• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.775-778
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• 2000

Single point diamond turning technique fur optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. SPDT has been widely used in manufacturing optical reflectors of non-ferrous metals such as aluminum and copper which are easy to be machined for their proper ductility. But optical crystals being discussed here are characterized by their high brittleness which makes it difficult to obtain high quality optical surfaces on them. The purpose of cur research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result, the cutting force is steady, the cutting force range is 0.05-0.08N. The surface roughness is good when spindle is above 1400rpm. and feed rate is small. The influence of depth of cut is very small.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.993-998
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• 2002

Ultra precision processing technology is the field which is seriously protected its technology by advanced nations. Because of this reason, this technology is very difficult to supply for domestic companies, also domestic companies are revealed the limit of technology development by itself. And then, those are depend on the technology development of advanced nation, domestic companies are not conquer application step with already developed parts. Of course, some cases of its research are succeed. those are included element technology, system technology and so on, for development of ultra precision processing system. To conquer technology holding ultra precision processing accuracy of no level, active research are needed. In this paper, stability of ultra precision cutting unit is analyzed, this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for un it control.

• 한국생산제조학회지
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• 제20권3호
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• pp.268-273
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• 2011

In light guide panels, the PMMA sheet that is used in liquid crystal displays plays an important role in scattering the incident light and requires very fine machining as the sheet is directly related to the optical characteristics of the panels. High speed end milling(HSE) and high speed shaping(HSS) processes that are widely adopted and applied to the precise machining of light incident plane through vibration-assisted HSS for increasing the optical quality by minimizing the above-mentioned problems. The cutting tool and the tool post presented in this paper are designed by the authors to increase the magnitude of the cutting stroke by adopting the resonant frequency without weakening the stiffness and to reduce vibrations during even high speed feeding. The dynamic haracteristics of thecutting tool and the tool post are evaluated through simulation and experiment as well. The results reveal very appropriate dynamic characteristics for vibration-assisted HSS.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.444-447
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• 2005

This paper is described about the technique of ultra-precision machining for a infrared camera aspheric mirror. A 200 mm diameter aspheric mirror was fabricated by SPDTM. Aluminum alloy as mirror substrates is known to be easily machined, but not polishable due to its ductility. Aspheric large reflector without a polishing process, the surface roughness of 5 nm Ra, and the form error of $\lambda/2\;(\lambda=632.8 nm)$ for reference curved surface 200 mm has been required. The purpose of this research is to find the optimum machining conditions for cutting reflector using A16061-T651 and apply the SPDTM technique to the manufacturing of ultra precision optical components of Al-alloy aspheric reflector.

• 한국기계가공학회지
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• 제6권4호
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• pp.50-56
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• 2007

This study aims to find the optimal cutting conditions, when are IR Detection device HgCdTe is machined with diamond tool of diamond turning machine. Machining technique for HgCdTe with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. It has been found HgCdTe has more and more important applications in the field of modern optics. The purpose of our research is to find the optimum machining conditions for ductile cutting of HgCdTe and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.939-942
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• 2000

Single point diamond turning technique for optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material.

• 한국기계가공학회지
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• 제4권1호
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• pp.43-48
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• 2005

This paper is described about the technique of ultra-precision machining for an aerospace aspheric mirror. The reflection mirror system generates parallel beams inside a thermal vacuum chamber. A 200mm diameter aspheric mirror was fabricated by SPDTM. Aluminum alloy as mirror substrates is known to be easily machined, but not polishable due to its ductility. Aspheric large reflector without a polishing process, the surface roughness of 10nm Ra, and the form error of ${\lambda}/2$ (${\lambda}$=632.8nm) for reference curved surface 200mm has been required. The purpose of this research is to find the optimum machining conditions for cutting reflector using Al6061-T651 and apply the SPDTM technique to the manufacturing of ultra precision optical components of Al-alloy aspheric reflector.

• 기계저널
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• 제30권4호
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• pp.367-373
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• 1990

초정밀 절삭용 다이아몬드 공구의 날끝 형상에 관해서는 여러 가지 설계안이 개발되어 제각기 성공적으로 사용되고 있지만 제품 품질의 균일성, 즉 성능과 수명의 차이는 아직까지 미해결이다. 또한, 초정밀공구의 날끝 능선에 관해서 최근 측정 데이터가 발표되고 있으나, 양호한 날끝능선, 불량한 능선 및 소정의 다듬질이 이루어지지 못하고 수명에 달해버린 능선 등에 대한 제각기의 형상, 구조 등이 밝혀지지 않고 있으며, 공구의 제작법을 개발하는 것은 금후의 연구과제로 남 아있다. 그리고, 단결정 바이트의 연마에 대해서는 많은 기술적인 진전이 이루어져 왔으나, 수 명의 차이는 해결하지 못하고 있다. 이는 날끝능선의 연마방향과 더불어 다이아몬드의 이방성, 원석의 품질 등과 관련이 있다고 볼 수 있다. 공구의 마멸과정이 결정방위에 의존하는 것은 당연하겠지만, 공구의 연마가공에서는 이방성 그 자체가 공구마멸에 나타나는 문제 및 경사면과 여유면의 마멸과 달리 예리한 인선을 둔화시키는 날끝 능선의 마멸은 어떻게 진행되는가가 문 제이며, 공구의 결정방위와 성능, 수명과의 관련은 실험적으로 해명되어야 할 것이다. 또한 재 료인 다이아몬드 원석에 있어서도, 커다란 결함이 발견된 것은 제외되지만 극히 경미한 결함은 어디까지 허용될 것인지가 문제이다. 내부응력, 착색 등 결함의 인자는 다양하지만 제각기 공구 의 성능 및 수명과의 관련은 명확하게 밝혀져 있지 않다. 이러한 인자 중에서도 어느 것이 가장 크게 영향을 미치는지 확인된다면 커다란 진보가 이루어질 것으로 기대된다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.34-34
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• 2004

정보의 급속한 발전, 컴퓨터, 가전기기, 자동차등 내구 소비재의 제품 개발기간 단축, 생산자의 지속적인 생산성 향상 활동, 소비자 선호의 다양성, 품질 요구 수준 상승 등 제반 환경변화는 절삭가공부분에 있어 핵심이 되고 있다. 여기에 전통적 제조업의 고부가가치화 및 새로운 시스템의 도입 등과 맞물려 최근의 초정밀 공작기계는 고속화, 고정밀화를 바탕으로 크게 발전하고 있다, 특히 21세기로 향하는 지금 공작기계 기술은 고속화, 정밀화, 개방화, 환경친화의 방향으로 혁신을 지속하고 있으며, 머지 않아 마이크로 프로세서의 급속한 발전에 힘입어 고속화 기술은 극 초고속화 단계로, 정밀화 기술은 극 초정밀화 단계로, CNC 기술은 오픈화 및 네트워크화를 통한 다양한 통신기술이 부가됨으로써 설계, 생산, 영업 및 서비스 정보와 연계시켜 통합제어를 통한 타 지역의 공작기계를 원격제어 할 수 있는 단계로 이르게 될 것이다.(중략)

• 한국공작기계학회논문집
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• 제18권1호
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.