(Electromigration Behavior of Flip Chip-bonded Sn-3.5Ag-0.5Cu Solder bumps) (플립 칩 본딩된 Sn-3.5Ag-0.5Cu 솔더범프의 electromigration 거동)
-
- Proceedings of the International Microelectronics And Packaging Society Conference
- /
- 2004.11a
- /
- pp.68-68
- /
- 2004