• Journal of Agricultural Extension & Community Development
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• v.4 no.1
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• pp.1-14
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• 1997

This research was carried out to provide the basic informations for the study of the occupational socialization process of rural development workers. Until now in a study of rural development workers, the study about the socialization process, which is to study the whole change during the life, has not been sufficient. The occupational socialization process of rural development workers may be considered both a process from life as a pre-rural development workers to life as a rural development worker and a process of retirement or resigination as a rural development worker. The socialization process of rural development workers in general is presumed as the five steps. Each theme word corresponding to the cultural characters in each step is as following. (1) Expectation toward Uncertainty: Step before Life of Employing (2) Extra-Passion and Trial and Error: Step for Adapting the Working Life (3) Swimming: Step of Dissension and Desperation (4) Sinking or Avoiding Dissension: Step of Stability and Stagnation (5) Emptying a Lonely Mind: Step of Professional Inactivity and Retirement The five steps appear mixedly and irregularly. At each step, rural development workers can feel the sense of fruitage and dignity (a naive compensatory mind) despite appearance intermittent and unclear.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.16-22
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• 1993

A via-hole process for reproducible and reliable GaAs MMIC fabrication is described. The via-hole etching process consists of two step dry etching. During the first etching step a BC $I_{3}$/C $I_{2}$/Ar gas mixure is used to achieve high etch rate and small lateral etching. In the second etching step. CC $L_{2}$ $F_{2}$ gas is used to achieve selective etching of the GaAs substrate with respect to the front side metal layer. Via holes are formed from the backside of a 100$\mu$m thick GaAs substrate that has been evaporated initially with 500.angs. thick chromium and subsequently a 2000.angs. thick gold layer. The fabricated via holes are electroplated with gold (~20$\mu$m thick) to form via connections. The results show that established via-hole process is satisfactory for GaAs MMIC fabrication.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Journal of the Korean Applied Science and Technology
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• v.28 no.1
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• pp.6-9
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• 2011

Step feed process was analyzed stoichiometrically for the optimal operation conditions in this study. In case of optimal operation conditions, minimum R (sludge recycling) value, r (internal recycling ratio) value, and n (influent allocation ratio) value for the step feed process to acquire the maximum TN removal efficiency were identified by theoretical analysis. Maximum TN removal efficiency, based on stoichiometric reaction, can be obtained by controlling n value for the step feed process.

• 제어로봇시스템학회:학술대회논문집
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• 1992.10b
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• pp.265-271
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• 1992

It is the purpose of this paper to present a dialogical designing method for control system using a rough grasp of the unknown process property. We deal with a single-input single-output feedback control system with a fuzzy controller. The process property is roughly estimated by the step response, and the fuzzy controller is interactively modified according to the operator's requests. The modifying rules mainly derived from computer simulation are useful for almost every process, such as an unstable process and a non-minimum phase process. The fuzzy controller is tuned by taking notice of four characteristics of the step response: (1) rising time, (2) overshoot, (3) amplitude and (4) period of vibration. The tuning position of the controller is fourfold: (1) antecedent gain factor GE or GCE, (2) consequent gain factor GDU, (3) arrangement of the antecedent fuzzy labels and (4) arrangement of the control rules. The rules give an instance to the respective items of the controller in an effective order. The modified fuzzy PI controller realizes a good response of a stable process. However, because the GDU tuning becomes difficult for the unstable process, it is necessary to evaluate the stability of the process from the initial step response. The fuzzy PI controller is applied to the process whose initial step response converges with GDU tuning. The fuzzy PI controller with modified sampling time is applied to the process whose step response converges under the repeated application of the GDU tuning. The fuzzy PD controller is applied to the process whose step response never converges by the GDU tuning.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.5366-5370
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• 2013

