Study on the Failure Mechanism of a Chip Resistor Solder Joint During Thermal Cycling for Prognostics and Health Monitoring (고장예지를 위한 온도사이클시험에서 칩저항 실장솔더의 고장메커니즘 연구)
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- Transactions of the Korean Society of Mechanical Engineers A
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- v.35 no.7
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- pp.799-804
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- 2011