• Journal of the Korean Society for Precision Engineering
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• v.32 no.2
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• pp.219-227
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• 2015

A dehumidifier using a thermoelement has many advantages compare to a dehumidifier using compressor systems. However, it is crucial to optimize the performance of heat sink for improving heat dissipation problem on the heat generation part. In this study, we utilized computational fluid dynamics software to compare Nusselt number, temperature and system efficiency based on fin thickness, flow gap between fin and fin length. Moreover, slip flow on the boundary layer was applied for the further analysis. Our objective in this study is to suggest an optimal fin shape to improve heat transfer with the tendency of performance factor depending on change of the shapes. Our results on the optimization of fin shape and analysis of slip flow will be utilized to enhance the heat transfer in the heat sink which is important in the design of dehumidifier using a thermoelement.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.870-875
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• 2004

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was $45.1^{\circ}C$ in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was $2.51^{\circ}C/W$ in the air vent hole typed Wave Heat Sink, and it changed to $2.65^{\circ}C/W\;and\;2.16^{\circ}C/W$ with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

• The KSFM Journal of Fluid Machinery
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• v.18 no.3
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• pp.33-37
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• 2015

A numerical study on the IPM/Bridge Diode cooling and coil cooling has been performed. Results are presented as plots of thermal resistance, temperature drop and RPM-ratio. CFD analysis for conventional cooling system has been performed as a reference case. As the RPM-Ratio was increased, heatsink thermal resistance and coil temperature were decreased. IPM/Bridge Diode thermal resistance and temperature of the coil is tended to be trade-off. The temperature of coil closest to the AC-motor fan showed the most significant change in accordance with duct design. The temperature of coil located at the top of DC-motor fan showed the most significant variation as the cooling air passes the heatsink fin area.

• Transactions of Materials Processing
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• v.23 no.7
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• pp.419-424
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• 2014

In order to improve efficiency, an outdoor unit using a refrigerant cooling method is designed into many air conditioner systems. The heat exchanger is composed of a Cu tube and an plate. The optimal design for the cold plate is very important because the efficiency of the heat transfer depends on the contact area between the Cu tube and the cold plate. The current study focused on the design of the cold plate to obtain a uniform contact between the Cu tube and the cold plate. Both FE(finite element) analysis and optimization were used in the design. The contact area between the tube and plate was predicted and improved by 16% through the press forming simulations. The springback after press forming was also reduced when the optimized design parameters were used. To verify the validity of the optimal cold plate design, a verification test was conducted. As a result, the performance of the heat exchanger improved by 34% when compared to benchmarked products.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

• Journal of the Korean Solar Energy Society
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• v.35 no.1
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• pp.1-8
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• 2015

In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

• Korean Journal of Optics and Photonics
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• v.27 no.6
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• pp.218-222
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• 2016

The thermal characteristics of a laser diode TO package has been analyzed using a commercial computational fluid dynamics (CFD) tool, and the thermal bypass structure was optimized. Comparison of device temperature and the estimated thermal resistance of the resultant structure showed that the bypass structure relieved the thermal bottleneck, and improved the thermal characteristics quite efficiently.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.117-123
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• 2018

Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.

• Journal of the Korean Society of Visualization
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• v.22 no.1
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• pp.79-84
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• 2024

As microchips' degree of integration is getting higher, its cooling problem becomes important more than ever. One of the promising methods is using fractal microchannel heat sink by mimicking nature's Murray networks. However, most of the related works have been progressed only by numerical analysis. Perhaps such lack of direct experimental studies is due to the technical difficulty of the temperature and heat flux measurement in complex geometric channels. Here, we demonstrate the direct visualization of in situ temperature profile in a fractal microchannel heat sink. By using the temperature-sensitive fluorescent dye and a transparent Polydimethylsiloxane window, we can map temperature profiles in silicon-based fractal heat sinks with various fractal scale factors (a=1.5-3.5). Then, heat transfer rates and pressure drops under a fixed flow rate were estimated to optimize hydrodynamic and thermal characteristics. Through this experiment, we found out that the optimal factor is a=1.75, given that the differences in heat transfer among the devices are marginal when compared to the variances in pumping power. This work is expected to contribute to the development of high-performance, high-efficiency thermal management systems required in various industrial fields.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.