• Proceedings of the KAIS Fall Conference
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• 2006.05a
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• pp.112-115
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• 2006

본 논문에서는 무인 생산 공정의 선삭 가공 시 발행하는 칩의 처리에 관한 연구를 수행하였다. 선삭시 발생되는 칩은 부품의 정밀도와 표면 조도를 저하시키는 등 품질 저하와 함께 생산성을 저해하는 요소가 되기도 한다. 이러한 칩을, 칩 브레이커를 사용하여 작은 곡률 반경으로 절단함으로써 칩 제거를 효율적으로 제어한다. 그와 함께, 다구찌 기법을 적용하여 최적의 조건으로 칩 브레이커 형상 설계 인자를 도출하는데 그 목적이 있다.

• Food Engineering Progress
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• v.14 no.1
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• pp.49-53
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• 2010

Surface plasmon resonance (SPR) which is utilized in thin film refractometry-based sensors has been concerned on measurement of physical, chemical and biological quantities because of its high sensitivity and label-free feature. In this paper, an application of SPR to detection of alcohol content in wine and liquor was investigated. The result showed that SPR sensor had high potential to evaluate alcohol content. Nevertheless, food industry may need SPR sensor with higher sensitivity. Herein, we introduced a nano-technique into fabrication of SPR chip to enhance SPR sensitivity. Using Langmuir-Blodgett (LB) method, gold film with nano-structured surface was devised. In order to make a new SPR chip, firstly, a single layer of nano-scaled silica particles adhered to plain surface of gold film. Thereafter, gold was deposited on the template by an e-beam evaporator. Finally, the nano-structured surface with basin-like shape was obtained after removing the silica particles by sonication. In this study, two types of silica particles, or 130 nm and 300 nm, were used as template beads and sensitivity of the new SPR chip was tested with ethanol solution, respectively. Applying the new developed SPR sensor to a model food of alcoholic beverage, the sensitivity showed improvement of 95% over the conventional one.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.1
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• pp.139-144
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• 1991

Chip flow angle is one of the important factors to be determined for the scheme of Chip Control. Up to now, however, a dependable way to predict the chip flow angle in practical cutting has not been established satisfactorily. In this paper a rather simple theoretical prediction of chip flow angle is tried based on some already widely confirmed hypotheses. The developed equation of chip flow angle contains the parameters of depth of cut d, feed rate f, nose radius $r_{n}$ side cutting edge angle $C_{s}$, side rake angle .alpha.$_{s}$ and back rake angle .alpha.$_{b}$. Theoretical results of chip flow angle given by this study bas been shown in a good agreement with experimental ones.s.s.s.s.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.4
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• pp.2430-2435
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• 2015

In order to achieve high flexibility in manufacture, analysis of chip's shape is one of the most important problems. This paper describes the change of machining characteristics in workpiece materials depending on turning clearance angle. The experiments start from choosing three workpiece materials that are SM45C(machine structural carbon steel), STS303(stainless steel), SCM415 (chrome-molybdenum steel). Then, the experiments show specifically how features of selected materials changed when they were processed with diverse machining depths and with feed rate starting from fixed rotational speed. Especially, the experiments were also analyzed in chip's shape and wear of insert tip. In conclusion, these experiments show that chip's shape was changed by quality of the materials, depth of cut, and conveying speed. When machining feedrate and machining depth were 0.10mm/rev and 0.3mm respectively, workpiece materials showed the best shapes, not categorizing quality of the materials and machining characteristics.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.6
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• pp.591-598
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• 2012

In this study, the cutting characteristics of bulk metallic glass (BMG) cut using a computer numerically controlled (CNC) lathe were investigated for different insert tool materials and cutting speeds. The surface roughness, chip morphology, cutting forces, and tool wear during turning of $Zr_{50}Cu_{40}Al_{10}$ BMG alloy were examined. Four kinds of tool materials were used to cut an 8-mm-diameter BMG. The examination of the surface roughnesses of the BMG specimens machined at each cutting speed showed that the surface roughness became better as the cutting speed increased, and the tool materials also influenced the surface roughness. The chip morphology investigations showed that the unoxidized BMG chips had serrated curled chips with adiabatic shear bands, while the oxidized chips exhibited local melting and tangling rather than the usual spiral-shaped chips. The cutting force induced during machining of the Zr-based BMG was the largest for the TiN-WC tool, followed by the polycrystalline diamond (PCD) tool. The cermet tool exerted the smallest cutting force.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.96-102
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• 1991

절삭가공의 목적은 소재의 불필요한 부분을 chip으로 제거하여 소요의 형상 치수인 새로운 표면을 만들어 내는 것이다. 실제 가공에서 소요되는 동력을 보면 대부분은 chip을 만들어 내는데 소비되기 때문에 chip의 특성은 절삭가공에 있어서 극히 중요한 인자가 되는 것이다. 본 연구에서는 많이 사용되고 있는 throw away 공구에서의 칩 브레이커의 성능을 향상시키기 위하여 실험을 통하여 기존에 사용되고 있는 공구들의 성능을 평가하고 문제점을 제시한다.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.9
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• pp.191-199
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• 1999

In the continuous cutting process such as turning operation, chip control is thought very important to achieve the unmanned manufacturing system. The prediction of chip breakage under the given conditions is a substantial element for chip control. In this paper, a systematic approach to know the chip breaking region is represented under the concept of equivalent parameters. to Verify the suggested model, cutting experiments are executed with a commercial type and two other type chip breakers which have modified chip breaker parameters such as land width, groove width and nose radius. predicted chip breaking regions using the 3D cutting model agrees with those obtained from the experiments.

• Proceedings of the Optical Society of Korea Conference
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• 2003.07a
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• pp.146-147
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• 2003

산업계에서의 다양한 제품 개발로 인해 새로운 형상 측정기술이 요구된다. 칩패키지와 실리콘 웨이퍼로 대표되는 광산란 표면 특성을 가진 제품들의 형상 측정은 거친 표면을 가진 반면 수마이크로의 형상 측정 정밀도를 요구하기 때문에 기존의 측정법으로는 기대하는 성과를 이루지 못해왔다. 현재까지 기존의 정통적인 측정법을 통해 측정 시도되어 온 방법들은 다음과 같이 두 방법으로 요약된다. 첫째, Kwon과 Han등은 경면(specular surface)을 측정하던 정통적인 간섭계에 10.6$\mu$m파장의 $CO_2$레이저를 광원으로 사용함으로써 가시광선 영역에서의 광산란 표면을 적외부 영역에서 경면화 하여 측정하였다. (중략)

• Journal of the Korean Society for Precision Engineering
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• v.20 no.11
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• pp.64-70
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• 2003

This paper suggests a systematic methodology to predict chip forms using the experimental design technique and the neural network. Significant factors determined with ANOVA analysis are used as input variables of the neural network back-propagation algorithm. It has been shown that cutting conditions and cutting tool shapes have distinct effects on the chip forms, so chip breaking. Cutting tools are represented using the Z-map method, which differs from existing methods using some chip breaker parameters. After training the neural network with selected input variables, chip forms are predicted and compared with original chip forms obtained from experiments under same input conditions, showing that chip forms are same at all conditions. To verify the suggested model, one tool not used in training the model is chosen and input to the model. Under various cutting conditions, predicted chip forms agree well with those obtained from cutting experiments. The suggested method could reduce the cost and time significantly in designing cutting tools as well as replacing the“trial-and-error”design method.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.1-64.1
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• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.