• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.7
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• pp.17-22
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• 2008

This paper presents a low-power and small-area pulse width modulator by light intensity for photoflash. Light intensity controller is achieved by using capacitor, photodiode, and comparator. The proposed circuit designs digital circuit to reduce static power consumption except comparator. And IGBT driver has short circuit protection using delay cell. The pulse width modulator has the operating range of $V_{MS}$ from 0.5V to 2.5V and pulse width of output from 0.14ms to 1.65ms at 300Hz. The pulse width modulator fabricated in $0.35-{\mu}m$ CMOS technology occupies $0.85mm{\times}0.56mm$. This circuit consumes 3.0mW at 300Hz and 3.0V.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.5
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• pp.52-59
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• 1989

The reliability of the thin thermal oxide was investigated by using constant current stress method. Polysilicon gate MOS capacitors with oxide thickness range of 20-25nm were used in this experiment. Automatic measurement and statistical data analysis which were essential in reliability evaluation of VLSI process preformed by HP 9000 computer. Based on TDDB results, defect density, breakdown charge (Qbd) and lifetime of oxide film were evaluated. According to the polarity of the stress, some different characteristics were shown. Defect density was 62/$cm^2$ at negative gate injection. The value of Qbd was about 30C/$cm^2$ at positive gate injection, and about 21C/$cm^2$ at negative. The current density acceleration factor was 1.43$cm^2$/A for negative gate injection, and 1.25$cm^2$/A for positive gate injection.

• Journal of Advanced Navigation Technology
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• v.21 no.3
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• pp.220-229
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• 2017

In this paper, To take advantage a variety of DC power as the boost DC-DC converter design specifications through the inductor L and capacitor C through PSPICE to calculate the best estimate of the value. Boost DC-DC converter with a switch device using IRF840 and reverse recovery time Schottky diodes with excellent with constant current controller using D10SC6M and resistance can be configured to considering the Power LED Module was driven by the production. Converter's switching frequency is 50 kHz, the first Duty Rate was made to increase gradually depending on the value of the detection were, 10 % in the output voltage. As a result, the simulated Boost Power LED driver characteristics is in comparison with the design specifications, 5% or less as the error was approximated. Finally, when input 15 V were offered, a stable output 24 V were obtained. and Dimming Control through the adjustment of brightness and current consumption were possible.

• Journal of the Korean Magnetics Society
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• v.14 no.3
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• pp.109-113
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• 2004

GMR isolator was modeled using a Wheatstone bridge which is profitable for transmitting rectangular wave digital data, and the output voltage characteristics in relation to the input current were investigated in time domain. GMR isolator modeling was divided into two parts, namely magnetic and electric parts. The flow chart of the modeling was drawn in which measured MR curve of the spin valves were incorporated to obtain the electrical voltage output. For magnetic modeling, 3-dimensional model of planar coil was analyzed by FEM method to obtain the magnetic field strength corresponding to the input current. For electric modeling, resistance, inductance and capacitance of the planar coil were calculated and magnetic field waveform was obtained corresponding to the coil current waveform in time domain. Finally, MR-H curves of spin valves and the magnetic field waveform at the spin valves were composited to obtain the output voltage waveform of the isolator. Even though the amplitude of the coil current waveform was increased by 100％, decreased by 90％, or delayed by 10％ of the period compared with the input current, similar transmitted output voltage waveform to the input current waveform was obtained due to hysteretic characteristics of the spin valves at the transmission speed of over 400 Mbit/s.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.14 no.4
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• pp.65-72
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• 2000

This paper proposes a Push type High Frequency DC-DC Converter using Zero Voltage Switching to reduce turn on and off loss at the switching instants. This paper has a advantage which is able to operating safely in load short, because DC reactor is connected with resonance reactor in order to supply a fixed safely in load short, because DC reactor is connected with resonance reactor in order to supply a fixed current with low ripple from DC power supply. The capacitor $(C_1, C_2)$ connected in switch are a common using as resonance capacitor and ZVS capacitor. The analysis of the proposed high frequency resonance DC-DC converter is generally described by using normallized parameter, and we has evaluated characteristic values which is needed to design a circuit. We conform a rightfulness of theoritical analysis by comparing a theoretical values and experimental values obtained from experiment using MOSFET as switching devices.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.8
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• pp.1-8
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• 2004

