• Korean Journal of Acupuncture
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• v.18 no.1
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• pp.165-170
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• 2001

A rapid increasing in cultivation area due to favorable price temporarily and decreasing in consumer's demands caused by economic depressions recently, lead the price of Cynanchum wilfordii Hemsley to decline sharply. Thus, it may give rises to weakening of cultivation bases in Cynanchum wilfordii Hemsley. To investigate optimal mechanical peeling conditions of Cynanchum wilfordii Hemsley, protruded rubber, plastic pad, diamond shape's steel and palstic brush were introduced as blades and artificial stone, sand and small pebble were done as abrasives. The main results obtained were summarized as follows; 1. It took 2 minutes per 1kg in mechanical peeling of Cynanchum wilfordii Hemsley's raw root whereas 36 minutes in manual peeling and values of lightness showed more higher in manual peeling than in mechanical peeling. 2. Yield in combination of diamond shape's steel blade and sand abrasive showed the lowest at 89.9% among treatments and peeling rates in combination of diamond shape's steel blade and small pebble showed the highest at 71.3% in mechanical peeling. 3. Lightness, one of the most important factors in determining quality of Cynanchum wilfordii Hemsley, showed the highest in combination of diamond shape's steel blade and small pebble brasive at 61.90 in mechanical peeling. 4. As the speed of rotation gets faster, yields tend to lower in mechanical peeling. Peeling rates and lightness showed the highest at 66.8%, 57.96 respectively among treatments at 30 r.p.m. in mechanical peeling.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Korean Applied Science and Technology
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• v.33 no.4
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• pp.802-812
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• 2016

Silicone foam is very useful as flame resistant material for many industrial areas such as high performance gasketing, thermal shielding, vibration mounts, and press pads. A silicone foam was prepared through simultaneous crosslinking and foaming by hydrogen condensation reaction of a vinyl-containing polysiloxane (V-silicone) and a hydroxyl-containing polysiloxane (OH-silicone) with hydride containing polysiloxane (H-silicone) in the presence of platinum catalyst and imorganic filler at room temperature. This is more convenient process for silicone foam manufacturing than the conventional separated crosslinking and foaming systems. Funtionalized silicones we used in this experiment were consisted with a V-silicone containing 1,0 meq/g of vinyl groups and a viscosity of 20 Pa-s, an OH-silicone with 0.4 meq/g of hydroxyl groups and a viscosity from 50 Pa-s, and an H-silicone containing 7.5 meq/g of hydride groups and a viscosity of 0.06 Pa.s. The effects of compositions of functionalized silicones and additives, such as catalyst and filler on the structure and mechanical properties of silicone foam were studied. 0.5 wt% of Pt catalyst was enough to accelerate the foaming rate of silicone resins. The addition of OH-silicone with lower viscosity accelerates the initial foaming rate and decreases the foam density, but the addition of V-silicone with lower viscosity reduces the tensile strength as well as the elongation. The final foam density, tensile strength, and elogation of silicone foam prepared under the SF-3 condition increase maximum to $0.58g/cm^3$, $3,51kg_f/cm^2$, and 176 %, repectively. We found out the filler alumina also played an important role to improve the mechanical properties of silicone foams in our foaming system.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Journal of Digital Convergence
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• v.18 no.3
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• pp.23-34
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• 2020

This study aims to verify the mediating effect of mobile social participation on the relationship between the mobile device capability and life satisfaction. Using the data of 2018 Digital Divide Survey conducted by the National Information Society Agency(NIA), the mediating effect was verified by Baron & Kenny (1986)'s 3 step process, targeting 1,665 middle and older aged adults. The result is as follows: first, the mobile device capability of the middle and older aged people has a positive effect on life satisfaction. Second, the effect of the mobile device capability of middle and older aged people on life satisfaction is partially mediated by mobile social participation including expressing opinions on social concerns, proposing policies and filing a civil complaint, donation and volunteering work and online voting and responding to a poll. The result represents that the mobile device, such as a smart phone or a smart pad, capability of the middle and older aged group not only directly benefits the group but also helps expand their mobile social participation, which leads to, although indirectly, higher life satisfaction. Therefore, the study is expected to be a groundwork for a practical intervention for enlarging the use of mobile device and lifting digital information level of the elderly to encourage mobile social participation and drive life satisfaction.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.49 no.1
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• pp.12-19
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• 2012

