• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.2
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• pp.61-70
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• 2019

Geopolymer is an eco-friendly construction material that has various advantages such as reduced $CO_2$ emission, fire resistance and low thermal conductivity compared to cement. However, it has not been many studies on the thermal behavior of the surface of the geopolymer panel when flame is applied to the surface. In this study, surface characteristics of hardened geopolymer on flame exposure was investigated to observe its characteristics as heat-resistant architectural materials. External structure changes and crack due to the heat shock were not observed during the exposure on flame. According to the residue of calcite and halo pattern of aluminosilicate gel, decarboxylation and dehydration were extremely limited to the surface and, therefore, it is thought that durability of hardened geopolymer was sustained. Gehlenite and calcium silicate portion was inversely proportional to quartz and calcite and significantly directly proportional to BFS replacement ratio. Microstructure changes due to the thermal shock caused decarboxylation and dehydration of crystallization and it was developed the pore and new crystalline phase like calcium silicate and gehlenite. It is thought that those crystalline phase worked as a densification and strengthening mechanism on geopolymer panel surface.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.4
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• pp.159-165
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• 2021

The fiber composites have been investigated as lightweight structure material platforms for aerospace applications because their strength can be enhanced by adding reinforcement without a significant increase in weight. In this study, the fabrication and characterization of carbon nanotube (CNT) reinforced glass fiber composites are demonstrated to enhance the tensile strength of longitudinal direction along the glass fibers. Due to the reinforcement of CNT in epoxy layers, the yield strength of fiber/epoxy composites is enhanced by about 10 %. Furthermore, using scanning electron microscopy, analysis of fracture surfaces shows that mixed CNT in epoxy layers acts as necking agents between fractured surfaces of fiber/epoxy; thereby, initiation and evolution of crack across fiber composite can be suppressed by CNT necking between fractured surfaces.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.6
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• pp.1095-1100
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• 2021

In this study, ITZO thin films were deposited on glass, sapphire, and PEN substrates by RF magnetron sputtering, and their electrical and optical properties were investigated. The resistivity of the ITZO thin film deposited on the glass and sapphire substrates was 3.08×10-4 and 3.21×10-4 Ω-cm, respectively, showing no significant difference, whereas the resistivity of the ITZO thin film deposited on the PEN substrate was 7.36×10-4 Ω-cm, which was a rather large value. Regardless of the type of substrate, there was no significant difference in the average transmittance of the ITZO thin film. Figure of Merits of the ITZO thin film deposited on the glass substrate obtained using the average transmittance in the absorption region of the amorphous silicon thin film solar cell and the absorption region of the P3HT : PCBM organic active layer were 10.52 and 9.28×10-3 Ω-1, respectively, which showed the best values. Through XRD and AFM measurements, it was confirmed that all ITZO thin films exhibited an amorphous structure and had no defects such as pinholes or cracks, regardless of the substrate type.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.1
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• pp.1-6
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• 2022

In this research, a ring-shaped silicon carbide (SiC) single crystal manufactured using the PVT (Physical Vapor Transport) method was proposed to be applied to a SiC focus ring in semiconductor etching equipment. A cylindrical graphite structure was placed inside the graphite crucible to grow a ring-shaped SiC single crystal by the PVT method. SiC single crystal ring without crack was successfully obtained in case of using SiC single crystal wafer as a seed. A plasma etching process was performed to compare plasma resistance between the CVD-SiC focus ring and the PVT-SiC focus ring. The etch rate of ring materials in PVT-single crystal SiC focus ring was definitely lower than that of CVD-SiC focus ring, indicating better plasma resistance of PVT-SiC focus ring.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.7 no.11
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• pp.447-455
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• 2017

At the modern industry, the composite material has been widely used. Particularly, the material of carbon fiber reinforced plastic hardened with resin on the basis of fiber is excellent. As the specific strength and rigidity are also superior, it receives attention as the light material. Among these materials, the carbon fiber reinforced plastic using carbon fiber has the superior mechanical property different from another fiber. So, it is utilized in vehicle and airplane at which high strength and light weight are needed at the same time. In this paper, the tensile property due to the fiber design is investigated through the analysis study with CT specimen composed of carbon plastic reinforced plastic. At the stress analysis of CFRP composite material with hole, the fracture trend at the tensile environment is examined. Also, it is shown that the lowest stress value happens and the deformation energy of the pre-crack becomes lowest at the analysis model composed of the stacking angle of 60° through the result due to the stacking angle. On the basis of this study result, it is thought to apply the foundation data to anticipate the fracture configuration at the structure applied with the practical experiment.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Composites Research
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• v.15 no.4
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• pp.23-31
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• 2002

