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Pre-Packing, Early Fixation, and Multi-Layer Density Analysis in Analytic Placement for FPGAs (FPGA를 위한 분석적 배치에서 사전 패킹, 조기 배치 고정 및 밀도 분석 다층화)

  • Kim, Kyosun
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.10
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    • pp.96-106
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    • 2014
  • Previous academic research on FPGA tools has relied on simple imaginary models for the targeting architecture. As the first step to overcome such restriction, the issues on analytic placement and legalization which are applied to commercial FPGAs have been brought up, and several techniques to remedy them are presented, and evaluated. First of all, the center of gravity of the placed cells may be far displaced from the center of the chip during analytic placement. A function is proposed to be added to the objective function for minimizing this displacement. And then, the density map is expanded into multiple layers to accurately calculate the density distribution for each of the cell types. Early fixation is also proposed for the memory blocks which can be placed at limited sites in small numbers. Since two flip-flops share control pins in a slice, a compatibility constraint is introduced during legalization. Pre-packing compatible flip-flops is proposed as a proactive step. The proposed techniques are implemented on the K-FPGA fabric evaluation framework in which commercial architectures can be precisely modeled, and modified for enhancement, and validated on twelve industrial strength examples. The placement results show that the proposed techniques have reduced the wire length by 22%, and the slice usage by 5% on average. This research is expected to be a development basis of the optimization CAD tools for new as well as the state-of-the-art FPGA architectures.

Small-Swing Low-Power SRAM Based on Source-Controlled 4T Memory Cell (소스제어 4T 메모리 셀 기반 소신호 구동 저전력 SRAM)

  • Chung, Yeon-Bae;Kim, Jung-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.3
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    • pp.7-17
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    • 2010
  • In this paper, an innovative low-power SRAM based on 4-transistor latch cell is described. The memory cells are composed of two cross-coupled inverters without access transistors. The sources of PMOS transistors are connected to bitlines while the sources of NMOS transistors are connected to wordlines. They are accessed by totally new read and write method which results in low operating power dissipation in the nature. Moreover, the design reduces the leakage current in the memory cells. The proposed SRAM has been demonstrated through 16-kbit test chip fabricated in a 0.18-${\mu}m$ CMOS process. It shows 17.5 ns access at 1.8-V supply while consuming dynamic power of $87.6\;{\mu}W/MHz$ (for read cycle) and $70.2\;{\mu}W/MHz$ (for write cycle). Compared with those of the conventional 6-transistor SRAM, it exhibits the power reduction of 30 % (read) and 42 % (write) respectively. Silicon measurement also confirms that the proposed SRAM achieves nearly 64 % reduction in the total standby power dissipation. This novel SRAM might be effective in realizing low-power embedded memory in future mobile applications.

Implementation of Readout IC for $8\times8$ UV-FPA Detector ($8\times8$ UV-PPA 검출기용 Readout IC의 설계 및 제작)

  • Kim, Tae-Min;Shin, Gun-Soon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.3
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    • pp.503-510
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    • 2006
  • Readout circuit is to convert signal occurred in a defector into suitable signal for image signal processing. In general, it has to possess functions of impedance matching with perception element, amplification, noise reduction and cell selection. It also should satisfies conditions of low-power, low-noise, linearity, uniformity, dynamic range, excellent frequency-response characteristic, and so on. The technical issues in developing image processing equipment for focal plane way (FPA) can be categorized as follow: First, ultraviolet (UV) my detector material and fine processing technology. Second, ReadOut IC (ROIC) design technology to process electric signal from detector. Last, package technology for hybrid bonding between detector and ROIC. ROIC enables intelligence and multi-function of image equipment. It is a core component for high value added commercialization ultimately. Especially, in development of high-resolution image equipment ROIC, it is necessary that high-integrated and low-power circuit design technology satisfied with design specifications such as detector characteristic, signal dynamic range, readout rate, noise characteristic, ceil pitch, power consumption and so on. In this paper, we implemented a $8\times8$ FPA prototype ROIC for reduction of period and cost. We tested unit block and overall functions of designed $8\times8$ FPA ROIC. Also, we manufactured ROIC control and image boards, and then were able to verify operation of ROIC by confirming detected image from PC's monitor through UART(Universal Asynchronous Receiver Transmitter) communication.

