• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Restorative Dentistry and Endodontics
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• v.27 no.6
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• pp.577-586
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• 2002

The purpose of this in vitro study was to compare the effects of root canal cleanness following two Ni-Ti rotary instruments with different rake angle. Thirty-six sound, extracted human premolars with single root were randomly divided into three groups. The used rotary instruments were HEROShaper (Group 1, Micro-Mega, Besancon, France, n=12) and ProFile (Group 2, Maillefer, Ballaigues, Switzerland, n=12). Control group (n=12) was only extirpated with barbed broach (Mani, Matsutani Seisakusho Co., Japan) Group 1 & 2 teeth were prepared to a #40/.04 taper at the apex followed by 1 mm using crown-down technique. After canal preparation and frequent irrigation with 5.25% sodium hypochlorite, the roots split longitudinally into a bucco-lingual direction. Root halves were cross-sectioned in apical third portion again. All root specimens were processed for SEM investigation and photographed. Separate evaluations by one endodontist were undertaken for smear layer on prepared walls with a five score-index for each using reference photograph in root halves. The penetration depth of smear layer into dentinal tubules was also estimated in the other halves. Following results were obtained: 1. Smear layer was observed on all the prepared walls with two experimental groups except control group. 2. Smear layer characteristics in two experimental groups; 1) HEROShaper group showed snowy, dusty appearance and were shown open dentinal tubuli on the prepared walls of almost specimens, and the thickness of smear layer covering onto dentinal surfaces was within 1-2 ${\mu}m$ in a few specimens. 2) ProFile group showed shiny, burnished appearance and complete root canal wall covered by a homogenous smear layer with no open dentinal tubuli in all specimens. The penetration of smear layer into dentinal tubules was found in all specimens and the thickness was at 2-4 ${\mu}m$ in all specimens. These results demonstrated that a completely clean root canal could not be achieved regardless of positive or negative rake angle, which is in accordance with the majority of previous studies on root canal cleanliness In conclusion, through irrigation with antibacterial solutions or chelating agents is recommended to remove the smear layer on prepared canal wall in spite of Ni-Ti instrumentation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.48-48
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• 2009

최근 빠른 동작속도와 고 집적도를 얻기 위해 metal oxide semiconductor field effect transistor (MOSFET) 의 크기는 계속 해서 줄어들고 있다. 동시에 게이트의 절연층도 얇아지게 된다. 절연층으로 사용되는 $SiO_2$ 의 두께가 2nm 이하로 얇아 지게 되면 터널링에 의해 누설 전류가 발생하게 된다. 이 문제를 해결하기 위해 $SiO_2$ 를 대체할 고유전체 물질의 연구가 활발하다. 고유전체 물질 중에는 $ZrO_2,\;Al_2O_3,\;HfO_2$ 등이 많이 연구 되어 왔다. 하지만 유전상수 이외에 band gap energy, thermodynamic stability, recrystallization temperature 등의 특성이 좋지 않아 대체 물질로 문제점이 있다. 이를 보안하기 위해 산화물을 합금과 결합시키면 서로의 장점들이 합쳐져 기준들을 만족하는 물질을 만들 수 있고 $HfAlO_3$가 그 중 하나이다. Al를 첨가하는 이유는 문턱전압을 낮추기 위해서다. $HfAlO_3$는 유전상수 18.2, band gap energy 6.5 eV, recrystallization temperature 800 $^{\circ}C$이고 열역학적 특성이 안정적이다. 게이트 절연층은 전극과 기판사이에 적층구조를 이루고 있어 이방성인 드라이 에칭이 필요하고 공정 중 마스크물질과의 선택비가 높아야한다. 본 연구는 $HfAlO_3$박막을 $BCl_3/Ar,\;N_2/BCl_3/Ar$ 유도결합 플라즈마를 이용해 식각했다. 베이스 조건은 RF Power 500 W, DC-bias -100 V, 공정압력 15 mTorr, 기판온도 40 $^{\circ}C$ 이다. 가스비율, RF Power, DC-bias, 공정 압력에 의한 마스크물질과 의 선택비를 알아보았다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.8
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• pp.1169-1175
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• 1993

Plasma spraying method was used to fabricated the microwave absorbing ferrite-silicon carbide on the aluminum-alloy of the fuselage of an aircraft to protect it from RADAR detection. In this paper 15[rm] instead of 34[rm], the mean size of SIC-powder for ferrite-silicon carbide surface films(I) was used. 50(Kg/h) Instead of 70(Kg/h), the powder feed and 100[mm] Instead of 80(mm), spray distance of spray parameters was used. This M/W absorbers were designed experimentally and fabricated trially, as a result of which the relative frequency bandwidth of 2.8% were obtained under the tolerance limits of the reflection coefficients lower than-10[dB], and the maximum absorption thickness becomes 0.5[mm], which is much thinner than that of the conventional ones.

