• The Magazine of the IEIE
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• v.17 no.4
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• pp.62-65
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• 1990

• Journal of the Korean Institute of Intelligent Systems
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• v.20 no.4
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• pp.534-540
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• 2010

High dimensionality and highly correlated features are the major characteristics of hyperspectral data. Linear projections such as LDA and its variants have been used in extracting low-dimensional features from high-dimensional spectral data. Regularization of LDA has been introduced to alleviate the overfitting that often occurs in a small-sized training data set and leads to poor generalization performance. Among them, a smoothness regularized LDA seems to be effective in the feature extraction for hyperspectral data due to its capability of utilizing the high correlatedness. This paper studies the performance of the regularized LDA in hyperspectral data classification experimentally with varying conditions of the training data. In addition, a new dual smoothness regularized LDA is proposed and evaluated that makes use of both the spectral-domain and spatial-domain correlations between neighboring pixels.

• Korean Journal of Optics and Photonics
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• v.13 no.5
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• pp.373-376
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• 2002

An asymmetrical directional coupler with two nonidentical fibers has, for the first time, been proposed and analyzed for an EDFA gain flattening filter (GFF). The characteristics of the transmission spectra of the GFFs have been theoretically investigated for the core spacings, the coupling lengths and the fiber parameters of the asymmetrical directional coupler. The analytical results show that an EDFA gain spectrum with flatness of ~7 ㏈ can be flattened to within $\pm$0.75 ㏈ over a bandwidth of 30 nm by using the asymmetrical directional coupler-based GFF.

• Journal of Korean Tunnelling and Underground Space Association
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• v.23 no.6
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• pp.423-438
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• 2021

The blade of motor grader is used for scattering and leveling the aggregates on the foundation of road construction site. The paper performed a design improvement research of the blade part to enhance the working efficiency of motor graders. The scattering works of aggregates by blade driving were simulated by DEM (discrete element method) of a dynamic code. The four design parameters were selected and a specific leveling scenario for the simulation was determined. The nine blade models were numerically experimented, and the sensitivity of each factors was analyzed. Next, the design factors that influence a blade performance have been selected by ANOVA, and these key design factors were applied to the progressive quadratic response surface method (PQRSM). The optimum set of design factors of the blade was finally proposed.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2013.06a
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• pp.6-7
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• 2013

저전송률 오디오 부호화기의 성능 향상을 위해 가변 LPC 기반으로 스펙트럼을 평탄화 하는 방법을 제안한다. 제안한 방법은 대역별 scale factor를 동일하게 하여 비트 효율을 증가시키고 spectral hole이 발생하는 문제점을 해결할 수 있다. 또한, 가변 LPC 필터를 사용하여 프레임 특성에 따라 스펙트럼 평탄화 강도를 가변적으로 조절하여 성능 향상을 제공한다. 제안한 방법이 일반 LPC 필터 방법보다 저대역의 부호화 성능을 향상시키고 스테레오 왜곡을 감소시키는 것을 확인하였다.

• The Journal of the Korea Contents Association
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• v.3 no.3
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• pp.55-62
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• 2003

In this paper, I proposed a new WRR Cell Scheduling algorithm for improving the problem of existing smoothing scheme. in proposed algorithm, when queue of being service VC in present round is emptied, instead VC that difference between assigned weight and length of present buffer is biggest in all VC service. This result efficiency of bandwidth allocation is increased. And above all real-time traffic is serviced, non-real-time to allocate bandwidth of the remainder multimedia-service is possible. In one cycle, number of serviced average cell is increased. And for many eel serviced, length of total Duffer is decreased.

• Korean Journal of Optics and Photonics
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• v.9 no.3
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• pp.181-185
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• 1998

Gain characteristic of concatenated erbium-doped fiber amplifiers(EDFA) are studied with a recirculating EDFA loop. For a non-flat gain EDFA, the 3 dB gain bandwidth was reduced to 6 nm after the 20th EDFA. However, for an optimized gain flattened EDFA, in a simple configuration, the 5 dB gain bandwidth was found to be 9nm, even after the 100th EDFA, corresponding to 8000km transmission. This results suggest that the simple optimized flat gain amplifier could be a good candidate for ultra-long distance wavelength division multiplexed transmissions.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.12
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• pp.76-82
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• 1997

Chemical mechanical polishing (CMP) has become widely accepted for the planarization of multi-interconnect structures in semiconductor manufacturing. However, perfect planarization is not so easily ahieved because it depends on the pattern sensitivity, the large number of controllable process parameters, and the absence of a reliable process model, etc. In this paper, we realized the planarization of deposited oxide layers followed by metal (W) polishing as a replacement for tungsten etch-back process for via formation. Atomic force microscope (AFM) is used for the evaluation of pattern topography during CMP. As a result, AFM evaluation is very attractive compared to conventional methods for the measurment of planarity. mOreover, it will contribute to analyze planarization characteristics and establish CMP model.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.198-205
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• 1992

Abstract-Planarieation technology, which is essential to VLSI, has been developed using non-etch back Spin- On-Glass (SOG). Process factors for 1.5 micron double metal technology are optimized by the statistical design of experiments. Optimum conditions are found to be a process with twice SOG coating, sufficiently long hot plate baking at 300t, and furnace curing for 40 minutes below 400$^{\circ}$C.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.383-385
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• 2013

반도체소자의 고속실현을 위해서 알루미늄배선에서 40% 가량 성능을 높이는 반면 제조비용은 30%까지 낮출 수 있는 구리를 선호하고 있으나, 식각이 잘 되지 않아 원하는 패턴으로 만들어 내기가 곤란한 공정기술의 어려움과 구리물질이 지닌 유독성문제를 가지고 있다. 기존의 식각기술로는 구리패턴을 얻을 수 없는 기술적 한계 때문에 화학.기계적 연마(CMP)를 이용한 평탄화와 연마를 통해서 구리배선을 얻는 다마스커스(Damascene)기술이 개발됐고 이를 이용한 구리배선기술이 현실적으로 가능하게 됐다. CMP를 이용한 평탄화 및 연마 공정에서 Wafer에 도포된 구리의 두께를 실시간으로 측정하여 정밀하게 제어할필요가 있는데, 본 논문에서는 와전류를 이용하여 옹고스트롬 단위의 두께를 실시간으로 측정하여 제어 하는 시스템구현에 대해 기술한다.