• Electrical & Electronic Materials
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• v.34 no.1
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• pp.31-41
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• 2021

• Proceedings of the Korean Fiber Society Conference
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• 1987.06a
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• pp.63-64
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• 1987

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.177-182
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• 2006

In this work, we have prepared organophilic MMT having thermal stability by ion exchange reaction of various aromatic ammonium salts with MMT containing sodium ion. The organic modifiers having alkyl side chains and amine functional group were successfully synthesized by effectively introducing the surfaces of MMT via ion exchange reaction to form organophilic MMTs with a view to improve the reactivity and thermal stability. The WAXD patterns of organophilic MMT showed the more increased gallery spacing by $3.3{\AA}$ than that of the pristine MMT and also the onset of initial decomposition of organophilic MMT was $275^{\circ}C$ as determined by a thermogravimetric analysis. The polyimide (PI) nanocomposite films based on poly(amic acid) and organophilic MMT were prepared by a solution blending followed by cyclodehydration reaction. We have investigated the dispersity of organophilic MMTs in PI matrix by using WAXD and the effect of the organophilic MMT content on the mechanical properties of PI nanocomposite films was studied.

• Journal of Adhesion and Interface
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• v.10 no.2
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• pp.98-105
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• 2009

Poly(amic acid) was synthesized from the reaction of p-PDA/ODA and PMDA/BPDA and silane oligomer containing epoxy group was also synthesized from the reaction of tetramethylorthosilicate (TMOS) and glycidol. After hybridizing poly (amic acid) and silane oligomer, they were effectively converted into polyimide/silica hybrid films by thermal imidization process. As the silica contents in hybrid films increased, CTE values decreased from 17 ppm/K to 10 ppm/K and the tensile modulus increased, in spite of decreasing tensile strength. In addition, the peel test showed that the adhesion strength of hybrid film was enhanced from $0.43kg_f/cm$ to $1.02kg_f/cm$. Therefore, it could be concluded that the polyimide/silica hybrid film is effective to enhance adhesion strength for FCCL films.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.408.1-408.1
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• 2016

현대 반도체 산업에서 소자의 집적도가 증가함에 따라 층간 절연막의 두께가 줄어들어 RC delay현상이 발생한다. 또한 유연성에 대한 요구도 증가하고 있다. 그 대안으로 저유전 SiO2 무기물, 유무기 복합체, 유기물 등이 크게 각광받고 있다. 본 연구는 SiO2 hollow sphere와 폴리이미드를 이용해 유무기복합체를 합성하고 유전율 측정 및 유연성 테스트를 진행한 내용을 담고있다. 먼저 폴리스티렌에 SiO2를 코팅한 후 폴리이미드 용액과 기계적으로 혼합시킨다. 이후 스핀코팅 및 열처리를 이용해 한단계로 복합체를 합성할수 있다. 합성된 복합체의 유전율은 최소 1.6에 가까운 수치를 나타낸다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.41-47
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• 2001

폴리머 박막은 반도체 패키징, MEMS 구조물은 물론 MCM-D 등의 기술에도 널리 쓰이고 있다. 또한 대부분 폴리머/금속의 다층구조의 형태를 띠고 있어 이 상태의 기계적 특성의 이해는 더욱 중요하다. 본 연구에서는 폴리머 박막의 기계적 특성을 측정하기 위한 새로운 방법이 제안된다. 제안된 방법은 최근 발달된 마이크로머시닝기술을 사용하여 구현된 공진형 스트링구조를 이용하게된다. 폴리머 기계적 특성치와 스트링의 공진특성은 서로 상관 관계를 갖게되며 이러한 공진특성의 측정은 기계적 특성의 실시간 관찰을 가능하게 해준다. 본 논문에서는 공진형 스트링을 이용하여 폴리이미드의 잔류음력과 폴리이미드/금속간의 접착 내구성을 정량화하는 방법을 제안한다. 제안된 측정방법은 단순히 스트링구조 뿐만 아니라 다른 기계적 구조에도 응용이 가능하다.

• Journal of Satellite, Information and Communications
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• v.10 no.1
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• pp.67-70
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• 2015

We studied the state of the dual liquid crystal (LC) alignment which displays both homeotropic and homogeneous alignment on blended polyimide (PI) layer. The research was conducted using rubbing method at different imidizing temperatures and the blended PI was made using homeotropic PI having an alkyl side chain and homogeneous PI without the side chain. The uniform LC alignments were achieved, and have thermal stability. The results of contact angles were similar to that of pretilt angles.

• Proceedings of the Membrane Society of Korea Conference
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• 1998.04a
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• pp.59-60
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• 1998

1. 서론 : 고분자 분리막은 대부분 immersion precipitation에 의한 상분리법으로 제조한다. 이 방법으로 제조한 막은 표면으로 갈수록 치밀한 구조를 갖고, 하부층에는 많은 경우 macrovoid가 형성된다. 이러한 연구의 하나로 PVP와 같은 고분자 첨가제를 고분자 용액에 첨가하여 막을 제조하는 방법에 대한 연구가 Boom 등을 중심으로 이루어져 왔는데, 대부분의 경우 macrovoid가 줄어들고 막의 porosity가 증가하는 결과를 보여준다. 본 연구에서는 막의 재료로 열적, 화학적 성질이 우수한 폴리이미드 막에 대해 PVP가 첨가되었을 때의 영향을 살펴보았는데, 특히 macrovoid가 없고 높은 투과도를 얻을 수 있는 조겅의 용액에 PVP를 첨가하여 막을 제조할 경우 나타나는 막의 구조 및 투과 특성의 변화를 중점적으로 관찰하였다.

• Polymer(Korea)
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• v.36 no.3
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• pp.275-280
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• 2012

Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and $p$-phenylenediamine ($p$-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4-component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Polymer(Korea)
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• v.33 no.6
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• pp.525-529
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• 2009

In order to manufacture 2-layer flexible copper clad laminate (FCCL) s having the excellent performance high adhesion properties between copper foil and polyimide film are required. Silane coupling agents with specific functional groups as an adhesion promoter are generally used to enhance the adhesion. In our study, we synthesized a novel silane coupling agent for increasing the adhesive property between copper layer and polyimide layer. The surface morphology of rolled copper foil, as a function of the concentrations of the coated silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by the surface morphology and we confirmed that the novel silane coupling agent affects adhesive properties in FCCL with two types of poly (amic acid)s.