• Proceedings of the Korea Information Processing Society Conference
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• 2009.04a
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• pp.1519-1522
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• 2009

Jini 2.x 표준의 보안 모델은 클라이언트와 서버간의 신뢰와 안전한 통신을 위해 크게 3 가지 순차적인 과정을 요구한다. 순서대로, 프락시 준비, 상호인증을 위한 자격증명과 신원의 확인, 세션의 암호화 연산이다. 첫 번째 프락시 준비 과정은 다운로드 서비스프락시가 올바른 출처에서 온 안전한 이동코드인가를 검증하는 과정을 요구하고, 보안 제약조건과 동적 권한부여 구성을 완료하는 과정을 포함한다. 나머지 두 과정은 기존 X.509 인증서 기반의 TLS/SSL 통신이 요구하던 과정과 유사하다. 프락시 준비 과정은 클라이언트-서버 양측에 안전하고 신뢰 할 수 있는 스텁(stub)을 준비하는 시간이기 때문에 실질적인 통신지연 요소에 들지 않는다. 그러나 나머지 과정들은 기존 SSL 통신이 갖는 오버헤드를 가지고 있다는 것을 본 논문의 실험에서 확인하였다. 본 논문에서는 프락시 준비 과정에서 상호 인증정보와 세션 키를 확보하기 위한 Jini 서비스 구조와 방법을 제시하고 서비스 연결 지연을 단축한 실험결과를 논한다.

• Journal of the Korea Society of Computer and Information
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• v.19 no.6
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• pp.101-108
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• 2014

The parallel machine scheduling is to schedule each job to exactly one parallel machine so that the total completion time is minimized. It is used in various manufacturing system areas such as steel industries, semiconductor manufacturing and plastic industries. Each job has a setup phase and a processing phase. A removal phase is needed in some application areas. A processing phase is performed by a parallel machine alone while a setup phase and a removal phase are performed by both a server and a parallel machine simultaneously. Most of previous researches used a single server and considered only a setup phase and a processing phase. If a single server is used for scheduling, the bottleneck in the server increases the total completion time. Even though the number of parallel machines is increased, the total completion time is not reduced significantly. In this paper, we have proposed an efficient algorithm for the parallel machine scheduling using multiple servers and considering setup, processing and removal phases. We also have investigated experimentally how the number of servers and the number of parallel machines affect the total completion time.

• The Journal of the Convergence on Culture Technology
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• v.5 no.4
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• pp.87-92
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• 2019

The purpose of this study is to investigate the preparation time of fire-fighting water for public fire hydrants and ground, underground fire hydrants. The equipment preparation time for stage 1 was 20.50 seconds for ground type and 24.67 seconds for underground type. The reason for this difference in preparation time is that an underground fire hydrant requires additional standpipes to connect to the main conduit of Paru and the underground hydrant, which open the manhole cover. Water tank Maintenance joint with water hose male coupling of the second stage was similar to that of the ground type of 48.50 seconds and underground water tipe of 49.00 seconds. This is because the operation of connecting the fire hose to the maintenance tank of the water tank car is the same. In the third stage, the water pipe connection was 43 seconds for ground type and 174.33 seconds for underground type. The reason why the time for connecting the water pipe to the fire hydrant is large difference is that the underground fire hydrant is opened by opening the manhole cover, After connecting the stand pipe to the fire hydrant, the additional process of connecting the water pipe to the stand pipe is required, which is considered to have greatly increased the time required. The opening of Water Control Valve and spindle Valve in the fourth stage was 66.50 seconds for the ground type and 78.83 seconds for the underground type. This difference is due to the fact that the spindle of the ground fire hydrant is located on the main body and can be easily opened, but the underground type is located next to the main body under the manhole and requires additional time to connect the opening equipment.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.8
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• pp.883-890
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• 2015

As the semiconductor processing technology has been developing, multiple cores or NoC(network on chip) can be contained in recent chips. GALS(globally asychronous locally synchronous) clocking scheme that has multi-clock domains with different frequencies or phase differences is widely used to solve power consumption and clock skew in a large chip with a single clock. A synchronizer is needed to avoid a synchronization problem between sender and receiver in GALS. In this paper, the setup and hold time of DFF required to design the synchronizer are measured using 180nm CMOS processing parameters depending on temperature, supply voltage, and the size of inverter in DFF. The simulation results based on the bisection method in HSPICE show that the setup and hold time are proportional to temperature, however they are inversely proportional to supply voltage, and negative values are measured for the hold time.

• Korean Management Science Review
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• v.5 no.2
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• pp.48-56
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• 1988

본 연구에서는 생산능력제약이 주어지는 경우에 있어서 가동준비시간의 절감효과 분석을 위한 모형을 수립하고 이 모형을 이용하여 여러가지 분석을 하고 마지막으로 알고리즘을 제시하였다. 특히 동적수요를 가정함으로써 기존의 EOQ모형연구에서 분석할 수 없었던 분석이 가능하였고, 수요가 변동하는 상황이라 하더도 생산능력제약이 없는 경우의 결과가 나올 수 있음을 보였다.

• Korean Deer Journal
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• v.6 no.8 s.37
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• pp.60-61
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• 2001

• 프린팅코리아
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• s.60
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• pp.123-123
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• 2007

• The Monthly Diabetes
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• s.141
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• pp.45-46
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• 2001

• The Optical Journal
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• v.13 no.2 s.72
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• pp.23-27
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• 2001

이번 호는 작업관리르 다룬다. 작업 관리는 작업 룰(규율) 관리, 준비 교체 작업 관리, 작업 개선관리의 세 시스템으로 대별할 수 있다. 이와 함께 소정의 표준작업조건 아래서 일정한 작업방법에 따라서 숙련된 작업자가 정상적인 속도로 작업을 수행하는 데 필요한 시간인 '표준 작업시간'을 이해하고, 표준 작업시간 측정방법 가운데 Stop Watch법을 자세히 알아보기로 하자.

• Applied Microscopy
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• v.34 no.2
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• pp.95-102
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• 2004

The TEM samples prepared by ion milling have the advantage that thin area can be obtained from almost any materials. However, it has the disadvantage that the amount of thin area can often be quite limited. For the cross-sectioned samples and grossly heterogeneous materials, the thickness of less than $0.1{\mu}m$ can be achieved by mechanical grinding and polishing (tripod polisher) and then the TEM samples may be ion-milled for final thinning or cleaning. These approaches were described in this paper. Examples of TEM observations were taken from cross-section samples of thin films on silicon and sapphire, from diffusion layers between $Mo_5Si_3\;and\;Mo_2B$, and from rapidly solidified 304 stainless steel powders embedded in electroplated copper.