• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.244-244
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• 2004

다양한 산업 분야에서 세장비가 높은 구멍 가공의 필요성이 증가하고 있다. 방전 가공은 세장비가 높은 미세 구멍을 가공하는데 매우 효과적인 방법이다. 그러나 일반적인 방전 가공으로는 세장비가 5이상 되는 깊은 구멍을 가공하기가 쉽지 않다 구멍을 가공할 때에 일정 깊이 이상으로 가공이 진행되면 가공 부스러기가 쉽게 배출되지 못하여 방전 집중 현상과 아크 방전이 일어나게 된다. 이로 인해 깊은 구멍 가공이 불가능하게 된다. 그러나 절연액에 초음파를 부가하여 가공을 하면 공구와 가공물 사이의 기공 부스러기가 분산되어 방전 집중 현상과 아크 방전 현상이 사라지고 가공이 원활히 이루어진다.(중략)

• 한국정밀공학회지
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• 제23권3호
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• pp.69-75
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• 2006

In this paper, micro electrical discharge milling using deionized water as dielectric fluid was investigated. In EDM, dielectric fluid is an important factor which affects machining characteristics. When deionized water was used as dielectric fluid, machining characteristics were investigated according to voltage, capacitance, and resistivity of deionized water. Machining gap increased with increasing voltage and capacitance. As the resistivity of deionized water decreased, the machining gap increased. The wear of a tool electrode and machining time can be reduced by using deionized water instead of EDM oil. Surface roughness was also improved when deionized water was used.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.27-28
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• 2007

• 전자통신동향분석
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• 제3권1호
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• pp.53-64
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• 1988

소자의 집적도가 향상됨에 따라 공정조건 제어의 중요성이 부각되고 있다. 따라서 제조환경의 엄격한 제어가 요구되고, 사용되는 화학약품 및 탈이온수의 순도가 중요해지고 있다. 즉, 반도체 제조공정의 주변기술에 대한 중요성이 높아지는 추세이다. 본고에서는 이러한 주변기술의 발전동향에 대해 간략하게 기술하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2005년도 춘계학술대회
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• pp.546-549
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• 2005

Micro EDM milling using deionized water as dielectric fluid was investigated. After machining micro grooves using deionized water with different voltage. capacitance. and resistivity of deionized water, machining characteristics were investigated. The wear of a tool electrode and the machining time can be reduced by using deionized water instead of kerosene. Micro hemispheres were machined in deionized water and kerosene and their machining characteristics were compared.

• 한국전기전자재료학회논문지
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• 제14권9호
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• pp.703-703
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• 2001

• 한국정밀공학회지
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• 제24권12호
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• pp.42-49
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• 2007

When micro holes are machined by EDM, machining characteristics of machined holes are changed according to the machining conditions. Typical machining conditions are the kind of dielectric fluids, capacitance and ultrasonic vibrations. They influence electrode wear, machining time, radial clearance and taper angle. In this paper, machined holes whose depths are 300, 500, $1000\;{\mu}m$ are observed for each machining conditions. Using deionized water as a dielectric fluid makes electrode wear small, machining time short, radial clearance large and taper angle small. High capacitance makes electrode wear high. Ultrasonic vibrations make electrode wear large, machining time short, radial clearance small and taper angle small. From the results of experiments, the optimal machining conditions were obtained to machine highly qualified micro holes.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2009년도 춘계학술대회 논문집
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• pp.33-36
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• 2009

본 연구에서는 액체로켓엔진 산화제로 과산화수소를 사용하기 위한 공급 설비 구축 및 세척 방법을 제시하고자 한다. 과산화수소 공급 설비의 오염을 최소화하기 위하여 공급 설비를 세척하고 세척된 공급 설비에 보호막을 입히는 passivation 절차를 확립하였다. 또한, 구축된 공급 설비는 누설 시험과 연소 시험을 통해서 안정성을 검증하였다.

• 한국가시화정보학회지
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• 제15권1호
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• pp.25-31
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• 2017

This study aims to visualize the Marangoni flow inside a droplet placed on heated hydrophobic surface and to measure its internal velocity field. The experimental result shows that the internal velocity increases with the increase of the plate temperature. In addition, the temperature difference induces the initial flow and drives the Marangoni circulation inside the droplet as soon as the evaporation starts (i.e. the thermal Marangoni flow). The fluorescence particles in the droplet trace two large-scale counter-rotating vortex pairs yielding the downwards flow along the vertical central axis. These vortex pairs gradually become small and move towards the contact line as time goes by, and this Marangoni flow sustains only for a half of the total evaporation time.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.