The Journal of Korean Institute of Next Generation Computing
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v.15
no.2
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pp.39-49
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2019
Recently, CPU-GPU integrated heterogeneous multicore processors have been widely used for improving the performance of computing systems. Heterogeneous multicore processors integrate CPUs and GPUs on a single chip where CPUs and GPUs share the LLC(Last Level Cache). This causes a serious cache contention problem inside the processor, resulting in significant performance degradation. In this paper, we propose the partitioned LLC architecture to solve the cache contention problem in heterogeneous multicore processors. We analyze the performance impact varying the LLC size of CPUs and GPUs, respectively. According to our simulation results, the bigger the LLC size of the CPU, the CPU performance improves by up to 21%. However, the GPU shows negligible performance difference when the assigned LLC size increases. In other words, the GPU is less likely to lose the performance when the LLC size decreases. Because the performance degradation due to the LLC size reduction in GPU is much smaller than the performance improvement due to the increase of the LLC size of the CPU, the overall performance of heterogeneous multicore processors is expected to be improved by applying partitioned LLC to CPUs and GPUs. In addition, if we develop a memory management technique that can maximize the performance of each core in the future, we can greatly improve the performance of heterogeneous multicore processors.
The existing smart grid device authentication system is concentrated on DCU, meter reading FEP and MDMS, and the authentication system for smart meters is not established. Although some cryptographic chips have been developed at present, it is difficult to complete the PKI authentication scheme because it is at the low level of simple encryption. Unlike existing power grids, smart grids are based on open two-way communication, increasing the risk of accidents as information security vulnerabilities increase. However, PKI is difficult to apply to smart meters, and there is a possibility of accidents such as system shutdown by sending manipulated packets and sending false information to the operating system. Issuing an existing PKI certificate to smart meters with high hardware constraints makes authentication and certificate renewal difficult, so an ultra-lightweight password authentication protocol that can operate even on the poor performance of smart meters (such as non-IP networks, processors, memory, and storage space) was designed and implemented. As a result of the experiment, lightweight cryptographic authentication protocol was able to be executed quickly in the Cortex-M3 environment, and it is expected that it will help to prepare a more secure authentication system in the smart grid industry.
The Journal of the Convergence on Culture Technology
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v.9
no.6
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pp.967-971
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2023
Recently, a variety of AI-based platform services are available, and one of them is ChatGPT that processes a large quantity of data in the natural language and generates an answer after self-learning. ChatGPT can perform various tasks including software programming in the IT sector. Particularly, it may help generate a simple program and correct errors using C Language, which is a major programming language. Accordingly, it is expected that ChatGPT is capable of effectively using Verilog HDL, which is a hardware language created in C Language. Verilog HDL synthesis, however, is to generate imperative sentences in a logical circuit form and thus it needs to be verified whether the products are executed properly. In this paper, we aim to select small-scale logical circuits for ease of experimentation and to verify the results of circuits generated by ChatGPT and human-designed circuits. As to experimental environments, Xilinx ISE 14.7 was used for module modeling, and the xc3s1000 FPGA chip was used for module embodiment. Comparative analysis was performed on the use area and processing time of FPGA to compare the performance of ChatGPT products and Verilog HDL products.
Journal of the Institute of Electronics Engineers of Korea TC
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v.46
no.12
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pp.6-13
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2009
For X-band phased array systems, a power amplifier, a 6-bit phase shifter, a 6-bit digital attenuator, and a SPDT transmit/receive (T/R) switch are fabricated and measured. All circuits are demonstrated by using CMOS 0.18 um technology. The power amplifier has 2-stage differential and cascade structures. It provides 1-dB gain-compressed output power ($P_{1dB}$) of 20 dBm and power-added-efficiency (PAE) of 19 % at 8-11 GHz frequencies. The 6-bit phase shifter utilizes embedded switched filter structure which consists of nMOS transistors as a switch and meandered microstrip lines for desired inductances. It has $360^{\circ}$ phase-control range and $5.6^{\circ}$ phase resolution. At 8-11 GHz frequencies, it has RMS phase and amplitude errors are below $5^{\circ}$ and 0.8 dB, and insertion loss of $-15.7\;{\pm}\;1,1\;dB$. The 6-bit digital attenuator is comprised of embedded switched Pi-and T-type attenuators resistive networks and nMOS switches and employes compensation circuits for low insertion phase variation. It has max. attenuation of 31.5 dB and 0.5 dB amplitude resolution. Its RMS amplitude and phase errors are below 0.4 dB and $2^{\circ}$ at 8-11 GHz frequencies, and insertion loss is $-10.5\;{\pm}\;0.8\;dB$. The SPDT T/R switch has series and shunt transistor pairs on transmit and receive path, and only one inductance to reduce chip area. It shows insertion loss of -1.5 dB, return loss below -15 dB, and isolation about -30 dB. The fabricated chip areas are $1.28\;mm^2$, $1.9mm^2$, $0.34\;mm^2$, $0.02mm^2$, respectively.
