• 한국진공학회지
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• 제2권3호
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• pp.304-313
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• 1993

집속 이온빔 기술은 고해상도의 이온빔 리토그라피, 마스크가 필요없는 이온주입, 그리고 Ion beam induced deposition 등 반도체 소자의 미세가공에 널리 이용되어 왔다. 좋은 안정도와 높은 전류밀도, 적은 에너지 퍼짐 그리고 낮은 에미턴스와 높은 선명도를 갖는 집속 이온빔 장비를 위한 액체 갈륨 이온원이 한국에서 개발 시업되었다. 이온빔의 전압이 15kV, 렌즈전압이 7kV 그리고 렌즈상단에 위치한 aperture의 직경이 0.2mm일 때, 0.1$mu extrm{m}$의 빔 직경으로 집속되는 정전 einzel렌즈가 설계 조립되었고, FIB 진공 chamber는 렌즈부와의 차 등 진공시스템으로 구성되어 설계제작되었다. FIB 장비가 조만간 한국에서 이온빔 밀링, ion beam induced deposition 그리고 잘못된 부분의 수정 등 반도체 제작공정에서의 응용에 큰 기여를 할 것이라 기대된다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.779-780
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• 2011

• 한국공작기계학회논문집
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• 제16권5호
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• pp.129-133
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• 2007

Focused Ion Beam(FIB) systems is a useful tool for the fabrication of micro-nano scale structures. In this study, the effects of FIB etching on the Au microstructure are systematically investigated. As the fabrication parameters, ion dose, dwell time and beam overlap ratio are studied. First, the increases of Ga ion dose makes the milling yield higher and the sidewall of milling profile steeper. Dwell time is found to have little effects on the milling profile due to the relatively large milling area of $1\times1{\mu}m^2$ used in this study. However, beam overlap significantly affects not only milling rate but also milling profile. As the beam overlap ratio changes from positive to negative, the development of regular cross-stripe patterns at the bottom with low milling rate is observed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.111-112
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• 2008

• 한국정밀공학회지
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• 제28권2호
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• pp.245-250
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• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2011년도 제37회 추계학술대회논문집
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• pp.493-496
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• 2011

본 논문은 이온빔 기술에 대하여 발표된 논문을 중심으로 조사하였다. 이온빔의 기술은 기질이나 가공물에서 표면을 깎아내는 기법과 이와 반대로 표면에 이온을 증착 개질 시키는 두 가지로 크게 대별할 수 있고 문헌상으로는 후자가 더욱 활발하다.

• 한국군사과학기술학회지
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• 제14권6호
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• pp.1107-1113
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• 2011

In this paper, ion beam technology was investigated through the published papers. Ion beam technology is mainly used by the focused ion beams. There are two different types of application methods. One method is to remove the material from the substrate, the other one is to deposit the materials on the surface of the substrate or specimen. Based on the literature review there are 1.5 times more published research papers related to the deposition than those of the removal.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.109-110
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.489-490
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• 2006

To establish fabrication techniques for nano structure understanding of focused ion beam (FIB) milling process is required. In this study the mathematical model containing the factors related to FIB milling is developed to acquire the optimal fabrication condition. Then, the model is verified by comparison with various nano pattern fabricated in actual FIB system. Consequently, it is demonstrated that the nano patterns with the smallest pitch can be fabricated using developed FIB milling model.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.322-325
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• 2005

The shrinking critical dimensions of modern technology place a heavy requirement on optimizing feature shapes at the micro- and nano scale. In addition, the use of ion beams in the nano-scale world is greatly increased by technology development. Especially, Focused ion Beam (FIB) has a great potential to fabricate the device in nano-scale. Nevertheless, FIB has several limitations, surface swelling in low ion dose regime, precipitation of incident ions, and the re-deposition effect due to the sputtered atoms. In recent years, many approaches and research results show that the re-deposition effect is the most outstanding effect to overcome or reduce in fabrication of micro and nano devices. A 2D string based simulation software AMADEUS-2D $(\underline{A}dvanced\;\underline{M}odeling\;and\;\underline{D}esign\;\underline{E}nvironment\;for\;\underline{S}putter\;Processes)$ for ion milling and FIB direct fabrication has been developed. It is capable of simulating ion beam sputtering and re-deposition. In this paper, the 2D FIB simulation is demonstrated and the characteristics of ion beam induced direct fabrication is analyzed according to various parameters. Several examples, single pixel, multi scan box region, and re-deposited sidewall formation, are given.