• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Tribology and Lubricants
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• 제24권6호
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• pp.315-319
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• 2008

This paper presents the interface bonding characteristics between a phosphor bronze and a steel plate for pin-bush bearings. The pin-bush bearing is an important component in which is used to reduce a friction loss and a wear against the piston pin. The pin-bush bearing is manufactured by hot-pressing a phosphor bronze and a back metal of a steel plate. This paper investigated the bonding interface characteristics in which is manufactured by melting a copper based bronze and a steel plate. The hardness from the inner surface of a bronze to the outer one of steel has been measured using a Vickers hardness tester. The experimental results show that the hardness of a bronze is superior to that of the conventional bronze and the transient hardness of pin-bush bearings is gradually increasing to the hardness of the steel back metal. This means that the bonding interface zone of pin-bush bearings may be fabricated by defusing a bronze to the steel plate due to a density difference between two materials.

• 공업화학
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• 제21권5호
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• pp.500-504
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• 2010

다중벽 탄소 나노튜브(Carbon nanotube, MWNTs)의 우수한 전기적 기계적 특성과 폴리우레탄의 우수한 기계적 물성을 이용하여 우수한 전기 전도성 복합체를 제조하기 위하여 말단기가 polyurethane로 기능화 된 탄소 나노튜브(PU-g-MWNTs)를 제조하였다. 말단기에 형성된 폴리우레탄과 고분자 메트릭스 간의 상용성으로 인한 계면 접합력으로 인해 기능화된 CNT 복합체 기능화 되지 않은 CNT에 비해 우수한 분산성을 나타내었다. PU-g-MWNT/PU 복합체의 전기 전도성을 PU-g-MWNT의 농도에 따라 측정하였으며 percolation threshold 이론에 의해 해석하였다. 그 결과 PU-g-MWNT/PU 복합체의 전기전도성은 임계농도 0.78 wt%과 임계지수 0.945를 가짐을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.385-385
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• 2011

Si 또는 반도체 화합물을 기반으로 한 태양전지의 높은 원재료 가격과 복잡한 공정 등의 문제점들을 해결하기 위한 방안으로 반도체성 고분자인 Poly(3-hexylthiophene)(P3HT)과 C60 유도체인 PCBM을 광활성 층으로 이용하여 유기 태양전지(Organic Solar Cell, OSC)를 제작하였다. 하지만 상대적으로 낮은 효율을 갖는 OSC의 단점을 해결하기 위해서 유기물 자체가 갖고 있는 광 안정성, 낮은 전하 이동도 및 광 에너지 흡수대 등의 문제점들의 해결 방안들이 제시되고 있다. 본 연구에서는 광활성 층을 사용한 유기 태양전지의 특성에서 후열처리에 따른 유기 태양전지의 전기적 및 구조적, 광학적인 특성들이 소자의 효율에 끼치는 영향에 대해 분석하였다. 후열 처리 온도에 따른 광활성 층의 구조적인 특성을 분석하기 위해 EFM 이미지와 XRD패턴을 측정하였는데 열처리 후 박막의 전기적인 포텐셜과 결정성 향상의 유기 태양전지의 효율향상에 기여함을 알 수 있었다. 또한 임피던스 분석 장치를 이용해 후열 처리에 따른 소자의 Resistance, Capacitance, I-V 곡선들을 분석한 결과 최적의 조건에서 열처리된 광활성 층은 전하들의 이동을 조절하여 소자 내에서 Capacitance를 증가시키는 것 뿐만 아니라 전극과 유기물 층 사이의 계면 특성을 향상시킴으로써, 소자의 효율을 증가시키는 원인으로 작용함을 확인 하였다.