Experimental results are presented for gate oxide degradation, such as SILC and soft breakdown, and its effect on device parameters under negative and positive bias stress conditions using n-MOSFET's with 3 nm gate oxide. The degradation mechanisms are highly dependent on stress conditions. For negative gate voltage, both interface and oxide bulk traps are found to dominate the reliability of gate oxide. However, for positive gate voltage, the degradation becomes dominated mainly by interface trap. It was also found the trap generation in the gate oxide film is related to the breakage of Si-H bonds through the deuterium anneal and additional hydrogen anneal experiments. Statistical parameter variations as well as the “OFF” leakage current depend on both electron- and hole-trapping. Our results therefore show that Si or O bond breakage by tunneling electron and hole can be another origin of the investigated gate oxide degradation. This plausible physical explanation is based on both Anode-Hole Injection and Hydrogen-Released model.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.8
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• pp.45-51
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• 2008

HID(High Intensity Discharge) search lamp for shipment requires a high open circuit and output current compare than vehicle. This paper presents a soft-start open circuit voltage and constant current sequence control method for 2.5[kW] HID search lamp. The proposed method controls the opal circuit voltage and discharge current of HID lamp according to ignition signal with a simple 8-bit micro-processor and PWM device. For the stable control of lamp, micro-processor checks the output voltage and current. And the checked signals are compared with ignition signal and changes the control mode for stable operation. An ignition signal and micro-processor change the control mode from open circuit voltage contort to constant current control. The proposed control scheme is verified from experimental tests of 2.5[kW] HID search lamp for shipment.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.

• Journal of the Institute of Convergence Signal Processing
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• v.7 no.4
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• pp.195-200
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• 2006

The conventional discrete circuit for ABS/TCS system was examined and the problems of the system were analyzed by computer simulation. In order to improve the performance of ABS/TCS system, interface IC which has error compensation, comparator and under voltage lock-out circuit was designed and their electrical characteristics were investigated. The voltage regulator was included to compensate the temperature variation in the temperature range from $-20^{\circ}C$ to $120^{\circ}C$ for automobile environment. ABS and brake signal were separated using the duty factor of same frequency or different frequencies. UVLO(Under Voltage Lock-Out) circuit and constant current circuit were applied for the elimination of noise, and protection circuit was applied to cut the excess current off. Layout for IC fabrication was designed to enhance the electrical performance of ABS/TCS system. Layout was consisted of 11 masks, arrayed effectively 8 pads to reduce the current loss. We can see that the result of layout simulation was better than the result of bread board.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.45-47
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• 2002