Recently, the market of skin-care device has been steadily growing up. In this paper, we tried to develop a personal compound stimulus device more competitive than existing products. As the compound stimulus, biochemical stimulus of herbal extraction fluid, thermal stimulus of plate-shaped carbon fiber heater, and optical stimulus of near infrared LED were selected. By some evaluation tests, the thermal stimulation part and the optical stimulation part were found to be developed properly. Additionally, the efficacy of the mixed stimulus of thermal and optical stimulation was tested in C2C12 mouse myoblast. Through RT-PCR analysis, it was found that, by the developed compound stimulus, the expression of collagen I mRNA and collagen III mRNA increased by 4.9 and 1.3 times respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.8
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• pp.1123-1132
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• 2018

In this paper, we design and implement a public bicycle sharing system based on smart phone application capable of distributing access codes via internet connection. When smartphone user uses the application to request a bicycle unlock code, server receives the request and sends an encrypted code, which is used to unlock the bicycle at the station and the same code is used to return the bicycle. The station's hardware prototypes were built on top of Internet devices such as raspberry pi, arduino, keypad, and motor driver, and smartphone application basically includes shared bike rental and return functionality. It also includes an additional feature of reservation for a certain time period. We tested the implemented system, and found that it is efficient because it shows the average of 3-4 seconds delay. The system can be implemented to manage multiple bikes with a single control box, and as the user can use a smartphone application, this makes the system more cost effective.

• Journal of Digital Convergence
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• v.17 no.12
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• pp.249-254
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• 2019

According to the recent expansion of the network environment, the spread of smart devices is continuously increasing. With the spread of smart devices such as smart phones, smart pads and wearables, changes are taking place in smart technologies and IT convergence technologies. The development of smart technology is a key element of the 4th industrial technology. The Fourth Industrial Revolution expanded the new service-based industry by adding intelligence to residential, industrial and production environments using IT convergence and smart devices. Research on providing various services using smart technologies, such as smart home, smart factory, smart farm, and smart healthcare, is being conducted in variety. In particular, There is a sharp rise in smart homes due to the proliferation of IoT devices and the growth of sensor technology, control technology, applications, data management, and cloud services. Smart home services using smart technology provide residents with convenient, beneficial services and environments. Smart home service has complemented the existing home network service, but there still are flaws to be modified. In other words, the spread of smart devices, the development of service provider-oriented services, and the interlocking of services have limitations in providing services in consideration of user environment and user state. In order to solve this problem, this study proposes a smart home service system that considers the situation of the elderly.

• Korean Journal of Agricultural Science
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• v.27 no.1
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• pp.13-19
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• 2000

The external morphology of male and female of Liriomyza trifolii (Burgess) was studied using the scanning electron microscopy (SEM). Three types of sensilla were identified on the funicle of antennae. The trichoid sensilla were most conspicious and distributed with a characteristic sharp structure at the apical end. Basiconic sensilla were showed distal curvature about $13{\mu}m$ long and $1.2{\mu}m$ to $1.4{\mu}m$ in diameter. Grooved sensilla were showed a finger-like projections at the peg apex. The function of these sensilla likely to be olfactory. The mouthparts were adapted for sucking food, and formed a elongate rostrum which was incorporated with labrum. The labrum was a small and flap-like shape. The slender and paired maxillary palp seemed to combine with each other lengthwise to long tube. The tarsus typically consisted of 5 segments, which might be variously modified, principally by thickening or flattening. The segment beared a pair of claws. Beneath the claws, there was a pair of pad-like pulvillia and a bristle-like median empodium. L. trifolii might secreted on the pulvillus and empodium an adhesive substance that enable them to cling to smooth surfaces. Male terminalia was complicated. The name 'aedeagus' seemed the best available general term for the copulatory organ, otherwise, female terminalia was usually relatively simple. This structure was reduced and formed a telescopic, eversible, and tubular ovipositor.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.35.2-35.2
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• 2009

