• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.331-337
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• 2003

This paper represents 50 ㎓ narrow band pass filters for fiber optical communication fabricated by dual ion beam sputtering method. We have analyzed the characteristics of the TA$_2$ $O_{5}$ and $SiO_2$ single layers in order to optimize the process conditions for the 50 ㎓ narrow band pass filters, and controlled the film thickness uniformity to less than 0.1 nm deviation by dual peak spike filter pre-deposition. We designed and fabricated 50 ㎓ narrow band pass filters that consist of 216 layers including 4 cavities based on quarter wave optical thickness. Class substrates with high thermal expansion coefficients were used to reduce the film stress. Anti-reflection coating at the rear side of the substrate was also needed to reduce the optical thickness errors of the Optical Monitoring System caused by multiple beam interference between the front side and the rear side of substrate. The optical characteristics of this 50 ㎓ narrow band pass filters are insertion loss of 0.40 ㏈, pass band ripple of 0.20 ㏈, and pass bandwidth at -0.5 ㏈ of 0.20 nm. and isolation bandwidth at -25 ㏈ of 0.6 nm, which satisfy specifications of dense WDM system in fiber optical communications.tions.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1112-1119
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• 2006

In this paper, mutually coupled oscillator is employed to improve phase noise. Mutually coupled structure oscillator couples two oscillator's phase shifted output signals, that is fabricated using teflon board which has dielectric constant of 2.5 and Surface Mount Gallium Arsenide FET devices. And this paper proposed the structure to bias adjustment for the phase condition of mutually couples. When one oscillator has bias point of 4.4 V and 37 mA, it's output signal has phase noise characteristic of -96.37 dBc(@9305 MHz, offset frequency 100 KHz), -73.46 dBc(10 kHz). and After it's output signal mutually coupled the other's output signal that has bias point of 8.1 V and 69 mA, it has superior phase noise characteristic of -106.7 dBc(@9305 MHz, offset frequency 100 kHz), -81 dBc(10 kHz).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.563-566
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• 2000

The effect of CuO and CuO-B $i_2$ $O_3$ additives on microwave dielectric properties of (P $b_{0.45}$C $a_{0.55}$)[F $e_{0.5}$N $b_{0.5}$)$_{0.9}$S $n_{0.1}$] $O_3$were investigated to decrease the sintering temperature for usage of Low Temperature Co-firing Ceramics (LTCC). The (P $b_{0.45}$C $a_{0.55}$)[F $e_{0.5}$N $b_{0.5}$)$_{0.9}$S $n_{0.1}$] $O_3$ceramics was sintered at 11$65^{\circ}C$. In order to decrease the sintering temperature, CuO and Cuo-B $i_2$ $O_3$ were added in the (Pb,Ca)[(Fe,Nb)Sn] $O_3$ with CuO-B $i_2$ $O_3$. For the addition of 0.4 wt.% CuO, the sintered density and the dielectric constant of the ceramics were revealed the maximum values of the 6.06g/c $m^2$ and 83 respectively and temperature coefficient of resonance frequency ($\tau$$_{f}$) shifted to the positive value. As increasing B $i_2$ $O_3$to the (Pb,Ca)[(Fe,Nb)Sn] $O_3$ with CuO-B $i_2$ $O_3$with 0.2 wt.% CuO, the sintered density, the $\varepsilon$$_{r}$ and the Q was decreased, and $\tau$$_{f}$ was minimized at 0.2 wt.% CuO, and 0.2 wt.% B $i_2$ $O_3$. For this composition, dielectric properties were $\varepsilon$$_{r}$ of 81, Q. $f_{0}$ of 4400 GHz, and $\tau$$_{f}$ of 5 ppm/$^{\circ}C$ at sintering temperature of 100$0^{\circ}C$. the relationship between the microstructure and properties of ceramics was studied by X-ray diffraction(XRD), scanning electron microscopy(SEM).copy(SEM).oscopy(SEM).copy(SEM).EM).

• Physical Therapy Korea
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• v.10 no.1
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• pp.15-27
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• 2003

Therapeutic ultrasound is commonly applied for deep heating in physical therapy setting. However, it is difficult to determine the exact application dosage and to confirm the immediate heating effect. Microwave Radio-Thermometer (MRT) can measure the temperature by the electromagnetic energy in the microwave region of the object that emits above absolute zero temperature. MRT was used for early diagnosis of breast cancer since it was not harmful, non-invasive, and non-ionizing to the human body. The purposes of this study were to investigate how accurately 1.1 GHz RTM (RES Ltd. Russia) measures the change of average temperature in the tissue, and to determine the depth of temperature change measurement. Therapeutic ultrasound was applied (continuous wave for 5 minutes, 1 MHz, intensity of 1.5 $W/cm^2$ [in vitro] and 1.0 $W/cm^2$ [in vivo]) in four different conditions: (1) 30 cases of in vitro specimen of pork, (2) 30 cases of in vitro specimen of pork ankle joint, (3) 10 cases of in vivo canine thigh, and (4) 30 cases of in vivo human body. Intraclass Correlation Coeffients (ICC[3,1]) between average needle probe thermometer below surface and MRT temperature was revealed as followed: (1) Before ultrasound application ICCs ranges above .8 in specimen of pork (15 mm underneath the skin) and above .82 in specimen of pork ankle joint (10~30 mm underneath the skin). (2) After ultrasound application ICCs ranges above .7 in both specimens of pork and pork ankle joint. (3) Before ultrasound application ICCs ranges above .8 in canine thigh (20 mm underneath the skin). (4) After ultrasound application ICCs ranges above .82 in canine thigh. The temperature of the human body increased significantly with the mean of $15^{\circ}C$ in muscle tissue and with the mean of $3.5^{\circ}C$ in joint (p<.00). It was revealed that the average depth of temperature measurement of the tissue by MRT was in between 10 and 35 mm, and determined that the proper temperature measurement band was $36.5{\sim}37.0^{\circ}C$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.52-59
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• 2007