A Property-Based Data Sealing using the Weakest Precondition Concept (최소 전제조건 개념을 이용한 성질 기반 데이터 실링)

  • Park, Tae-Jin;Park, Jun-Cheol
    • Journal of Internet Computing and Services
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    • v.9 no.6
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    • pp.1-13
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    • 2008
  • Trusted Computing is a hardware-based technology that aims to guarantee security for machines beyond their users' control by providing security on computing hardware and software. TPM(Trusted Platform Module), the trusted platform specified by the Trusted Computing Group, acts as the roots for the trusted data storage and the trusted reporting of platform configuration. Data sealing encrypts secret data with a key and the platform's configuration at the time of encryption. In contrast to the traditional data sealing based on binary hash values of the platform configuration, a new approach called property-based data sealing was recently suggested. In this paper, we propose and analyze a new property-based data sealing protocol using the weakest precondition concept by Dijkstra. The proposed protocol resolves the problem of system updates by allowing sealed data to be unsealed at any configuration providing the required property. It assumes practically implementable trusted third parties only and protects platform's privacy when communicating. We demonstrate the proposed protocol's operability with any TPM chip by implementing and running the protocol on a software TPM emulator by Strasser. The proposed scheme can be deployed in PDAs and smart phones over wireless mobile networks as well as desktop PCs.

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A Study on the Telemetry System for the Inhabitant Environment and Distribution of Fish-II -Current Direction, Velocity, Sea Ambient Noise and Distribution of Fishes- (어류의 서식환경과 분포생태의 원격계측에 관한 연구 - II -유향, 유속 및 환경소음과 어류의 분포생태-)

  • 신형일;안영화;신현옥
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.35 no.2
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    • pp.129-135
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    • 1999
  • The telemetry system for the current speed and direction, the underwater ambient noise and the distribution ecology of fishes was constructed by the author and his collaborator in order to product and manage effectively in shallow sea culture and setnets fisheries, and then the experiments for the telemetry system carried out at set net fishing ground located Nungpobay in Kojedo from October 1996 to June 1997. As this results, the techniques suggested in the telemetry system gave full display its function even though far away 1.5 km from transmitting part, but with the suggested telemetry system could not be ascertained relationship between physical environment and distribution ecology of fishes.

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A 2.4-GHz Low-Power Direct-Conversion Transmitter Based on Current-Mode Operation (전류 모드 동작에 기반한 2.4GHz 저전력 직접 변환 송신기)

  • Choi, Joon-Woo;Lee, Hyung-Su;Choi, Chi-Hoon;Park, Sung-Kyung;Nam, Il-Ku
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.12
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    • pp.91-96
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    • 2011
  • In this paper, a low-power direct-conversion transmitter based on current-mode operation, which satisfies the IEEE 802.15.4 standard, is proposed and implemented in a $0.13{\mu}m$ CMOS technology. The proposed transmitter consists of DACs, LPFs, variable gain I/Q up-conversion mixer, a divide-by-two circuit with LO buffer, and a drive amplifier. By combining DAC, LPF, and variable gain I/Q up-conversion mixer with a simple current mirror configuration, the transmitter's power consumption is reduced and its linearity is improved. The drive amplifier is a cascode amplifier with gain controls and the 2.4GHz I/Q differential LO signals are generated by a divide-by-two current-mode-logic (CML) circuit with an external 4.8GHz input signal. The implemented transmitter has 30dB of gain control range, 0dBm of maximum transmit output power, 33dBc of local oscillator leakage, and 40dBc of the transmit third harmonic component. The transmitter dissipates 10.2mW from a 1.2V supply and the die area of the transmitter is $1.76mm{\times}1.26mm$.

FPGA Implementation of Real-time 2-D Wavelet Image Compressor (실시간 2차원 웨이블릿 영상압축기의 FPGA 구현)