최근 본 연구실에서 무연 솔더를 위한 새로운 Cu-Zn 합금 젖음층을 개발하였다. 전해도금을 통하여 Cu-Zn 합금층을 형성한 뒤 그 위에 Sn-4.0wt% Ag-0.5wt% Cu (SAC 405) 솔더를 리플로 솔더링을 통해 솔더접합부를 형성하였으며 계면에서 생성된 금속간 화합물의 형성 및 성장 거동을 연구하였다. SAC/Cu 시스템의 경우, $150^{\circ}C$에서 시효 처리를 실시하는 동안 솔더와 도금된 Cu 계면에서 $Cu_6Sn_5$ 상과 미세한 공공이 형성된 $Cu_3Sn$ 상이 발견되었다. 반면에 SAC/Cu-Zn 시스템에서는 계면에서 $Cu_6Sn_5$ 상만이 형성되었다. 또한 큰 판상형의 $Ag_3Sn$ 상이 SAC/Cu 시스템에 비해 현저하게 억제되었다. SAC/Cu-Zn 계면에서의 금속간 화합물의 성장 속도가 SAC/Cu 계면에서 형성된 금속간 화합물의 성장 속도보다 느리게 나타났다. Cu-Zn 젖음층의 Zn가 솔더와 Cu-Zn 층 사이에서 Cu와 Sn 원자의 상호 확산을 방해하기 때문이다. 본 연구에서는 Cu와 Cu-Zn 층을 이용한 솔더 접합부의 낙하 충격 신뢰성을 연구하였다. 낙하 충격 시험 시편은 두 개의 인쇄 회로 기판을 SAC 405 솔더볼을 이용하여 리플로를 통해 상호연결 하여 제조되었다. 이 때, 각각의 인쇄 회로 기판의 패드에는 Cu 층과 Cu-Zn층을 전해도금을 통하여 각각 $10{\mu}m$두께의 젖음층을 형성하였다. 낙하 시험 시편을 제조한 뒤, 시효 처리에 대한 낙하 저항 신뢰성의 특성을 연구하기 위해 250, 500 시간동안 시효처리를 한 후 각 조건에서 계면에 형성된 금속간 화합물의 성장 거동을 관찰하였으며, 낙하 충격 시험을 실시하였다. 낙하 시험은 daisy chain으로 연결된 시편의 저항이 100 Ohm 이상 측정되었을 때 중단되도록 하였다. Cu-Zn/SAC/Cu-Zn 시편의 경우 초기 리플로를 하였을 때 불량이 발생하는 평균 낙하 수는 350이며, Cu/SAC/Cu 시편의 평균 낙하수는 200 미만으로 나타났다. Cu/SAC/Cu 시편의 경우, 시효처리 시간이 증가함에 따라 평균 낙하수는 큰 폭으로 감소하였지만, Cu-Zn/SAC/Cu-Zn 시편은 불량이 발생하는 평균 낙하수의 감소폭이 보다 완만하게 나타났다. Cu 층에 Zn를 첨가함으로써 솔더와 젖음층 사이에서 형성된 금속간 화합물의 성장 및 미세 공공의 형성이 억제되었고, 솔더 접합부의 과냉을 감소시킴으로써 큰 판상형의 $Ag_3Sn$ 상의 형성을 억제함으로써 Cu-Zn/SAC/Cu-Zn 솔더 접합부에서 Cu/SAC/Cu 솔더 접합부보다 낙하 충격에 대한 저항성 및 신뢰성이 향상되었다. 이는 무연 솔더에 Zn를 첨가하여 낙하 충격 신뢰성을 향상시킨 것과 동일한 효과를 나타냈음을 확인하였다. 본 연구는 한국 과학 기술 재단의 전자패키지 재료 연구 센터(CEPM)와 지식 경제부의 부품 소재 기술 개발 사업의 지원을 받아 수행되었습니다.