In this paper, we analyzed and measured implant isolation characteristics for a 1.25 Gbps monolithic integrated hi-directional (M-BiDi) optoelectronic system-on-a-chip, which is a key component to constitute gigabit passive optical networks (PONs) for a fiber-to-the-home (FTTH). Also, we derived an equivalent circuit of the implant structure under various DC bias conditions. The 1.25 Gbps M-BiDi transmit-receive SoC consists of a laser diode with a monitor photodiode as a transmitter and a digital photodiode as a digital data receiver on the same InP wafer According to IEEE 802.3ah and ITU-T G.983.3 standards, a receiver sensitivity of the digital receiver has to satisfy under -24 dBm @ BER=10-12. Therefore, the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysed and measured results of the implant structure, the M-BiDi SoC with the implant area of 20 mm width and more than 200 mm distance between the laser diode and monitor photodiode, and between the monitor photodiode and digital photodiode, satisfies the electrical crosstalk level. These implant characteristics can be used for the design and fabrication of an optoelectronic SoC design, and expended to a mixed-mode SoC field.

• The Bulletin of The Korean Astronomical Society
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• v.40 no.1
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• pp.68.2-69
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• 2015

We present [Fe II] $1.644{\mu}m$ features around ultracompact H II regions (UCHIIs) found on a quest for the "footprint" outflow features of UCHIIs -the features produced by outflowing materials ejected during an earlier, active accretion phase of massive young stellar objects (MYSOs). We surveyed 237 UCHIIs in the first Galactic quadrant, employing the CORNISH UCHII catalog and UWIFE data, which is an imaging survey in [Fe II] $1.644{\mu}m$ performed with UKIRT-WFCAM under ~0.''8 seeing conditions. The [Fe II] features were found around five UCHIIs. We interpret the [Fe II] features to be shock-excited by outflows from YSOs and estimate the outflow mass-loss rates from the [Fe II] flux which are ${\sim}1{\times}10^{-6}-4{\times}10^{-5}M{\odot}yr^{-1}$. We propose that the [Fe II] features might be the "footprint" outflow features, but more studies are required to clarify whether or not this is the case. This is based on the morphological relation between the [Fe II] and 5 GHz radio features, the outflow mass-loss rate, the travel time of the [Fe II] features, and the existence of several YSO candidates near the UCHIIs.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1172-1175
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• 2011

In this paper, a design method of multi-tone signals for the measurement of adjacent-channel power-ratios on power amplifiers is suggested. Because most tests for power amplifiers in production are performed with single-tone signals, its testing accuracy is not guaranteed as the signal complexity increases. Therefore, the application of multi-tone signals to the testing is suggested by optimized complex coefficients of each tones for the best statistical similarity to the original modulated signal. From the verification, a 802.11a signal was replaced with a multi-tone signal of N=10, with the complex coefficients generated by the suggested method. The resulting measurements on the ACLR of 2.4 GHz power amplifier showed successful accuracy of less than 1 dB discrepancy.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.12
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• pp.1114-1125
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• 2013

License Plate Detection (LPD) is a key component in automatic license plate recognition system. Despite the success of License Plate Recognition (LPR) methods in the past decades, the problem is quite a challenge due to the diversity of plate formats and multiform outdoor illumination conditions during image acquisition. This paper aims at automatical detection of car license plates via image processing techniques. In this paper, we proposed a real-time and robust method for license plate detection using Heuristic Energy Map(HEM). In the vehicle image, the region of license plate contains many components or edges. We obtain the edge energy values of an image by using the box filter and search for the license plate region with high energy values. Using this energy value information or Heuristic Energy Map(HEM), we can easily detect the license plate region from vehicle image with a very high possibilities. The proposed method consists two main steps: Region of Interest (ROI) Detection and License Plate Detection. This method has better performance in speed and accuracy than the most of existing methods used for license plate detection. The proposed method can detect a license plate within 130 milliseconds and its detection rate is 99.2% on a 3.10-GHz Intel Core i3-2100(with 4.00 GB of RAM) personal computer.

• ETRI Journal
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• v.42 no.4
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• pp.491-504
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• 2020

We present AB9, a neural processor for inference acceleration. AB9 consists of a systolic tensor core (STC) neural network accelerator designed to accelerate artificial intelligence applications by exploiting the data reuse and parallelism characteristics inherent in neural networks while providing fast access to large on-chip memory. Complementing the hardware is an intuitive and user-friendly development environment that includes a simulator and an implementation flow that provides a high degree of programmability with a short development time. Along with a 40-TFLOP STC that includes 32k arithmetic units and over 36 MB of on-chip SRAM, our baseline implementation of AB9 consists of a 1-GHz quad-core setup with other various industry-standard peripheral intellectual properties. The acceleration performance and power efficiency were evaluated using YOLOv2, and the results show that AB9 has superior performance and power efficiency to that of a general-purpose graphics processing unit implementation. AB9 has been taped out in the TSMC 28-nm process with a chip size of 17 × 23 ㎟. Delivery is expected later this year.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.