• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.1620-1625
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• 2015

In this study, a variety of industrial gears, shafts, chains, rollers, mold, etc. are widely used inautomotive steel carbon steel for machine structural SM45C typical material used for the experiments. In order to cure the surface of the test piece after the rough grinding and fine grinding was performed in order polishing. Perform the surface hardening of SM45C lacal area by using a diode laser. The output of the laser diode and the feed rate to the process variable. Micro-hardness testing, microstructure testing, scanning electron microscope testing(SEM), the heat input to the analysis. After analyzing the experiment to compare the mechanical properties of the material. When using a diode laser to assess the soundness of the surface hardening. Accordingly, the process for deriving the optimum demonstrate the feasibility.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1278-1282
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• 2004

수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$와 $CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$와 $CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$ 와 $CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Korean Chemical Engineering Research
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• v.60 no.1
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• pp.132-138
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• 2022

In this study, a basic study was performed to systematically compare the changes in surface properties according to the post-processing method of the stereolithography (SLA) printing method, which is a photocuring 3D printing method, and to provide information on the post-processing method suitable for the application. Although it was possible to improve some of the transparency of the SLA-type output by regularly changing the irregular microstructure of the surface through polishing, it was difficult to secure sufficient transparency like glass. The change in contact angle characteristics due to grinding showed a tendency to slightly increase as the grinding time increased and the particle size of the sandpaper used was small, but the variation between samples was large and the average contact angle was 77~90°, showing no statistically significant difference. Surface treatment methods other than polishing were tried, and it was confirmed that it was possible to easily and simply improve the transparency by applying a commercially available vehicle scratch remover or silicone oil. In addition, a method for securing high transparency such as glass by using a scratch remover after sequential grinding while reducing the particle size of the sandpaper was proposed. Finally, even after surface treatment through polishing and various methods, it was difficult to secure a contact angle of 90° or more.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.284-289
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• 1991

3차원 자유곡면을 볼엔드밀을 사용하여 금형가공을 할 경우, 가공면에는 공구경로에 따른 흔적과 NC공작기계의 직선보간시 발생되는 가공오차에 의하여 공작물 상에 가공오차가 필연적으로 발생되게 된다. 따라서 공작기계상에 서 금형가공을 수행한 후에는 가공오차를 제거하고 금형의 표면을 매끄럽게 하기위하여 연마작업이 픽수적으로 요구 되고있다. 본 연구에서는 3차원 자유곡면으로 이루어진 금형의 연마가공에 로봇을 도입하고, 이를 위한 로봇 작업단의 경로 제어시비전문가라 할지라도 CAM시스템으로 부터 금형 가공용 NC공작기계의 공구경로데이타(Cutter Location Data)를 받으면 자유곡면을 모형화한 후 자유곡면의 법선벡터와 연마로봇 작업단의 위치벡터를 자동으로 생성하고, 그에 따른 로봇의 작업명령을 자동으로 생성할 수 있는 CAMPoli 오프라인 로봇 프로그래밍 시스템을 개발하였다. CAMPoli시스템은 마이크로소프트사의 WINDOWS/386 오퍼레이팅 시스템을 이용하여 IBM-PC/386 상에서 개발되었으며 그주요한 내용들은 다음과 같다. i) CAM시스템으로 부터 입력된 CL-데이타로부터 연마면에 대한 자유곡면을 생성하고, ii) 연마공정의 데이타베이스에 기초한 연마면수의 지정 및 변경을 수행하고, iii) 자유곡면 연마를 위한 로봇 작업단의 위치벡터와 법선벡터를 계산하고, iv) 기존의 로봇언어를 이용한 오프라인 소스프로그램(Source Program)을 생성 및 그래픽 시뮬레이션 하는 과정으로 구축되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.5
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• pp.350-355
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• 2000

The fabrication of sapphire wafer in C plane has been developed by horizontal Bridgeman method and GaN based semiconductor epitaxial growth has been carried out in metal organic chemical vapour deposition. The single crystalline ingot of sapphire has been utilized for 2 inch sapphire wafers and wafer slicing and lapping machines were designed. These several steps of lapping processes provided the mirror-like surface of sapphire wafer. The measurements of the surface flatness and the roughness were carried out by the atomic force microscope. The GaN thin film growth on the developed wafer was confirmed the wafer quality and applicability to blue light emitting devices.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2002.05a
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• pp.407-412
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• 2002

산업의 급속한 발달과 더불어 정보화 산업과 초정밀 가공분야의 신기술 개발이 활발히 진행되고 있다 최근 표면연마기술은 자동화 기계, 반도체, 원자력, 의료장비, 항공우주 산업 등의 분야에 사용되는 파이프와 실린더 등의 내면을 정밀하고 신속하게 가공하는데 있어서 여러 가지 기술적인 어려움으로 인해 기계 장비 및 가공효율을 저하시키는 요인이 되고 있다.(중략)

• The Journal of Korean Academy of Prosthodontics
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• v.58 no.3
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• pp.207-216
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• 2020

Purpose: To compare the polishing characteristics and their influence on Candida albicans adhesion to the recently introduced polyetherketoneketone (PEKK) and the conventional polymethylmethacrylate (PMMA) denture resin material. Materials and methods: Specimens from PEKK (Group E) and PMMA (Group M) were made in dimensions of 8 mm in diameter and 2 mm in thickness. The specimens were further divided into sub-groups according to the extent of polishing (ER, MR: rough; EP, MP: polished, N = 12 each). The specimens were polished using polishing machine and SiC foil. ER and MR group specimens were polished with 600 grit SiC foil only. EP and MP groups were further polished with 800, 1,000, 1,200 grit SiC foils sequentially. To measure the surface roughness values (Sa) of specimens, atomic force microscope (AFM) was used and scanning electron microscope (SEM) observation under 1,000, and 20,000 magnifications was performed to investigate surface topography. The polished specimens were soaked in C. albicans suspension for 2 hours with shaking to promote adhesion. The attached C. albicans were detached from the surface with 10 times of pipetting. The suspension of detached C. albicans was performed by serial dilution to 10³ times, and the diluted suspensions were inoculated on Sabouraud dextrose agar plates using spread plate method. After incubating the plate for 48 hours, colony forming unit (CFU)/plate of C. albicans was counted. Statistical analysis was performed using one-way ANOVA and Tukey HSD test to confirm significant difference between the groups (α=.05). Results: Average Sa value was significantly higher in MR group compared to other groups (P<.05), meaning that additional polishing steps reduced surface roughness effectively only in the PMMA specimens. There was no significant difference in Sa values between MP and EP groups. In SEM images, PEKK specimens showed numerous spikes of abraded material protruding from the surface and this phenomenon was more significant in EP group. The mean CFU/plate value was the highest in EP group and this was significant when it was compared to MP group (P<.05) which was the lowest. Conclusion: Polishing PEKK using serial SiC abrasive foil may result in higher adhesion of C. albicans. In clinic, this should be considered carefully.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.3
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• pp.108-112
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• 2011

In order to obtain excellent flatness and surface roughness of glass substrate disk, uniform distribution of abrasives should be important for uniform polishing. We introduced coated-type magnetic abrasives and magnetic field to a lapping for the improvement of surface roughness and removal rate. Polishing properties with the conventional diamond abrasives and the coated-type magnetic abrasives were compared. As a result, the coated-type magnetic abrasives showed small surface roughness and large removal rate by applying magnetic field. And it also was shown that coated-type magnetic abrasives could save the more amount of polishing liquid under the same removal rate than the conventional diamond abrasives can.