The Journal of Korean Institute of Communications and Information Sciences
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v.27
no.12C
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pp.1288-1298
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2002
To implement elliptic curve cryptosystem in GF(2$\^$m/) at high speed, a fast divider is required. Although bit-parallel architecture is well suited for high speed division operations, elliptic curve cryptosystem requires large m(at least 163) to support a sufficient security. In other words, since the bit-parallel architecture has an area complexity of 0(m$\^$m/), it is not suited for this application. In this paper, we propose a new serial-in serial-out systolic array for computing division operations in GF(2$\^$m/) using the standard basis representation. Based on a modified version of tile binary extended greatest common divisor algorithm, we obtain a new data dependence graph and design an efficient bit-serial systolic divider. The proposed divider has 0(m) time complexity and 0(m) area complexity. If input data come in continuously, the proposed divider can produce division results at a rate of one per m clock cycles, after an initial delay of 5m-2 cycles. Analysis shows that the proposed divider provides a significant reduction in both chip area and computational delay time compared to previously proposed systolic dividers with the same I/O format. Since the proposed divider can perform division operations at high speed with the reduced chip area, it is well suited for division circuit of elliptic curve cryptosystem. Furthermore, since the proposed architecture does not restrict the choice of irreducible polynomial, and has a unidirectional data flow and regularity, it provides a high flexibility and scalability with respect to the field size m.
In this study, waste air containing ethanol and hydrogen sulfide, was treated by an integrated hybrid system composed of two alternatively-operating UV/photocatalytic reactor-process and biofilter processes of a biofilter system having two units with an improved design (R reactor) and a conventional biofilter (L reactor). Both a pressure drop (△p) per unit process of the integrated hybrid system and a microbe-population-distribution of each biofilter process were observed. The △p of the UV/photocatalytic reactor process turned out very negligible. The △p of the L reactor was observed to increase continuously to 4.0~5.0 mmH2O (i.e., 5.0~6.25 mmH2O/m). In case of R reactor, its △p showed the one below ca. 16~20% of the △p of the L reactor. Adopting such microbes-carrying biofilter media with high porosity as waste-tire crumb media, and the improved biofilter design, contributed to △p of this study, reduced by ca. 37~50% and 40~53%, respectively, from the reported △p of conventional biofilter packed with biofilter media of the mixture (50:50) of wood chip and wood bark. In addition, the △p of R reactor in this study, reduced by ca. 80% from the reported △p of conventional biofilter packed with biofilter media of the mixture (75:25) of scoria with high porosity and compost, was mainly attributed to adopting the improved biofilter design. On the other hand, in case of L reactor, the CFU counts in its lowest column was analyzed double as much as those in any other columns. However, in case of R reactor, its CFU counts were bigger by 50% than the one of L reactor and its microbes were evenly distributed at its higher and lower columns of Rdn reactor and Rup reactor. This phenomena was attributed to an even moisture distribution of 50~55% of R reactor at its higher and lower columns. Therefore, R reactor showed superb characteristics in terms of both △p and microbe-population-distribution, compared to L reactor.