• 한국재료학회지
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• 제17권8호
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• 대한조선학회논문집
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• 제44권6호
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• pp.627-634
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• 2007

A bonded plate or a coated part can be debonded by external impact or thermal expansion. To analyse adhesive strength, the blister test is generally adopted. In this paper, a blister test is modelled theoretically and then the stability and bifurcation of the blister are studied under several different cases. The blister is simplified to consist of a pure bending plate attached elastically to the rigid substrate. Expression of the energy release rate is obtained as a form of an explicit function for a circular-type blister or tunnel-type blister grown by controlling the internal pressure or internal volume. Stability and bifurcation are also studied in the frame of the quasi-static evolution. The study shows that the circular- type blister propagates with the first mode of bifurcation and that the tunnel-type blister propagates with a regular wave. It is proved that the waves have the same form on two side lines of the tunnel and that the wave length can be obtained. When the internal pressure is controlled, the blister is unstable, but when the internal volume is controlled, it is stable.

• 한국표면공학회지
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• 제48권6호
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• pp.275-282
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• 2015

The cost for maintenance (replacement cost) of Ni-superalloy components in plant industry is very expensive because of high unit price of INCONEL 718. A development of repairing technology using kinetic spray process can be very helpful for reducing the maintenance cost. However, it is very difficult to produce well-deposited INCONEL 718 layer showing high interfacial bond strength via kinetic spraying. Thus, INCONEL 718 was deposited on SCM 440 substrate and the interfacial properties were investigated, in order to elucidate the cause of hindrance to the bonding between INCONEL 718 layer and SCM 440 substrate. As a result, it was revealed that the dominant obstacle to the interfacial bonding was excessive compressive residual stress accumulated in the coating layer, resulting from low plastic-deformation susceptibility of INCONEL 718. Nevertheless, the bonding state was enhanced by the post heat-treatment through relieving the residual stress and generating a diffusion/metallurgical bonding between the INCONEL 718 deposit and SCM 440 substrate.

• E2M - 전기 전자와 첨단 소재
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• 제8권6호
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Journal of Welding and Joining
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• 제7권2호
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• pp.60-69
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• 1989

The present study was aimed at investigating the effect of welding parameters such as welding current, electrode force(or squeeze force) and parts cleaning on the sound weld, and establishing the most reliable weld conditions for HWP(Heavy Water Reactor) fuel end capping with the resistance upset butt welding. Major results obtained are as follows. 1. The amount of sound weld was increased with increasing weld current(5.0-11KA) because the activated diffusion with increasing heat generation played an important role in eliminating the porosity and weld line in the weld interface. 2. It was found that weld current was not significantly influenced by the electrode force although the increase of it caused a slight increase of weld current and upset deformation. 3. Acetone rinsing before drying for the Zircaloy-4 end cap cleaning produced the reliable sound weld because it would remove the remaining solvent and surface films, and provided the uniform contact between the end cap and the tube. 4. The optimum welding conditions for fuel end capping by a resistance upset hytt welding are obtained as follows. weld current: 10-11KA, electrode force: 62-90KPa parts cleaning: vapor degreasing.rarw.water, acetone rinsing.rarw.drying.

• Journal of Welding and Joining
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• 제23권6호
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• pp.61-66
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• 2005

A probabilistic approach for evaluating failure risk is suggested in this paper. Probabilistic fracture analyses were performed for a pressurized pipe of a Cr-Mo steel reflecting variation of material properties at high temperature. A crack was assumed to be located along the weld fusion line. Probability density functions of major variables were determined by statistical analyses of material creep and creep crack growth data measured by the previous experimental studies by authors. Distributions of these variables were implemented in Monte Carlo simulation of this study. As a fracture parameter for characterizing growth of a fusion line crack between two materials with different creep properties, $C_t$ normalized with $C^*$ was employed. And the elapsed time was also normalized with tT, Resultingly, failure probability as a function of operating time was evaluated fur various cases. Conventional deterministic life assessment result was turned out to be conservative compared with that of probabilistic result. Sensitivity analysis for each input variable was conducted to understand the most influencing variable to the analysis results. Internal pressure, creep crack growth coefficient and creep coefficient were more sensitive to failure probability than other variables.