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http://dx.doi.org/10.3807/KJOP.2016.27.6.218

Thermal Characteristics of a Heat Sink with Bypass Structure for GaN-based Laser Diode  

Ji, Byeong-Gwan (School of Information and Communication Engineering, Inha University)
Lee, Seung-Gol (School of Information and Communication Engineering, Inha University)
Park, Se-Geun (School of Information and Communication Engineering, Inha University)
O, Beom-Hoan (School of Information and Communication Engineering, Inha University)
Publication Information
Korean Journal of Optics and Photonics / v.27, no.6, 2016 , pp. 218-222 More about this Journal
Abstract
The thermal characteristics of a laser diode TO package has been analyzed using a commercial computational fluid dynamics (CFD) tool, and the thermal bypass structure was optimized. Comparison of device temperature and the estimated thermal resistance of the resultant structure showed that the bypass structure relieved the thermal bottleneck, and improved the thermal characteristics quite efficiently.
Keywords
LD; Thermal resistance; Heat flow;
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Times Cited By KSCI : 3  (Citation Analysis)
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