For a easier bolt molding, an extrusion process, the 2nd step of the molding process, was moved to step 4, and the bolt head section was exclusively molded in steps 2 and 3. As a result, the molding process was made easier thanks to the minor modification, and the contact pressure decreased in step 1 and increased in step 2 over its earlier intensity. Also, the maximum effective stress, effective strain, and molding force were all increased in both steps 1 and 2.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.459-465
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• 1994

A-axis oriened YBCO thin flims were grown on $LaAIO_{3}$ single crystal substrate by off-axis rf magnetron sputtering method. We used two kinds of process to get a-axis oriented fi1ms;one-step process and two-step process. In one-step process, films are grown in single step in which substrate temperature( $T_s$) is in the range of $590^{\circ}C$ to $680^{\circ}C$. On the other hand, in two step process a-axis oriented thin film templates i f about 30nm thickness is deposited at low temperature first, and subsequently films are grown at elevated temperature to the final thickness of about 100nm. In the case of one step process($T_s$ ~)$600^{\circ}C$), prefered a-axis orientation is dominant and Cu-rich phases segregate at the surface. Segregations decrease and ($00 \ell$) peaks increase upon increasing $T_s$. The films prepared by two step method appeared to have strong(h00) peaks as the deposition rate increased. Microstructure shows pin holes resulted from mixed phases of a-axis and c-axis oriented films. In both cases of one step and two step process, as TS decreases, prepared films show stronger a-axis orientation. However electrical properties of the films are depressed with lower $T_c$ and wider $\Delta T$ as $T_s$ decreases.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.7
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• pp.841-849
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• 2013

In this study, a 2-step stamping model with an additional 1st stamping tool is proposed to reduce stamping flaws in the curved parts of a dimple in a nuclear fuel spacer grid. First, the strains of curved part of dimple are characterized via a comparison with strain solutions in pure bending. A reference 2D finite element (FE) model of 1-step stamping is then established, and the corresponding maximum strain is obtained. By varying the values of design variables of the 1st stamping tool in the 2-step stamping model, FE solutions are obtained to express the strain as a function of process variables, which provides the optimum values of process variables. Finally, applying these optimum values to a 3D FE model, we demonstrate the enhanced formability of the proposed 2-step stamping model.

• Korean Chemical Engineering Research
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• v.53 no.4
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• pp.417-424
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• 2015

In this study, the pretreatment of Helianthus tuberosus residue had been performed. The two-stage pretreatment on flow-through process were applied in the interests of increase of sugar production yield on enzymatic saccharification. The delignification by aqueous ammonia and the fractionation of hemicellulose by sulfuric acid solution as pretreatment solution were confirmed for effects of enzymatic saccharification. Two-stage pretreatment process was performed using aqueous ammonia and sulfuric acid. The first step was performed with aqueous ammonia for 40 min at $163.2^{\circ}C$ and the second step was performed with sulfuric acid solution for 20 min at $169.7^{\circ}C$. And then, the first step was performed with sulfuric acid solution and the second step was pretreated with aqueous ammonia. At this time, the glucose production was 30.7 g and the glucose yield was 72.4% in the first step process with aqueous ammonia. And, the glucose production was 20.9 g and the glucose yield was 49.3% in the first step process with sulfuric acid solution.

• Korean Journal of Computational Design and Engineering
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• v.9 no.2
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• pp.175-182
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• 2004

As a bridge between design and manufacturing, process planning is to generate a sequenced set of instructions to manufacture the specified part. Automatic interpretation of manufacturing information incorporated in the design documentation such as CAD file has been a knotty subject for manufacturing engineers since no current data exchange format for product data provides a perfect interface between heterogeneous systems. The recent neutral data exchange format STEp, standard for the exchange of product model data, includes not only geometry but also technical and managerial information. STEP AP(Application Protocol) 224 is specifically dedicated to the mechanical product definition for process planning using machining features. Given a design information in STEP AP 224 format, process planning can be made without human intervention. This paper describes a method to determine the sequence of machining features by using the machining features and the manufacturing information expressed in STEP AP224.