• Journal of the Korean Magnetics Society
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• v.3 no.1
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• pp.23-28
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• 1993

Thin films of soft magnetic Fe-Hf-C alloys with nanoscale crystallites were investigated in this study. The films were fabricated by an RF diode magnetron sputtering apparatus and subsequently annealed in vacuum. The soft magnetic properties of the films were observed to differ depending on the different substrates such as Corning 7059, $CaTiO_3$ and $Al_2O_3-TiC$ with various underlayer(Cr, $SiO_2$) thickness. This results may be due to the interdiffusion between the substrate and the magnetic layer and/or between the underlayer and the magnetic layer, rather than the microstructural change such as grain size. The Fe-Hf-C films with high permeability up to 4000(at 1 MHz) and saturation magnetization up to 16 kG were obtained in the vicinity of phase boundary between the crystalline and amorphous state when the size of ${\alpha}-Fe$ grains is about 5 nm. And also the films were found to have thermal stability up to $600^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.549-554
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• 2011

Recently, technical advances have been made in high efficiency gas turbine power plants. In domestic gas turbine facilities, the material properties of the blade and vane are degraded by the daily start-stop operations arising from the thermo mechanical cycle. We surveyed the time dependent degradation of the HP blade and vane to gather basic data for life assessment and damage analysis. The EOH(equivalent operating hours) of the blades were 23,686, 27,909, and 52,859 and the EOH of the vanes were 28,714 and 52,859, respectively. With increased operating hours, the shape of the primary ${\gamma}$' precipitate transformed from cubic to spherical, and its average size also increased. The leading edge area of the blades and the center of the vanes had the worst morphology, and this tendency agrees with the microhardness results. The thickness of the thermally grown oxide at the outer surface of the bond coat increased with increased operating hours.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.501-501
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• 2011

산업이 고도화, 다원화, 세계화되고 있는 현대사회는 다기능성, 고물성, 극한 내구성을 가지며 환경 친화적이면서 에너지 효율을 극대화시킬 수 있는 다기능 소재의 개발을 요구하고 있다. 이러한 시점에서 다양한 물성을 동시에 발현이 가능한 코팅 소재는 향후 미래에 중요한 원천소재로서 주목되고 있다. 특히, 환경에 의해 쉽게 물성 및 구조의 변화가 쉬운 종래의 코팅소재와는 달리, 다양한 외부환경에서도 미세 구조 및 물성을 안정적으로 유지할 수 있는 신개념의 코팅 소재의 개발이 절실히 요구되고 있다. 이를 위해서는 코팅소재의 다 성분화가 필수적이다. 최근의 코팅 기술은 2가지 이상의 물성, 특히 서로 상반되는 물성을 동시에 구현할 수 있는 소재의 개발을 요구하고 있다. 이러한 물성의 구현을 위하여 더 많은 성분으로 구성되며 더욱 복잡한 조직으로 구성된 코팅층에 대한 개발이 필요하다. 본 연구에서 목표로 하는 신 개념의 원천소재기술은 4 성분계 이상의 원료 물질을 단일 타겟으로 제조하여, 단순한 코팅공정으로서 단일 코팅층 내에 다양한 성분상이 10 nm 미만 크기의 나노 결정립/나노 비정질로 구성된 나노 복합 구조로 형성되도록 하는 기술을 개발하고자 하는 것이다. 이는 복합기능 3 이상의 다기능성 부여는 물론, 그림 1에 명시되어 있는 극한 기능성(광대역 윤활성, 전자 이동 제어에 의한 온도 저항 계수 및 전기 저항 조절, 고온 열적 안정성, 내산화성, 고열전도율, 초저마찰/내구성/초고경도성 등)이 구현되도록 하는 소재 개발과 원하는 물성을 구현할 수 있는 나노 복합 코팅층의 형성 공정으로 구성된다. 다성분계 모물질의 개발이 중요한 이유는 다수의 성분 원소를 합금 상태로 형성시킴으로서, 단일 소스에 의해 다양한 원소를 동시에 스퍼터링 및 증착이 가능하도록 할 수 있다는 장점을 가지기 때문이다. 특히, 타겟의 미세구조를 나노구조화 하는것을 통해, 스퍼터링 yield의 차이가 큰 원소일지라도 균일하게 증착시킬 수 있는 방법을 제시하고자한다. 이러한 연구는 다수의 성분 타겟을 사용함으로서 장비의 복잡성, 코팅의 재현성, 대형화 등의 문제점을 본질적으로 갖고 있는 기존 PVD 공정의 문제점을 해결하기 위한 최적의 대안이라할 수 있다. 본 발표에서는 3가지 이상의 다기능성 구현을 위한 가장 중요한 원천기술이라 할 수 있는 다성분계 타겟 모물질 제조 기술에 대해 소개하고자 한다.

• Membrane Journal
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• v.28 no.5
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• pp.297-306
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• 2018

This review focused carbon-free hydrogen productions from ammonia decomposition including inorganic membranes, catalysts and the presently studied reactor configurations. It also contains general information about hydrogen productions from hydrocarbons as hydrogen carriers. A Pd-based membrane (e.g. a porous ceramic or porous metallic support with a thin selective layer of Pd alloy) shows its efficiency to produce the high purity hydrogen. Ru-based catalysts consisted of Ru, support, and promoter are the efficient catalysts for ammonia decomposition. Packed bed membrane reactor (PBMR), Fluidized bed membrane reactor (FBMR), and membrane micro-reactor have been studied mainly for the optimization and the improvement of mass transfer limitation. Various types of reactors, which contain various combinations of hydrogen-selective membranes (i.e. Pd-based membranes) and catalysts (i.e. Ru-based catalysts) including catalytic membrane reactor, have been studied for carbon-free hydrogen production to achieve high ammonia conversion and high hydrogen flux and purity.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.