Journal of the Institute of Electronics Engineers of Korea SD
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v.40
no.3
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pp.43-53
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2003
Unlike in analog display devices, the physical screen resolution in digital devices are fixed from the manufacturing. It is a weak point on digital devices. The screen resolution displayed in digital display devices is varied. Thus, interpolation or decimation of the resolution on the display is needed to make the input pixels equal to the screen resolution., This process is called image scaling. Many researches have been developed to reduce the hardware cost and distortion of the image of image scaling algorithm. In this paper, we proposed a Winscale algorithm. which modifies the scale up/down in continuous domain to the scale up/down in discrete domain. Thus, the algorithm is suitable to digital display devices. Hardware implementation of the image scaler is performed using Verilog XL and chip is fabricated in a 0.5${\mu}{\textrm}{m}$ Samsung SOG technology. The hardware costs as well as the scalabilities are compared with the conventional image scaling algorithms that are used in other software. This Winscale algorithm is proved more scalable than other image-scaling algorithm, which has similar H/W cost. This image-scaling algorithm can be used in various digital display devices that need image scaling process.
Journal of the Institute of Electronics Engineers of Korea SP
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v.40
no.5
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pp.312-321
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2003
In this paper, we implement robot which are ability to recognize obstacles and moving automatically to destination. we present two results in this paper; hardware implementation of image processing board and software implementation of visual feedback algorithm for a self-controlled robot. In the first part, the mobile robot depends on commands from a control board which is doing image processing part. We have studied the self controlled mobile robot system equipped with a CCD camera for a long time. This robot system consists of a image processing board implemented with DSPs, a stepping motor, a CCD camera. We will propose an algorithm in which commands are delivered for the robot to move in the planned path. The distance that the robot is supposed to move is calculated on the basis of the absolute coordinate and the coordinate of the target spot. And the image signal acquired by the CCD camera mounted on the robot is captured at every sampling time in order for the robot to automatically avoid the obstacle and finally to reach the destination. The image processing board consists of DSP (TMS320VC33), ADV611, SAA7111, ADV7l76A, CPLD(EPM7256ATC144), and SRAM memories. In the second part, the visual feedback control has two types of vision algorithms: obstacle avoidance and path planning. The first algorithm is cell, part of the image divided by blob analysis. We will do image preprocessing to improve the input image. This image preprocessing consists of filtering, edge detection, NOR converting, and threshold-ing. This major image processing includes labeling, segmentation, and pixel density calculation. In the second algorithm, after an image frame went through preprocessing (edge detection, converting, thresholding), the histogram is measured vertically (the y-axis direction). Then, the binary histogram of the image shows waveforms with only black and white variations. Here we use the fact that since obstacles appear as sectional diagrams as if they were walls, there is no variation in the histogram. The intensities of the line histogram are measured as vertically at intervals of 20 pixels. So, we can find uniform and nonuniform regions of the waveforms and define the period of uniform waveforms as an obstacle region. We can see that the algorithm is very useful for the robot to move avoiding obstacles.
Journal of the Korea Society of Computer and Information
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v.16
no.7
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pp.1-11
/
2011
Many researchers have studied on the methods to improve the processor performance. However, high integrated semiconductor technology for improving the processor performance causes many problems such as battery life, high power density, hotspot, etc. Especially, as hotspot has critical impact on the reliability of chip, thermal problems should be considered together with performance and power consumption when designing high-performance processors. To alleviate the thermal problems of processors, there have been various researches. In the past, mechanical cooling methods have been used to control the temperature of processors. However, up-to-date microprocessors causes severe thermal problems, resulting in increased cooling cost. Therefore, recent studies have focused on architecture-level thermal-aware design techniques than mechanical cooling methods. Even though architecture-level thermal-aware design techniques are efficient for reducing the temperature of processors, they cause performance degradation inevitably. Therefore, if the mechanical cooling methods can manage the thermal problems of processors efficiently, the performance can be improved by reducing the performance degradation due to architecture-level thermal-aware design techniques such as dynamic thermal management. In this paper, we analyze the cooling efficiency of high-performance multicore processors according to mechanical cooling methods. According to our experiments using air cooler and liquid cooler, the liquid cooler consumes more power than the air cooler whereas it reduces the temperature more efficiently. Especially, the cost for reducing $1^{\circ}C$ is varied by the environments. Therefore, if the mechanical cooling methods can be used appropriately, the temperature of high-performance processors can be managed more efficiently.
Gyu Cheol Choi;KyungBeom Kim;Bonghwan Kim;Jong Min Kim;SangMok Chang
Clean Technology
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v.29
no.4
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pp.255-261
/
2023
Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.
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