal of $2^{23}-1$ word length. The fiber optic receiver is one of the essensial parts of the transmission module for B-ISDN. Also, the above optical packaging technology will be adapted for the developement of 10 Gbps transmission application 2.5 Gbps 5 Gbps

• Journal of the Ergonomics Society of Korea
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• v.25 no.2
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• pp.85-94
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• 2006

The purpose of this study is to extract typical body shapes of Korean adults based on the three-dimensional Korean anthropometric data measured through 5th national anthropometric survey and to examine the suitability of the 3-D human shape data for the interior packaging. 36 three-dimensional anthropometric variables related to the design of vehicle interior were considered for the appraisal of typical body shapes. Four major factors were extracted by the factor analysis and factor scores were calculated for all subjects. Typical or standard drivers of Korean adults were selected by the minimum deviation criteria for the four factor scores with respect to 5th, 50th, and 95th percentiles, respectively. Typical drivers of Korean adults were visualized by the CATIA-HUMAN program due to the absence of proper application software for three-dimensionally scanned human body data. There are considerable differences between the anthropometric data of Korean adults and those provided by CATIA-HUMAN program, which shows that the modeling data provided by CATIA-HUMAN should not be directly applied to the ergonomic evaluation for the vehicle design. This suggests the necessity for the development of suitable software for scanned human shape data. It is also expected that the anthropometric data of typical drivers extracted from this study help design package layouts and improve the suitability of ergonomic evaluation for Korean customers.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.1-8
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• 2017

Fe-9.8Si-6.0Al mother alloy was manufactured using by Fe-3.5Si recycled scrap and Si powder. And then, soft magnetic alloy powder of $D_{50}$ size and sphere type were prepared by gas atomization process. To obtain the soft magnetic powder of a high aspect ratio, in the first, we conducted the ball milling process for 8 hours. And heat treatment was performed under $650^{\circ}C$, 2 hours and $N_2$ atmosphere condition for reducing the residual stress of the powder. Based on these process, we made around $50{\mu}m$ diameter Fe-9.8Si-6.0Al powder, which morphology and shape was a similar to the commercial Fe-Si-Al powder. Finally, the soft magnetic sheets were prepared by tape casting process using by those powders. The permeability of the tape casting sheet was measured, and we confirmed the possibility of reusing to the soft magnetic materials of Fe-Si electric sheet scrap.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.11-18
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• 2016

This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which diameter and shape were $45{\sim}150{\mu}m$ and sphere type was prepared by gas atomization process. As we compared to commercial Fe-6.5Si powder, its diameter distribution and microstructure of recycled powder was a similar. To investigate the possibility of reusing the soft magnetic composite sheet for electronics, recycled powder was treated to have a high aspect ratio (AR), and we finally obtained the 65~66 AR and $2.3{\mu}m$ thickness powder. To release the residual stress of powder, heat treatment was conducted under $300{\sim}400^{\circ}C$, $N_2$ gas. And then, soft magnetic sheet was made by tape casting process using by those powders. After the density and permeability of tape was measured, and we confirmed that the recycled Fe-Si electric sheet scrap was possible to reuse the soft magnetic materials of electronics.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.105-109
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• 2005

A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.3
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• pp.97-106
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• 2018

This study aimed at examining the suitability of $Tenax^{(R)}$ for the migration testing of food packaging materials, which is currently approved in the EU as a dry food simulant. The results are used as a basis to examine the feasibility of introducing $Tenax^{(R)}$ to Korean regulation. The OMVs of test specimen into various solvents (diethyl ether, ethanol, pentane, and acetone) after exposure to $100^{\circ}C$ for 1 hr were compared. Diethyl ether showed the highest OMV ($1.33mg/dm^2$) among the solvents tested. When the tests were conducted with different amounts of $Tenax^{(R)}$ of 2, 4, or 8 g per specimen, the OMVs were 0.75, 1.33 and $1.40mg/dm^2$, respectively. The OMV obtained with a closed system after wrapping with aluminum foil showed a significantly higher OMV ($1.61mg/dm^2$) than that without aluminum wrapping ($1.318mg/dm^2w$) and an open system without lid ($1.06mg/dm^2$). The specific migration rates of surrogates spiked in the polyethylene test film and paper samples into $Tenax^{(R)}$ were compared with those into liquid food simulants including 95% ethanol and n-heptane, and actual foods such as starch, skim milk, and sugar. In general, the specific migration levels of surrogates into $Tenax^{(R)}$ were similar compared with n-heptane, however those were significantly higher than into actual foods. These results suggest that $Tenax^{(R)}$ may be used as a food simulant for the long-term preservation of dried foods and paper products. However, more studies need to be conducted to investigate the factors influencing the migration into $Tenax^{(R)}$, such as the types of foods and packaging materials tested, migration conditions, and surrogates properties etc.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.5
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• pp.63-70
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• 2020

In this paper, the transmit-receive module for military seekers has been designed and fabricated in 35 GHz. To increase the performance of substrates and high integration of circuits in millimeter-wave band, a 4-layer LCP(Liquid Crystal Polymer) substrate was developed. This substrate was implemented with three FCCL substrates and two adhesive layers, and a process using the difference in melting point between the substrates was used for lamination. Using a strip line and a microstrip line was confirmed by the transmission loss along the length of the substrate, and the performance of LCP substrates was validated with a power divider in 35 GHz. After confirming the performance of individual blocks such as power amplifier and low noise amplifier, a single channel Ka-band transmission/reception module was developed using a 4-layer liquid crystal polymer substrate. The transmit power of this module has above 1.1W in pulse duty 10% and has an output power of 1.1W and it has receive noise figure less than 8.5 dB and receive gain more than 17.6 dB.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.63-68
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• 2019

Dielectric and piezoelectric properties of PIN-PMN-PT piezoelectric single crystals with variation of temperature and compressive stress were investigated. The crystal phase of the single crystal was changed from the ferroelectric rhombohedral structure to tetragonal structure in the 110℃ region and from the tetragonal structure to the paraelectric cubic structure in the 190℃ region. The piezoelectric constant and relative dielectric constant were calculated from the rate of change of polarization and displacement with the application of electric field, which was similar to the value measured from the instrument. As the compressive stress applied to the sample increased, the piezoelectric constant d₃₃ and relative dielectric constant values tended to increase. When the compressive stress applied to the sample at 5℃ was 60 MPa, the d₃₃ was calculated as 4,500 pC/N. At 60℃, the relative dielectric constant of 62000 was calculated when the compressive stress applied to the sample was 40 MPa. The increase in piezoelectric constant and relative dielectric constant when the compressive stress increased could be attributed to the phase transition from the rhombohedral structure to orthorhombic.