반도체 소자의 고집적화 및 고속화가 요구됨에 따라 MOSFET 구조의 게이트 절연막으로 사용되고 있는 SiO₂ 박막의 두께를 감소시키려는 노력이 이루어지고 있다. 0.1㎛ 이하의 소자를 위해서는 15Å 이하의 두께를 갖는 SiO₂가 요구된다. 하지만 두께감소는 절연체의 두께와 지수적인 관계가 있는 누설전류를 증가시킨다[1-3]. 따라서 같은 게이트 개패시턴스를 유지하면서 누설전류를 감소시키기 위해서는 높은 유전상수를 갖는 두꺼운 박막이 요구되는 것이다. 그러므로 약 25정도의 높은 유전상수를 갖고 5.2～7.8 eV 정도의 비교적 높은 bandgap을 갖으며, 실리콘과 열역학적으로 안정한 물질로 알려진 HfO2[4-5]가 최근 큰 관심을 끌고 있다. 본 연구에서는 HfO₂ 박막을 실제 소자에 적용하기 위하여 전극 및 열처리에 따른 HfO₂ 박막의 미세구조 및 전기적 특성에 관한 연구를 수행하였다. 이를 위해, HfO₂ 박막을 reactive DC magnetron sputtering 방법으로 증착하고, XRD, TEM, XPS를 사용하여 ZrO₂ 박막의 미세구조를 관찰하였으며, MOS 캐패시터 구조의 C-V 및 I-V 특성을 측정하여 HfO₂ 박막의 전기적 특성을 관찰하였다. HfO₂ 타겟을 스퍼터링하면 Ar 스퍼터링에 의해 에너지를 가진 산소가 기판에 스퍼터링되어 Si 기판과 반응하기 때문에 HfO₂ 박막 형성과 더불어 Si 기판이 산화된다[6]. 그래서 HfO₂같은 금속 산화물 타겟 대신에 순수 금속인 Hf 타겟을 사용하고 반응성 기체로 O₂를 유입시켜 타겟이나 시편위에서 high-k 산화물을 만들면 SiO/sub X/ 계면층을 제어할 수 있다. 이때 저유전율을 갖는 계면층은 증착과 열처리 과정에서 형성되고 특히 500℃ 이상에서 high-k/Si를 열처리하면 계면 SiO₂층은 증가하는 데, 이것은 산소가 HfO₂의 high-k 박막층을 뚫고 확산하여 Si 기판을 급속히 산화시키기 때문이다. 본 방법은 증착에 앞서 Si 표면을 희석된 HF를 이용해 자연 산화막과 오염원을 제거한 후 Hf 금속층과 HfO₂ 박막을 직류 스퍼터링으로 증착하였다. 우선 Hf 긍속층이 Ar 가스 만의 분위기에서 증착되고 난 후 공기중에 노출되지 않고 연속으로 Ar/O₂ 가스 혼합 분위기에서 반응 스퍼터링 방법으로 HfO₂를 형성하였다. 일반적으로 Si 기판의 표면 위에 자연적으로 생기는 비정질 자연 산화막의 두께는 10～15Å이다. 그러나 Hf을 증착한 후 단면 TEM으로 HfO₂/Si 계면을 관찰하면 자연 산화막이 Hf 환원으로 제거되기 때문에 비정질 SiO₂ 층은 관찰되지 않았다. 본 실험에서는 HfO2의 두께를 고정하고 Hf층의 두께를 변수로 한 게이트 stack의 물리적 특성을 살펴보았다. 선증착되는 Hf 금속층을 0, 10, 25Å의 두께 (TEM 기준으로 한 실제 물리적 두께) 로 증착시키고 미세구조를 관찰하였다. Fig. 1(a)에서 볼 수 있듯이 Hf 금속층의 두께가 0Å일때 13Å의 HfO₂를 반응성 스퍼터링 방법으로 증착하면 HfO₂와 Si 기판 사이에는 25Å의 계면층이 생기며, 이것은 Ar/O₂의 혼합 분위기에서의 스퍼터링으로 인한 Si-rich 산화막 또는 SiO₂ 박막일 것이다. Hf 금속층의 두께를 증가시키면 계면층의 성장은 억제되는데 25Å의 Hf 금속을 증착시키면 HfO₂ 계면층은 10Å미만으로 관찰된다. 그러므로 Hf 금속층이 충분히 얇으면 플라즈마내 산소 라디칼, 이온, 그리고 분자가 HfO₂ 층을 뚫고 Si 기판으로 확산되어 SiO₂의 계면층을 성장시키고 Hf 금속층이 두꺼우면 SiO/sub X/ 계면층을 환원시키면서 Si 기판으로의 산소의 확산은 막기 때문에 계면층의 성장은 억제된다. 따라서 HfO₂/Hf(Variable)/Si 계에서 HfO₂ 박막이 Si 기판위에 직접 증착되면, 순수 HfO₂ 박막의 두께보다 높은 CET값을 보이고 Hf 금속층의 두께를 증가시키면 CET는 급격하게 감소한다. 그러므로 HfO₂/Hf 박막의 유효 유전율은 단순 반응성 스퍼터링에 의해 형성된 HfO₂ 박막의 유전율보다 크다. Fig. 2에서 볼 수 있듯이 Hf 금속층이 너무 얇으면 계면층의 두께가 두꺼워 지고 Hf 금속층이 두꺼우면 HfO₂층의 물리적 두께가 두꺼워지므로 CET나 EOT 곡선은 U자 형태를 그린다. Fig. 3에서 Hf 10초 (THf=25Å) 에서 정전 용량이 최대가 되고 CET가 20Å 이상일 때는 high-k 두께를 제어해야 하지만 20Å 미만의 두께를 유지하려면 계면층의 두께를 제어해야 한다.