  • 서영호;김왕현;김종현;김동욱
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.27 no.7A
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    • pp.683-694
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    • 2002
  • In this paper, a digital image compression codec using 2D DWT(Discrete Wavelet Transform) is designed using the FPGA technology for real time operation The implemented image compression codec using wavelet decomposition consists of a wavelet kernel part for wavelet filtering process, a quantizer/huffman coder for quantization and huffman encoding of wavelet coefficients, a memory controller for interface with external memories, a input interface to process image pixels from A/D converter, a output interface for reconstructing huffman codes, which has irregular bit size, into 32-bit data having regular size data, a memory-kernel buffer to arrage data for real time process, a PCI interface part, and some modules for setting timing between each modules. Since the memory mapping method which converts read process of column-direction into read process of the row-direction is used, the read process in the vertical-direction wavelet decomposition is very efficiently processed. Global operation of wavelet codec is synchronized with the field signal of A/D converter. The global hardware process pipeline operation as the unit of field and each field and each field operation is classified as decomposition levels of wavelet transform. The implemented hardware used FPGA hardware resource of 11119(45%) LAB and 28352(9%) ESB in FPGA device of APEX20KC EP20k600CB652-7 and mapped into one FPGA without additional external logic. Also it can process 33 frames(66 fields) per second, so real-time image compression is possible.

Design of pHEMT channel structure for single-pole-double-throw MMIC switches (SPDT 단일고주파집적회로 스위치용 pHEMT 채널구조 설계)

  • Mun Jae Kyoung;Lim Jong Won;Jang Woo Jin;Ji, Hong Gu;Ahn Ho Kyun;Kim Hae Cheon;Park Chong Ook
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.207-214
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    • 2005
  • This paper presents a channel structure for promising high performance pseudomorphic high electron mobility transistor(pHEMT) switching device for design and fabricating of microwave control circuits, such as switches, phase shifters, attenuators, limiters, for application in personal mobile communication systems. Using the designed epitaxial channel layer structure and ETRI's $0.5\mu$m pHEMT switch process, single pole double throw (SPDT) Tx/Rx monolithic microwave integrated circuit (MMIC) switch was fabricated for 2.4 GHz and 5 GHz band wireless local area network (WLAN) systems. The SPDT switch exhibits a low insertion loss of 0.849 dB, high isolation of 32.638 dB, return loss of 11.006 dB, power transfer capability of 25dBm, and 3rd order intercept point of 42dBm at frequency of 5.8GHz and control voltage of 0/-3V These performances are enough for an application to 5 GHz band WLAN systems.

Design and Implementation of a Virtual MCU Based on SystemC to Provide the Implementation Environment of MAC Layer Software (MAC 계층 소프트웨어의 구현 환경을 제공하기 위한 SystemC 기반의 가상 MCU 모듈의 설계 및 구현)

  • Jeong, Yoo-Jin;Park, Soo-Jin;Lee, Ho-Eung;Park, Hyun-Ju
    • Journal of Internet Computing and Services
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    • v.10 no.6
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    • pp.7-17
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    • 2009
  • The development of wireless communication MAC layer is usually released as SoC which is a combination in hardware and software. In this system development environment, an environment for software development and verification is necessary because the hardware development takes a lot of time priori to completion. In integrated development of hardware and software, simulation environment of hardware and software provided by hardware modeling using HDL at RTL and ISS respectively. By increasing the development complexity of system, ESL design modeling systems at higher abstraction level than RTL has already prompted. The ESL design is divided untime model and time model. This paper present design and implementation of MCU for untime model simulation, not time model. Proposed MCU can optimize the system at early step of system development and move up the development completion time by verifying the system function easily and rapidly than part required exact time in untime model. In this paper, we present an MCU module based on SystemC and UC/OS-II Module providing real-time operate system.

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Design and Reliability Evaluation of 5-V output AC-DC Power Supply Module for Electronic Home Appliances (가전기기용 직류전원 모듈 설계 및 신뢰성 특성 해석)

  • Mo, Young-Sea;Song, Han-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.4
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    • pp.504-510
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    • 2017
  • This paper presents an AC-DC power module design and evaluates its efficiency and reliability when used for electronics appliances. This power module consists of a PWM control IC, power MOSFETs, a transformer and several passive devices. The module was tested at an input voltage of 220V (RMS) (frequency 60 Hz). A test was conducted in order to evaluate the operation and power efficiency of the module, as well as the reliability of its protection functions, such as its over-current protection (OVP), overvoltage protection (OVP) and electromagnetic interference (EMI) properties. Especially, we evaluated the thermal shut-down protection (TSP) function in order to assure the operation of the module under high temperature conditions. The efficiency and reliability measurement results showed that at an output voltage of 5 V, the module had a ripple voltage of 200 mV, power efficiency of 73 % and maximum temperature of $80^{\circ}C$ and it had the ability to withstand a stimulus of high input voltage of 4.2 kV during 60 seconds.