The two dimensional size effect of specimen gauge section ($length{\;}{\times}{\;}width$) was investigated on the compressive behavior of a T300/924 $\textrm{[}45/-45/0/90\textrm{]}_{3s}$, carbon fiber-epoxy laminate. A modified ICSTM compression test fixture was used together with an anti-buckling device to test 3mm thick specimens with a $30mm{\;}{\times}{\;}30mm,{\;}50mm{\;}{\times}{\;}50mm,{\;}70mm{\;}{\times}{\;}70mm{\;}and{\;}90mm{\;}{\times}{\;}90mm$ gauge length by width section. In all cases failure was sudden and occurred mainly within the gauge length. Post failure examination suggests that $0^{\circ}$ fiber microbuckling is the critical damage mechanism that causes final failure. This is the matrix dominated failure mode and its triggering depends very much on initial fiber waviness. It is suggested that manufacturing process and quality may play a significant role in determining the compressive strength. When the anti-buckling device was used on specimens, it was showed that the compressive strength with the device was slightly greater than that without the device due to surface friction between the specimen and the device by pretoque in bolts of the device. In the analysis result on influence of the anti-buckling device using the finite element method, it was found that the compressive strength with the anti-buckling device by loaded bolts was about 7% higher than actual compressive strength. Additionally, compressive tests on specimen with an open hole were performed. The local stress concentration arising from the hole dominates the strength of the laminate rather than the stresses in the bulk of the material. It is observed that the remote failure stress decreases with increasing hole size and specimen width but is generally well above the value one might predict from the elastic stress concentration factor. This suggests that the material is not ideally brittle and some stress relief occurs around the hole. X-ray radiography reveals that damage in the form of fiber microbuckling and delamination initiates at the edge of the hole at approximately 80% of the failure load and extends stably under increasing load before becoming unstable at a critical length of 2-3mm (depends on specimen geometry). This damage growth and failure are analysed by a linear cohesive zone model. Using the independently measured laminate parameters of unnotched compressive strength and in-plane fracture toughness the model predicts successfully the notched strength as a function of hole size and width.

• The Korean Journal of Petroleum Geology
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• v.11 no.1 s.12
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• pp.1-8
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• 2005

Seventeen exploratory wells have been drilled in the Block VI-1 of offshore Korea, which is located in the southern part or the Ulleung Basin. Gas show has been recognized from most of the wells, and gas and condensate have been accompanied in some wells. Commercial discovery of gas, accompanied by condensate, has been made from Gorae V well. The reservoir gases or the Dolgorae III, Gorae I, and Gorae V wells in the Ulleung Basin mainly consists of hydrocarbon gases (>93%). These gases are thermogenic wet gases which contain more than 96% of the methane and result from the cracking of petroleum or kerogen. Based on the chemistry and composition of the gases and stable isotope data, they seem to be generated from different source rocks. The condensates from the Gorae I and V wells are mostly generated from terrestrial organic matter. Lacustrine organic matter may not play an important role for the generation of these condensates. The condensates from the Gorae V wells consist predominantly of terrestrial organic matter but with minor subsidiary input from marine organic matter. The condensates from Gorse I and V wells may be generated from different source rocks. The thermal maturity level of the condensates from the Gorae V well ranges from early to middle oil generation zone and condensate from Gorae I reaches middle oil window. Correlation or the thermal maturation level of the condensates and organic matter in the sediments reveals that a depth of the generation of liquid hydrocarbons can be inferred to 3,000 m and 3,900 m for the Gorae V and I wells, respectively. Gorae V well, however, did not reach the target depth and the geochemical data of the Gorae I well were obscured due to the severe sediment caving in.

• Applied Chemistry for Engineering
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• v.32 no.3
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• pp.268-276
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• 2021

As wireless communication devices become more common, interests in how to control the electromagnetic waves generated from the devices are increasing. One of the most commonly used electromagnetic wave control materials is magnetic one, but due to the features that make the product heavy and thick when applied to the product, it is difficult to use them in curved electronic devices. Therefore, a polymer flexible meta electronic device has been presented to sort out the problem, which is thin and can have various curvatures. However, it requires an additional evaluation of curvature reliability. In this study, we developed a method to predict electromagnetic wave control characteristics through the resistance/length of the conductive ink line patterns of polymer flexible meta electronic devices, which is inversely proportional to the electromagnetic wave control characteristics. As the radius of curvature decreased, the resistance/length increased, and there was little variations with the duration times of curvature. We also found that both permanent and recoverable changes along with the removal of curvature were occurred when the curvature was applied, and that the cause of these changes was newly created vertical cracks in the conductive ink line pattern due to the tensile stress applied by applying curvature.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.