• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.10
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• pp.826-834
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• 2006

A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.182-187
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• 2006

This research presented the heat resistance characteristics of heat sink which is newly designed through the experiment. For the same volume and base plate of heat sinks, the experiment of heat transfer characteristics was conducted for forced convection of layered type heat sink. The heat transfer and pressure drop characteristics of the layered type heat sink were compared for the various kinds of fin pitches, fin heights and heights of heat sink. The results show that thermal resistance is decreased as the height of heat sink increases and the fin height and fin pitch decrease, From the experimental data of layered type heat sink, the correlation equation of Nusselt number was obtained as follows ; $$Nu=0.845{\cdot}Re^{0.393}{\cdot}(\frac{f_h}{D_h})^{0.160}{\cdot}(\frac{f_p}{D_h})^{0.372}{\cdot}(\frac{H_{hs}}{D_h})^{-0.942}$$

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.5
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• pp.96-102
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• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. More than 80% of the power supply is converted into heat energy, which has a fatal impact on the lifetime of the LED. Therefore, the effective heat dissipation characteristics of a heatsink, such as a 30W floodlight, through forced convection were grasped and the heat transfer characteristics were tested. As a result, it was confirmed that the smaller the number of fins, the more the temperature distribution varies according to the wind velocity. In addition, the larger the number of fins, the smaller the temperature difference according to the wind velocity. Therefore, it was found through this experiment that excellent heat dissipation performance was exhibited as the heat dissipation area and wind velocity increased.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.225-230
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• 2006

The overall performance and local flow fields of the fan, heat sink, and fan-sink were experimentally and numerically studied to investigate the flow characteristics of a fan-sink. The flow resistance of the heat sink was measured by small fan tester based on AMCA standards and compared with the CFD results to select available cooling fan for the fan-sink. The nonuniform velocity profile behind the fan outlet was shown by the flow visualization. The effects of nonuniform velocities on the performance of heat sink were discussed. To validate the commercial CFD code CFX-5.6, the predicted performance curve was compared with that of fan testing. The local flow fields of the fan-sink were analyzed by CFD results. MFR (multiple frame of reference) was used as a computational model combining rotating fan and stationary heat sink. Through the CFD results of the fan-sink, the flow patterns behind the fan outlet influenced the flow resistance and overall performance of the heat sink.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1247-1252
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• 2004

The present paper is devoted to the modeling method based on an averaging approach for thermal analysis of microchannel heat sinks subjected to the uniform wall temperature condition. Solutions for velocity and temperature distributions are presented using the averaging approach. When the aspect ratio of the microchannel is higher than 1, these solutions accurately evaluate thermal resistances of heat sinks. Asymptotic solutions for velocity and temperature distributions at the high-aspect-ratio limit are alsopresented by using the scale analysis. Asymptotic solutions are simple, but shown to predict thermal resistances accurately when the aspect ratio is higher than 10. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Characteristics of the thermal resistance of microchannel heat sinks are also discussed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.849-854
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• 2005

In this paper, the cooling performance of a microchannel heat sink with nano-particle-fluid suspensions ('nanofluids') is numerically investigated. By using theoretical models of thermal conductivity and viscosity of nanofluids that account for the fundamental role of Brownian motion respectively, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6nm copper-in-water and 2nm diamond-in-water. The results show that a microchannel heat sink with nanofluids has high cooling performance compared with the cooling performance of that with water, the classical coolant. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.2
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• pp.253-266
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• 1998

A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1430-1435
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• 2004

The present paper is devoted to the modeling based on an averaging approach for microchannel heat sinks. Firstly, analytic solutions for velocity and temperature distributions for low-aspect-ratio microchannel heat sinks are presented by using the averaging approach. When the aspect ratio of the microchannel is smaller than 1, analytic solutions accurately evaluate thermal resistances of heat sinks while the previous model cannot predict thermal resistances. Secondly, asymptotic solutions for velocity and temperature distributions at low-aspect-ratio limit and at high-aspect-ratio limit are presented by using the scale analysis. Asymptotic solutions are very simple, but shown to predict thermal resistances accurately.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.941-943
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• 2010

근래 LED 조명기기 연구는 출력이 낮은 조명기기에서 고출력 전원을 이용한 고휘도 제품 개발로 바뀌는 추세이다. 고출력을 이용할 경우 단순히 히트싱크 형상, PCB 배치 및 물성 변경을 통한 방열문제 해결 방법으로는 LED 조명기기의 수명감소 문제를 해결하는데 한계가 있다. 따라서 방열능력을 더욱 향상시킬 수 있는 히트파이프(heat pipe)의 필요성이 대두되었다. 본 연구에서는 히트파이프를 이용해 고출력 LED 조명기기 개발을 위한 연구를 수행하였다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.12
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• pp.1711-1720
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• 2001

In this study, the heat transfer characteristics of a U-shape heat pipes were investigated. Heat is supplied to the U heat pipe through its middle zone(evaporator), and is released to the environment through its both arms(condensers). Both heat transfer coefficients and heat transport limitations were measured and compared with correlations previously developed for straight type heat pipes. Special concerns were focused to the cases, when each of condensers were submitted to a different cooling conditions, relatively. As a result. the heat transfer limitation of a U-shape heat pipe was found out to be 10∼15% less than the value for a straight heat pipe with an equivalent size.